90 results about "Printed circuit board" patented technology

In the case where high speed differential signals are transmitted in differential transmission lines through via holes with open-stubs, signal waveforms are distorted due to impedance mismatch in the open-stubs of the via holes, thus causing jitter, which has become an issue of high speed signals. For differential transmission lines that pass through via holes with open-stubs, a degree of coupling of the lines is decreased while the differential characteristic impedance is made constant. Thereby, the effects of backward cross talk noise caused by the coupling can be minimized, and thus jitter can be suppressed.

A semiconductor package has a printed circuit board, an integrated circuit chip on the printed circuit board with an exposed semiconductor die, and a rigid structure secured to the printed circuit board and enclosing the exposed semiconductor die. The exposed surface of the semiconductor die placed is in thermal contact with an inner surface of the rigid structure with a compressible material.

A display device includes a display panel including a pixel array including data lines, gate lines crossing the data lines, and pixels arranged in a matrix form, a source driver integrated circuit (IC) for supplying a data voltage to the data lines, a gate driver IC for supplying a gate pulse to the gate lines, and a first flexible film cable bonded to a substrate of the display panel. The first flexible film cable includes lines for transmitting gate timing control signals and gate driving powers received from a printed circuit board to the gate driver IC. The first flexible film cable has a thickness of about 20 μm to 100 μm.

A printed circuit board in which an electronic component is embedded and a method of manufacturing the same are provided. The printed circuit board includes a first insulation layer with a first via and a cavity formed therein, the first insulation layer comprising a photosensitive material, an electronic component having at least a portion thereof positioned into the cavity, and a second insulation layer having a second via that is connected with the first via, the second insulation layer being laminated on the first insulation layer so as to embed the electronic component.

The invention relates to an alignment method and system of an FOG technology. The alignment method of the FOG technology includes the steps that a glass panel provided with a first alignment mark is provided, and the surface of the first alignment mark is coated with a fluorescent material; the first alignment mark is irradiated by a light source with the wavelength corresponding to the fluorescent material, and the light source can make the fluorescent material excited to emit light; a flexible printed circuit board provided with a second alignment mark is placed above the glass panel; according to the relative positions of the first alignment mark and the second alignment mark, the position of the flexible printed circuit board is adjusted, and the second alignment mark is aligned with the first alignment mark. By means of the alignment method and system of the FOG technology, the first alignment mark is coated with the fluorescent material, the fluorescent material is irradiated by the light source to emit light, and therefore the first alignment mark can be displayed more clearly, alignment can be normally performed, and alignment precision is improved.

A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. Each test access point structure is conductively connected to a trace at a test access point and above an exposed surface of the printed circuit board to be accessible for probing by a fixture probe. The test access point structure may be designed and manufactured to permit deformation of the test access point structure upon initial probing of the test access point structure with a fixture probe to ensure electrical contact between the fixture probe and the test access point structure.

Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers.

The invention discloses a multi-wavelength femtosecond laser scanning type etching method for a printed circuit board. According to the multi-wavelength femtosecond laser scanning type etching method for the printed circuit board, a femtosecond laser device provided with a frequency doubling module is used as a laser source, and the femtosecond laser device can emit laser beams with different wavelengths so as to etch different layers, made of different materials, on the printed circuit board correspondingly; etching of all the layers of the printed circuit board can be completed on the same station, and machining errors caused by repeated positioning are avoided; meanwhile, more refined line-width etching can also be achieved, so that the printed circuit board is made smaller, lighter and thinner; machining is convenient, and the machining precision and quality are excellent.

An electronic device for widening an active area of a display is provided. The electronic device includes a housing including a first plate and a second plate facing away from the first plate, a touch screen display including a first glass plate, a second glass plate, and an organic light-emitting diode (OLED) layer interposed between the first plate and the second plate, a flexible layer including a first portion connected to the first surface of the second glass plate and bent around an edge of the second glass plate toward the second plate of the housing, and a second portion extending from the first portion and interposed between the second glass plate and the second plate of the housing, a display driver integrated circuit (DDIC) mounted on a first surface of the second portion of the flexible layer, and a printed circuit board (PCB) including a portion mounted on a second surface of the second portion of the flexible layer.

The invention discloses an induction coil assembly, which comprises a printed circuit board and a first planar winding group, and is characterized in that the printed circuit board is provided with a plurality of circuit layers, and a first block is defined on the printed circuit board; the first planar winding group is arranged on the printed circuit board and comprises a first planar inductor assembly and a second planar inductor assembly; the first planar inductor assembly is distributed in combination of the plurality of circuit layers, and the first planar inductor assembly is arranged around the first block; and the second planar inductor assembly is distributed in combination of the plurality of circuit layers, and the second planar inductor assembly is arranged around the first block. Through the induction coil assembly disclosed by the invention, a plurality of induction coils can be effectively arranged on a single circuit board, and arrangement of a planar coil structure used for filtering, voltage conversion or other electric power conversion on the single circuit board is realized.

For testing an RF device, such as an RF receiver/decoder chip that receives an RF signal via an antenna terminal and outputs a digital code at an output terminal, an inexpensive non-RF programmable tester is used. The programmable tester is a commercially available tester that need only generate and receive non-RF digital and analog signals. The RF signals needed for the testing of the RF device are totally supplied by RF generators on a single printed circuit board, external to the commercial tester housing. The board contains controllable RF generating circuitry whose possible output amplitudes and frequencies need be only those necessary for testing the particular DUT. The frequencies may be changed by switching in different crystal resonators mounted on the board.

The invention discloses a manufacturing process of an interlayer copper connector of a printed circuit board. The manufacturing process comprises the following steps: coating a glue resin layer and sticking and pressing release paper on two sides of the outer surface of an insulation layer; forming pores and machining; removing the release paper on one side and coating a copper layer; filling holes with electric conductive colloid; removing the release paper on the other side and coating a copper layer; and pressing, fitting and curing. According to the invention, by adopting a simply and easily operated silk screen printing technology and by combining the electric conductive colloid with low liquidity, the chemical copper depositing and plating technology in the production technology of the traditional printed circuit board is replaced successfully, the conduction performance of the copper layer on performance can be achieved, zero emission and zero pollution in the environment protection aspect are achieved, the investment total amount in device input and plant input aspects is reduced, the investment hazard is reduced, and the conditions for rapid production and manufacturing cycle shortening are provided for the market demand of the printed circuit boards on the aspect of production efficiency.

A foldable electronic device is provided. The foldable electronic device includes a hinge structure, a foldable housing, a flexible display disposed inside the foldable housing, a first flexible connection member, a second flexible connection member, an adhesive member attached to the first flexible connection member. The foldable housing includes a first housing structure and a second housing structure. The first housing structure includes a first surface, a second surface, and a first printed circuit board. The second housing structure includes a third surface, a fourth surface, and a second printed circuit board.

The invention relates to a circuit board applied to a motor, in particular to the slot-type circuit board applied to the motor and an assembly process of the slot-type circuit board. The slot-type circuit board applied to the motor comprises a motor outer shell, a front end cover, a rear end cover, a rotor assembly, a circuit board socket assembly and a circuit board plug-in assembly. The circuit board socket assembly is fixed with the rear end cover in a plug-in mode. The circuit socket assembly comprises an electronic component, a carbon brush assembly, torsion springs and a circuit board body. The electronic component is welded on the circuit board body. The carbon brush assembly is fixed on the circuit board body in a buckled mode. Cylinders are arranged on the circuit board body. The torsion springs are sleeved on the cylinders. One end of each torsion spring is connected with the rear end cover in a plug-in mode. The other end of each torsion spring is connected with the carbon brush assembly in a plug-in mode, so that electric connection is formed between the circuit board socket assembly and the rear end cover. Insertion holes are formed in the circuit board socket assembly. Plug pins are arranged on the circuit board plug-in assembly. The plug pins are arranged inside the insertion holes in a plug-in mode to form electric connection. According to the slot-type circuit board applied to the motor and the assembly process, occupied space is reduced, wiring and existing problems of the wiring are avoided, material consumption is saved, cost is reduced, and the anti-interference function of an electrical appliance is also improved.

The invention discloses a PCB (Printed Circuit Board) connection sheet dividing machine provided with a jig returning lifting platform. The PCB connection sheet dividing machine comprises a material feeding workstation, a transit workstation, a board dividing workstation and a material discharging workstation. The material feeding workstation is used for supplying materials; the transit workstation conveys the materials to the board dividing workstation; the board dividing workstation divides a PCB connection sheet by utilizing a milling cutter. The transit workstation is provided with a movable cover plate; the cover plate covers the PCB connection sheet, so that the PCB connection sheet is prevented from warping during a dividing process. The material discharging workstation comprises an output rail which is arranged on a transverse telescopic cylinder group and jigs arranged on the output rail; a returning rail is arranged below the output rail; a lifting rack provided with a clamping jaw cylinder is arranged on one side of the returning rail; and the conveying direction of the returning rail and the conveying direction of the output rail are opposite. Unloaded jigs are lifted by the lifting rack after passing by the returning rail, and the transverse telescopic cylinder group moves the output rail to make room for lifting of the jigs. Therefore, the unloaded jigs can be supplied to the output rail from the returning rail continuously, so that divided PCBs can be placed on the unloaded jigs.

An electrical center includes a housing and a relay module that is disposed in a well of the housing. The relay module has a lower base, a printed circuit board assembly, plug in electronic components and a cover. The lower base includes a tray having a depending shroud at one end portion and a pair of laterally spaced couplers that are integrally attached to an end wall of the tray. The end portion of the tray that has the depending shroud has a plurality of apertures that extend through the end portion of the tray for receiving terminal portions that extend through the apertures. An opposite end portion of the tray has an upper pedestal that is part of a connector body that extends through the tray to a lower socket. The printed circuit board assembly has a printed circuit board that is attached to the top of the tray near a side edge, a plurality of relays that are attached to an upper portion of the printed circuit board. The relays are electrically connected to a plurality of terminals that are disposed beneath the relays. These terminals have portions that plug into the apertures and terminate in free ends disposed inside the shroud. The relay module also includes plug in electronic components that are plugged into the end portion of tray so that their metal terminal tabs extend through the apertures and into the space inside the shroud. The relay module also includes a main relay that is mounted on the pedestal for electrical connection to a wiring harness that plugs into the lower socket of the connector body. The relay module is retained in the well of the housing by an internal lock bar that engages the couplers at one end and an internal lock nib that engages a flexible lock arm of the relay module the other end.

Disclosed herein is a laminate for a flexible printed circuit board, which includes a base film, and a tie layer formed of a copper alloy containing a small amount of Zn—V or Zn—Ta disposed on the base film. As such, the tie layer formed of a copper alloy containing Zn—V has a component ratio of Zn in the copper alloy larger than that of V, and preferably, includes more than 2.5% Zn but not more than 5%, and less than 2.5% V. In addition, the tie layer formed of a copper alloy containing Zn—Ta has a component ratio of Zn in the copper alloy larger than that of Ta, and preferably, includes more than 2.5% Zn but not more than 5%, and less than 2.5% Ta.

A printed circuit board structure includes a signal reference layer exposed at the surface of the printed circuit board.

An electrical connector assembly for use with an input/output card comprises a cartridge defining a receiving space by a pair of side walls. The cartridge defines a front entrance for receiving a complementary connector and a rear portion for receiving a printed circuit board. A connector is assembled in the receiving space for mating with the complementary connector and includes a base plate having a mounting block formed thereon. The block defines a plurality of terminal passageways therein and a plurality of terminals is assembled in the terminal passageways for bridging the complementary connector and the printed circuit board. Latches formed between the cartridge and the connector near the front entrance releasably position the complementary connector therein. Hooks formed between the cartridge and the connector fixedly assemble connector to the cartridge. Mounting slots defined between the cartridge and the input/output card moveably and releasably assemble the cartridge to the input/output card.

An electronic device is disclosed, including: a first support member including at least one screw-fastening portion; a first printed circuit board (PCB) stacked on the first support member and including at least one screw-fixing portion facing the at least one screw-fastening portion; a second PCB spaced apart from the first PCB, including a first screw guide groove; an interposer disposed between the first PCB and the second PCB electrically connecting them and including a second screw guide groove facing the first screw guide groove; and a second support member stacked on the second PCB and including a screw inlet portion facing the first screw guide groove. The second support member, the first PCB, and the first support member are fixed to each other via a screw inserted through the screw inlet portion.

The invention belongs to the technical field of conductive inks and particularly relates to a carbon fiber/gaseous carbon tube/carbon black compound conductive ink and a preparation method thereof. The carbon fiber/gaseous carbon tube/carbon black compound conductive ink is composed of, by weight part, 0.1-10 parts of carbon fiber/gaseous carbon tube compound powder, 0.1-20 parts of carbon black,0.1-70 parts of resin adhesives, 0.1-5 parts of dispersant, 0.1-5 parts of flatting agent, 0.1-5 parts of anti-settling agent and 0.1-5 parts of water-repellent agent. The carbon fiber/gaseous carbontube/carbon black compound conductive ink has the advantages of being high in adhesion force, electric conductivity, water resistance, alcohol resistance and the like and achieves uniform conductive uniformity and application attenuation resistance; meanwhile, the carbon fiber/gaseous carbon tube/carbon black compound conductive ink can be applied widely as heating carbon paste, conductive carbonpaste and electromagnetic shielding carbon paste to heating floors, PCB (printed circuit board) carbon oil, electromagnetic shielding coatings and the like.