Reflow soldering auxiliary tool and reflow soldering method for flexible circuit board

A flexible circuit board and reflow soldering technology, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as poor soldering, thermal bending deformation and floating of FPC circuit boards, and achieve high operating efficiency and high qualified rate of processed products , the effect of simple structure

Inactive Publication Date: 2012-09-19
SHANGHAI FPC ELECTRONICS
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, during the production and assembly process of FPC circuit boards, during reflow soldering, longer FPC circuit boards are easily bent and deformed by

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reflow soldering auxiliary tool and reflow soldering method for flexible circuit board
  • Reflow soldering auxiliary tool and reflow soldering method for flexible circuit board
  • Reflow soldering auxiliary tool and reflow soldering method for flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0014] Such as figure 1 , figure 2 As shown, a reflow soldering auxiliary tool for a flexible circuit board includes a bead 1 and a bead placement tray 3. The bead 1 is a flat and elongated structure with the left half and the right half symmetrical to each other. The middle part of the bead 1 is provided with Circular SMT mounter suction part 2, the bead placement tray 3 is provided with a plurality of bead 1 placement slots corresponding to the shape of the bead 1, and the bead 1 is placed in the bead 1 placement grooves of the bead placement tray 3 .

[0015] A reflow soldering method for a flexible circuit board, comprising the steps of: placing a bead placement tray 3 on which a bead 1 is placed in the tray of an SMT placement machine, and writing data of the bead 1 in the program of the SMT placement machine, such as the suction position , bead 1 size, bead 1

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a reflow soldering auxiliary tool and method for a flexible circuit board. The reflow soldering auxiliary tool comprises a pressing strip and a pressing strip placing tray, wherein the pressing strip is of a flat and long structure the left half part and the right half part of which are mutually symmetrical, a round absorbing part of an SMT (surface mount technology) chip mounter is arranged at the middle part of the pressing strip, and the pressing strip is placed into the pressing strip placing tray. The method comprises the following steps of: placing the pressing strip placing tray into a tray of the SMT chip mounter, writing information of the pressing strip into a program of the SMT chip mounter, after components are mounted by adopting the SMT chip mounter, lightly sucking the pressing strip like component assembling and placing the pressing strip at the top of two adjacent components, and then sending the whole FPC (flexible printed circuit) tray into a reflow oven to be subjected to reflow soldering processing, and finally after the FPC tray is taken out from the reflow oven, taking down the pressing strip by utilizing tweezers, thus the whole soldering process is completed. The tool and method disclosed by the invention can effectively avoid poor pseudo soldering caused by temperature distortion of FR-4 during reflow soldering.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner SHANGHAI FPC ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap