Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device

[0049] The embodiment of the present invention will be described below with reference to the accompanying drawings.

[0050] First, the manufacturing method according to the embodiment will be described with reference to FIG. 1A and FIG. 1B to FIG. 13A and FIG. 13B.

[0051] As illustrated in FIG. 1A and FIG. 1B, a slit is formed in a tape-like insulative film (which corresponds to insulative sheet) 3 such as polyimide and PET (polyester terephthalate) using a metal blade (e.g., Thomson blade) 13 so as to penetrate through the insulative film 3.

[0052]FIG. 2A is a plan view showing the insulative film 3 with a slit 15, FIG. 2B is a cross-sectional view taken along a line B-B of FIG. 2A, and FIG. 2C is an enlarged view showing a circle shown by the broken line of FIG. 2A. As seen from FIG. 2A, the slit 15 is formed partially along the outer peripheral line (outline) of a separating region (finally necessary region), which will be separated. That is, the slit 15 is not formed over the entire