45 results about "Insulation layer" patented technology

A display device includes a first substrate, a first electrode provided on the first substrate, an insulation layer provided on the first electrode, a second electrode provided on the insulation layer, a cavity partition surrounding the second electrode with an interval therebetween, a second substrate provided on the cavity partition, and a droplet of a coloring liquid sealed in the cavity partition. In the display device, a third electrode for promoting restoration of the droplet of a coloring liquid to a spherical shape is provided. In the display device, the insulation layer includes a insulator film and a low surface energy film; the insulator film assumes a specific inductive capacity of three or more and a thickness of 10 nm to 100 nm; and the low surface energy film assumes a thickness of 100 nm or less.

The invention provides a preparation method of a top gate metal oxide thin film transistor (TFT), belonging to the technical field of semiconductors. The method comprises the following steps: preparing a source/drain electrode; then preparing a metal oxide material; coating a photoresist on the surface of the metal oxide material and carrying out chemical mechanical polishing on the photoresist layer; processing the metal oxide which is not masked by the photoresist by annealing or plasmas; and finally stripping the photoresist and depositing a gate insulation layer material through magnetronsputtering and forming a gate through wet etching. The method has the following beneficial effects: reliable ohmic contact between the metal oxide thin film and the source/drain electrode can be formed by utilizing the characteristic that the metal oxide material can be converted into a conductor from a semiconductor after undergoing special processing.

A printed circuit board in which an electronic component is embedded and a method of manufacturing the same are provided. The printed circuit board includes a first insulation layer with a first via and a cavity formed therein, the first insulation layer comprising a photosensitive material, an electronic component having at least a portion thereof positioned into the cavity, and a second insulation layer having a second via that is connected with the first via, the second insulation layer being laminated on the first insulation layer so as to embed the electronic component.

A method for manufacturing a semiconductor device having a movable portion includes the steps of: forming a trench on a semiconductor layer so that the trench reaches an insulation layer; and forming a movable portion by etching a sidewall of the trench so that the semiconductor layer is separated from the insulation layer. The steps of forming the trench and forming the movable portion are performed by a reactive ion etching method. The insulation layer disposed on the bottom of the trench is prevented from charging positively in the step of forming the trench. The insulation layer disposed on the bottom of the trench is charged positively in the step of forming the movable portion.

The invention provides a double-sided aluminum base circuit board with super-high thermal conductivity and a preparation method of the circuit board. The double-sided aluminum base circuit board comprises an aluminum base plate material, an electrical conductive hole formed on the aluminum base plate material for communicating the upper side and the lower side of the aluminum base plate material, an aluminum oxide layer formed on the upper and the lower sides of the aluminum base plate material and on the wall of the electrical conductive hole by oxidation method for insulation and heat conduction, and a DLC (diamond-like carbon) coating and a Cu coating adhered on the aluminum oxide layer. The double-sided aluminum base circuit board provided by the invention is excellent in comprehensive heat conducting property, and the surface insulation heat-conducting layer is free of high polymer materials and is excellent in flame retardant property and aging resistance. In addition, the insulation layer on the surface of the circuit board and the insulation layer on the wall surface of the electrical conductive hole are an integrated insulation heat-conducting body with the same composition and an integrated structure, thereby obviating the hole filling and the chemical copper deposition method, simplifying the process and improving the yield.

The invention relates to a vertical-type low-temperature heat-insulation gas cylinder which comprises a shell, a liner, a distributor, an in-cylinder pipeline of a pipeline control system, a neck pipe and an insulation layer; the shell comprises a shell body and a vacuumizing connector which is connected with the shell body in a sealed mode; the liner comprises a liner body and a coil pipe connector which is connected with the liner in a sealed mode and is positioned at the bottom of the liner body; the heat insulation layer is arranged on the outer wall of the liner body; the distributor is a steel integrated component which is provided with an internal channel; the liner is positioned in the inner cavity of the shell body; the distributor is fixed on the shell body in a sealed mode; the upper end of the neck pipe is fixed on the distributor in a sealed mode; the lower end of the neck pipe is arranged at the periphery of the liner body and is fixed on the liner body in a sealed mode, thus the liner body is suspended in the shell body; the in-cylinder pipeline of the pipeline control system comprises a supercharging coil pipe, a vaporization coil pipe and a seal plate assembly; and the seal plate assembly comprises an inner cavity first pipe, liquid inlet and outlet pipes, a gas discharging pipe and a seal plate. The vertical-type low-temperature heat-insulation gas cylinder provided by the invention has the advantages of good heat insulation effect, is convenient to use and is safe and reliable.

The invention relates to a method for producing a photovoltaic solar cell having a front side designed for coupling in light, comprising the following method steps: A Producing a plurality of cutouts in a semiconductor substrate of a base doping type, B Producing one or more emitter regions of an emitter doping type at least at the front side of the semiconductor substrate, wherein the emitter doping type is opposite to the base doping type, C Applying an electrically insulating insulation layer and D Producing metallic feed through structures in the cutouts, at least one metallic base contact structure at the rear side of the solar cell, which is formed in an electrically conductive manner with the semiconductor substrate in a base doping region, at least one metallic front-side contact structure at the front side of the solar cell, which is formed in an electrically conductive manner with the emitter region at the front side of the semiconductor substrate, and at least one rear-side contact structure at the rear side of the solar cell, which is formed in a manner electrically conductively connected to the feed through contact structure. The invention is characterized in that in method step B and/or a further method step in addition a feed through emitter region of the emitter doping type extending from the front side to the rear side is formed in each case in the semiconductor substrate on the walls of the cutouts, in that in method step C the insulation layer is applied in a manner covering the rear side of the semiconductor substrate, if appropriate further intervening intermediate layers, in that in method step D the rear-side contact structure is applied to the insulation layer, if appropriate to further intermediate layers, in such a way that the rear-side contact structure extends to regions of the semiconductor substrate having base doping and, in these regions, on account of the intervening insulation layer, an electrical insulation is formed between rear-side contact structure and semiconductor substrate, and the base contact structure is applied to the insulation layer, if appropriate to further intermediate layers, in such a way that the base contact structure penetrates through the insulation layer at least in regions, such that an electrically conductive connection is produced between base contact structure and semiconductor substrate. The invention furthermore relates to a photovoltaic solar cell.

In the method for manufacturing a capacitance sensor according to the present invention, after a protection layer is pattern-formed on the surface of a silicon substrate, a first metal layer is formed on the surface of a silicon substrate so as to be opposed to a protection layer non-formed area on which no protection layer is formed and to expose a part of the protection layer non-formed area. After that, a first insulation layer, a metal sacrificing layer, and a second insulation layer, and a second metal layer are formed on the first metal layer in this order. Then, the metal sacrificing layer is removed by supplying a metal etching solution on the metal sacrificing layer. Further, a part of the silicon substrate is removed by supplying a silicon etching solution to the silicon substrate from the portion, from which the metal sacrificing layer is removed, via the protection layer non-formed area exposed by the removal of the metal sacrificing layer.

The invention discloses a crack-self-healed dismounting-free insulation system and a preparation method thereof. The insulation system comprises an inner bonding fireproof layer, a heat insulation layer, an outer bonding fireproof layer, a reinforcement layer, an anti-cracking layer and a fixing member which is connected with an exterior wall, wherein rib reinforcements which are of dot-matrix arrangement are arranged between the bonding fireproof layers and the heat insulation layer. Through embedding self-healed capsules, which contain healing matrix materials, into one or more of the outer bonding fireproof layer, the inner bonding fireproof layer, the reinforcement layer and the anti-cracking layer, by virtue of the performance that the self-healed capsules automatically rupture under tension deformation and/or stress deformation and/or certain humidity and temperature change range, the healing matrix materials inside the self-healed capsules can overflow and automatically permeate to cracks or tensile damage points of the insulation system, so as to carry out healing repair. The insulation system can be applied to construction engineering construction, can be used for solving the problem of difficulty in heat insulation of the exterior wall, can replace a formwork and can automatically carry out healing repair when the insulation system encounters early-stage common problems, such as crack falling.

The invention discloses a manufacturing process of an interlayer copper connector of a printed circuit board. The manufacturing process comprises the following steps: coating a glue resin layer and sticking and pressing release paper on two sides of the outer surface of an insulation layer; forming pores and machining; removing the release paper on one side and coating a copper layer; filling holes with electric conductive colloid; removing the release paper on the other side and coating a copper layer; and pressing, fitting and curing. According to the invention, by adopting a simply and easily operated silk screen printing technology and by combining the electric conductive colloid with low liquidity, the chemical copper depositing and plating technology in the production technology of the traditional printed circuit board is replaced successfully, the conduction performance of the copper layer on performance can be achieved, zero emission and zero pollution in the environment protection aspect are achieved, the investment total amount in device input and plant input aspects is reduced, the investment hazard is reduced, and the conditions for rapid production and manufacturing cycle shortening are provided for the market demand of the printed circuit boards on the aspect of production efficiency.

To provide a planarization method which does not depend upon the size and the density of a wiring pattern and in which a reliable wiring system and a Josephson device can be formed and wiring structure, an insulation layer is planarized by forming a reversal pattern mask of wiring and selectively removing the insulation layer on the wiring.

The invention relates to a roller kiln, in particular to a combustion supporting air heating and energy storing energy-saving roller kiln. Upper combustion supporting air pipes extending along a preheating and firing zone kiln body are arranged above fireproof heat insulation materials on the two side walls of the preheating and firing zone kiln body of the roller kiln. A lower combustion supporting air box extending along the preheating and firing zone kiln body is arranged on the outer side of a fireproof heat insulation material at the bottom of the preheating and firing zone kiln body. The upper combustion supporting air pipes and the lower combustion supporting air box are communicated with an upper row of nozzle combustion supporting air pipes and a lower row of nozzle combustion supporting air pipes of a preheating and firing zone respectively. A main combustion supporting pipe is arranged on the outer portion of the preheating and firing zone kiln body. The main combustion supporting pipe is connected with a high-pressure combustion supporting draught fan and a combustion supporting air inlet. The main combustion supporting pipe is communicated with the upper combustion supporting air pipes and the lower combustion supporting air box through a plurality of branch combustion supporting pipes on the two sides. According to the combustion supporting air heating and energy storing energy-saving roller kiln, the upper combustion supporting air pipes and the lower combustion supporting air box are buried in the kiln fireproof heat insulation materials, a heat insulation layer is arranged on the outer wall, energy can be accumulated, outward dissipation of heat in the kiln body can be reduced, when the temperature of combustion supporting air is higher than that of the fireproof materials of the wall, heat can be reversely transferred into the kiln, and energy consumption of the kiln is greatly reduced.

The invention relates to an assembled composite interior wall corner, which comprises two exterior wall corner panels with an L-shaped cross section, and a thermal insulation structure layer bonded between the two exterior wall corner panels, at least one end of the thermal insulation structure layer does not exceed the exterior wall corner panel to form a tenon The standard cutting strip can be inserted into the tenon, and the standard cutting strip can be fixed to the corner of the composite interior wall through dovetail nails so as to be connected with the prefabricated composite interior wall panel; when the internal corners of the two interior corner panels are in the same direction , the width of the outer inner corner board is equal to or greater than its height; when the inner corners of the two inner corner boards are located in opposite directions, the two inner corner boards are located on one side of the composite interior wall, and the other side of the composite interior wall is Ordinary flat interior wall structural panels. Compared with the prior art, the assembling method of the present invention is simple, the structural strength is high after assembling, and the corner sealing and sound insulation effects are good.

The invention discloses a polyurethane heat insulation roof board which comprises a board body (1). A polyurethane foam board (6) is arranged on the board body (1). A transverse reinforcing unit (2) and a vertical reinforcing unit (3) are arranged on the polyurethane foaming board (6). A base layer board (5) is arranged below the polyurethane foam board (6). Corner posts (4) are arranged on the base layer board (5). A heat preservation and insulation layer (7) is arranged on the polyurethane foam board (6). A waterproof layer (8) is arranged on the heat preservation and insulation layer (7), and an antiseptic layer (9) is arranged on the waterproof layer (8).

The invention relates to the technical field of external wall insulation, in particular to a waterproof type external wall insulation structure and a production method thereof. A leveling layer, a waterproof layer, an adhesive layer, an insulation layer, a first rubber cement layer, a gridding cloth layer, a second rubber cement layer and a finish layer are adopted; the problem of water leakage or wall mildewing due to lack of effective waterproof functions or setting of insulation structures in an existing external wall insulation structure is solved by the aid of the waterproof layer and an anchoring part.

The invention discloses a wafer-level packaging method of a semiconductor device and belongs to the technical field of semiconductor packaging. The method comprises the steps that a silicon wafer is taken; arraying of an insulation layer, a conducting electrode, a silicon through hole, a re-wiring metal layer and the like is completed on the silicon wafer through a wafer-level silicon substrate adapter plate, and an inversion zone is reserved for an LED chip; the LED chip is arranged inversely to the inversion zone; a light transmission layer covering the LED chip is formed, and the surface of the light transmission layer is subjected to roughening; and the silicon wafer obtained after packaging is cut into packaging bodies of single semiconductor devices. According to the wafer-level packaging method of the packaging structure of the semiconductor device, the wafer-level silicon substrate adapter plate technology and the surface roughening technology are used for forming the packaging structure of chips with the same size, size is small, a heat resistance value is low, cost is low, and brightness is high.

Operation temperature of combustion turbine heat components, which is made of costly high-temperature alloy, reaches 1100-1400 DEG C, if having no protecting layer, the components are fast damaged by high-temperature oxidation and high-temperature corrosion. The invention relates to a novel high-temperature alloy coating with lasting oxidization resistant ability for prolonging lifetime of the components in operation environment of high-temperature oxidation and high-temperature corrosion and avoiding cracking problem. The other use of the high-temperature alloy is preventing ceramic heat insulation layer coated on surface of the combustion turbine heat components from desquamating with the alloy used as high-temperature oxidation and corrosion resistant bottom layer of the ceramic heat insulation layer.

A method for fabricating a semiconductor device comprises forming a gate insulation layer on a substrate including a first region and a second region, forming a first gate conductive layer and a capping layer on the first region and the second region and heat-treating the substrate, removing the capping layer from the first region and the second region, forming a second gate conductive layer on the first region and the second region, nitriding the second gate conductive layer, and forming a third gate conductive layer on the second region.

The invention relates to a display device, including a substrate, a first metal layer, a first insulation layer, a second metal layer, a second insulation layer, a first electrode layer, a third insulation layer and a second electrode layer. The substrate has a display area and a peripheral area which is positioned on the periphery of the display area. The first metal layer is arranged on the substrate. The first insulation layer is arranged on the first metal layer and has a first contact hole, and the first contact hole is positioned in the peripheral area. The second metal layer is arranged on the first insulation layer and in the first contact hole and is electrically connected with the first metal layer. The second insulation layer is arranged on the second metal layer. The first electrode layer is arranged on the second insulation layer and has a first opening positioned in the peripheral area. The third insulation layer is arranged on the first electrode layer and has a second opening positioned in the peripheral area. The second electrode layer is arranged on the third insulation layer and in the second opening, and is electrically connected with the first electrode layer. The first contact hole is corresponding to the first opening.

The invention discloses a composite wall and a splicing structure of a house composed of composite walls. The wall and the house are included. The composite wall comprises wallboards and heat insulation layers; the wallboards comprise the outer wallboards and the inner wallboards which are all provided with vertical profile steel; and heat insulation blocks are installed between the inner wallboards and the outer wallboards. The house is provided with a pulling-resistant and supporting structure. The house structurally comprises the composite walls, roof boards and a roof ridge pole and is formed by splicing the vertical profile steel, wherein each composite wall comprises a first composite wall body and a second composite wall body; and the vertical profile steel is installed between the inner wallboards and the outer wallboards arranged on the first composite wall bodies and the second composite wall bodies. According to the composite wall and the splicing structure of the house composed of the composite walls, the heat insulation, anti-seismic and light house is built, the cost is reduced, the construction period is shortened, and construction is convenient.

The invention discloses a process method for insulation attaching type bonding of a large-scale motor rotor magnetic pole body. The method is an innovation of a large-scale motor rotor magnetic pole body insulation bonding method, and the bonding area is effectively increased through the ultra-flat treatment of the edge gaps between the magnetic pole punching sheets and the core-penetrating screwwelding holes. During wrapping, the insulation paper is wound at an included angle of more than 30 degrees with the surface of the pole body, and a smoothing scraper and a magnetic cake support are combined to form smoothing extrusion propulsion, so that bubbles generated in the insulation layer are effectively reduced. According to the invention, mold shaping treatment is adopted, so that pole body insulation bonding is tighter. The pole body is insulated, heated and cured, so that the coating glue is accelerated to be cured, the mold is removed as soon as possible, and the mold use efficiency is improved. And the angle insulation adopts a glue brushing treatment mode, so that the construction is time-saving and labor-saving. And the integrity of pole body insulation bonding is improved,and the quality stability of the pole body is ensured. The method is a novel technical scheme which is high in practicability, simple and convenient to operate, cost-reducing, efficiency-increasing and easy to popularize.

The invention provides a semi-conductive waterproof cable which comprises a conductor, a first semi-conductive layer, an insulation layer, a second semi-conductive layer, a buffering expansion layer, a metal shielding layer and an outer protective layer from inside to outside in sequence. The second semi-conductive layer is of a dense structure, the buffering expansion layer is made of polymeric materials mixed with water soluble expansion matters, the expansion degree of the buffering expansion layer is 10-300%, and the thickness of the buffering expansion layer is 0.2-4mm. The semi-conductive waterproof cable has good waterproof performance.

The invention discloses a reinforced control cable which comprises a cable core and an outer sheath. The cross section of the outer sheath is formed by combining the circular large end and the circular small end into a whole. The cable core formed by twisting and combining two insulated wire cores is wrapped with the large end of the outer sheath. A filling layer is arranged at a gap of the cable core. A shielding layer wraps the cable core in a winding mode. A reinforcing steel wire is arranged in the small end of the outer sheath and is parallel to the cable core. Each insulated wire core is composed of a conductor and an insulation layer; each conductor is formed by a plurality of anaerobic copper wires in a compound twisting mode, and one insulation layer wraps one conductor in an extrusion mode and is made of irradiation crosslinking or silane crosslinked polyethylene insulating materials. The reinforced control cable is reasonable and simple in structure, easy to produce and manufacture, low in cost and free of pollution, has high flexibility, restorability and tensile resistance, is compact and round in structure, safe to use and capable of completely meeting the performance requirement of complex required environment of current network topology and meeting the current informatization development demands, and has good environmental benefits and economic benefits.