40results about "Printed circuit assembling" patented technology

A packaging substrate includes an array of packaging units. Each packaging unit has a chip pad carrying a chip, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member filling up the open space, passive components each connected between two pins, a bonding adhesive applied to the pins to which the passive components is connected to affix the connection between the passive components and the respective pins, and a plurality of overflow-preventive grooves respectively provided around the bonding adhesive at each of the pins to which the passive components are connected to prevent overflow of the bonding adhesive.

This invention relates to a substrate layer structure adapted to carry electronic device, or components, or electro-mechanical, or electro-chemical sensors, or a combination thereof, and adapted to be attached to a surface of a human or animal body or biological species. The surface of the flexible substrate layer structure is a patterned structure of pre-fixed geometry-formed by one or more slits, but this geometry being selected such that the stretchability of the substrate layer structure becomes adapted to the geometry of the body surface under it.

The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; the soldering material is provided with energy supplied by an energy source, such that the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established.

The invention provides a clamping device for a plug-in unit. The device comprises a driving assembly and two clamping jaws, wherein the two clamping jaws are connected with the driving assembly, the driving assembly drives at least one of the two clamping jaws to move in the horizontal driving direction to get close to each other, the two clamping jaws are respectively provided with a vertical part and a clamping part, the vertical part is provided with a first end and a second end, the first end is connected with the driving assembly, and the clamping part is connected with the second end, the clamping parts of the two clamping jaws are arranged in parallel and are perpendicular to the horizontal driving direction. The clamping device for the plug-in unit is advantaged in that the operation space reserved for the clamping jaws by the front side face and the rear side face of a body of an electronic element can be effectively reduced.

A cooling-assisted, heat-generating electrical component reduces heat generated during operation. The electrical component, typically a resistor, has a least one heat-removing element electrically associated therewith. Heat-removing element comprises a plurality of thermal vias therein and is fixedly attached to an end portion of the electrical component, typically on opposed end portions. Heat absorbed by the heat-removing element can be transported away from the electrical component during service.

The invention discloses a printing template screen frame of a surface sticking technology; the middle width of the section of the proximate matter of the screen frame is larger than the width of the lower side; as the middle width of the section of the proximate matter of the screen frame is designed to be larger than the width of the lower side, the invention can improve the anti-bending intensity of the screen frame under the situation of being capable of preserving net yarn with a certain width needed by the tension of a steel sheet, thereby improving the quality of the printing solder paste. The invention also relates to a method for manufacturing the section of the proximate matter of the screen frame.

The invention discloses an automatic control processing device for an electronic element. The automatic control processing device comprises a base, a first sliding groove is formed in the base, linear electric cylinders are arranged on the two sides of the first sliding groove and located below the base, a first support is arranged between the linear electric cylinders, the first support is fixed to sliding blocks of the linear electric cylinders, an adjusting part is arranged on the first support, a sliding base is arranged on the adjusting part, a clamping part with a turnover function is arranged on the sliding base, and the clamping part is used for clamping an electronic element; and a first connecting piece and a second connecting piece are arranged on the base, a driving piece is arranged on one side of the first support, and the driving piece drives the first connecting piece or the second connecting piece to move and be inserted. The machining device replaces a traditional mode of manually detecting a plug connector to detect the electronic element, the production and machining efficiency of the electronic element is improved, and the labor intensity of workers is reduced.

The invention provides a flexible circuit board, a manufacturing method thereof and a display device. The flexible circuit board comprises a main board and a small board, the main board is provided with at least one first welding area for exposing a part of a first conductive layer, the small board is provided with at least one second welding area for exposing a part of a second conductive layer, the second welding area comprises a welding hole, the orthographic projection of the second welding area on the mainboard is at least partially overlapped with the first welding area, and the first conductive layer and the second conductive layer are connected through a welding structure. The welding structure comprises: a first layer of welding flux which is located on the first conductive layer part exposed by the first welding area; a second layer of welding flux which is located on the part, exposed out of the second welding area, of the second conducting layer, wherein at least part of the second layer of welding flux is welded and fixed to the first layer of welding flux through the welding hole; and a high-melting-point connecting piece, wherein one end of the high-melting-point connecting piece is located in the first layer of welding flux, the other end of the high-melting-point connecting piece is located in the second layer of welding flux in the welding hole, and the melting point of the high-melting-point connecting piece is higher than that of the first layer of welding flux and that of the second layer of welding flux. According to the flexible circuit board, the manufacturing method thereof and the display device, the welding quality and the welding yield of the circuit board can be improved.