Wafer blanking production equipment and processing method

The invention discloses production equipment, which comprises a base, an uncoiler, a leveling machine, a Y-axis swinging platform, an X-axis servo feeder and a pressure machine. The production equipment is characterized in that the uncoiler, the leveling machine and the X-axis servo feeder are all fixed on a swinging frame; the servo feeder is positioned at one end of the swinging frame close to the pressure machine; and the uncoiler and the leveling machine are fixed at the other end of the swinging frame. The S-type processing method comprises the following steps: processing a first wafer; keeping belting X-coordinate unchanged and performing wafer production once when each the increasing of the Y-coordinate is more than or equal to square root of twelve times r (r is the diameter of the wafer blanking); and performing wafer production once when each the decreasing of the Y-coordinate is more than or equal to square root of twelve times r. The M-type processing method comprises the following steps: processing the back-side wafer, increasing of the X-coordinate by deltax relative to a previous wafer, and increasing the Y-coordinate by deltay, wherein deltax is more than or equal to r, and deltay is more than or equal to square root of three times r; and processing the front-side wafer, wherein the X-coordinate is decreased while the Y-coordinate is increased. According to the equipment and the method provided by the invention, effectively and quickly processing the wafer blanking is realized, not only the raw materials are fully utilized, but also the work efficiency is also improved, the material utilization ratio can be improved by over 5-7 percent, and therefore, the equipment and the method is very suitable for medium and small batch production.