Suspension device and chemical plating device with suspension device

The invention relates to a suspension device. According to the suspension device, the parts, located between a first line tying point and a second line tying point, of two isolation lines of each isolation line set are separated through a supporting body, so that when a piece to be machined is placed in a containing space, the part, located between the first line tying point and the second line tying point, of the isolation line is obliquely arranged relative to a plane where the piece to be machined is located, contact between the piece to be machined and the isolation line is reduced, and the situation that marks of the isolation line are left or the thickness of a chemical plating layer is uneven in the chemical plating process of the piece to be machined is avoided. Meanwhile, due to the fact that the part, located between the first line tying point and the second line tying point, of the isolation line is obliquely arranged, when falling into the containing space from two adjacent first rod bodies, the piece to be machined can be rapidly and conveniently guided to fall into a limiting clamping groove through guiding of the isolation line, so that the requirement for automatic mechanical alignment and plugging of boards is met. In addition, the invention also provides a chemical plating device with the suspension device.