Laminate for flexible printed circuit board comprising tie layer of ternary copper alloy

a flexible printed circuit board and ternary copper alloy technology, which is applied in the direction of improving the adhesion of metals to the substrate, transportation and packaging, and processes, etc., can solve the problems of affecting the performance of the substrate, affecting the adhesion of the substrate, and affecting the dimensional stability of the substrate, etc., to achieve excellent adhesive strength, high performance, and chemical resistance. high

Inactive Publication Date: 2006-02-09
TORAY SAEHAN
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Benefits of technology

The technical effect of this patented invention relates to improving the bond between two materials used in making electronic devices such as printed circuits (F PCs). This improvement makes it easier to create smaller components with better electrical properties.

Problems solved by technology

The technical problem addressed in this patent text relates to improving the adhesion and durability of a two-layered substrate for an FPCB during manufacturing processes involving multiple steps, particularly when making finer circuits. Current methods involve applying a thermoset resin onto a copper foil beforehand, but these methods result in poor adhesiveness and reduced reliability of the final product. Therefore, there is a need for improved methods for producing a two-layered substrate for an FPCB that can maintain sufficient adhesive strength, chemical resistance, and heat resistance even at very high temperatures needed for high density circuit patterns.

Method used

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  • Laminate for flexible printed circuit board comprising tie layer of ternary copper alloy
  • Laminate for flexible printed circuit board comprising tie layer of ternary copper alloy
  • Laminate for flexible printed circuit board comprising tie layer of ternary copper alloy

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Embodiment Construction

[0026] Hereinafter, a detailed description will be given of the present invention, with reference to the appended drawings.

[0027]FIG. 1 is a sectional view showing a laminate for an FPCB having a tie layer formed on a polyimide film, according to the present invention. In the present invention, the tie layer is formed of a ternary copper alloy containing Zn—V or Zn—Ta. Below, a ternary copper alloy containing Zn—V is referred to as ‘CAT1’, and a ternary copper alloy containing Zn—Ta is referred to as ‘CAT2’. In FIG. 1, a CAT layer means a layer including any one of ‘CAT1’ and ‘CAT2’.

[0028] Referring to FIG. 2, a method of manufacturing the laminate for an FPCB shown in FIG. 1 is described. FIG. 2 is a schematic view showing an apparatus for manufacturing a laminate for an FPCB, according to the present invention.

[0029] The apparatus for manufacturing a laminate for an FPCB comprises a transferring system including an unwinding roller 2, a main drum 3, and a winding roller 4, all of

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Abstract

Disclosed herein is a laminate for a flexible printed circuit board, which includes a base film, and a tie layer formed of a copper alloy containing a small amount of Zn—V or Zn—Ta disposed on the base film. As such, the tie layer formed of a copper alloy containing Zn—V has a component ratio of Zn in the copper alloy larger than that of V, and preferably, includes more than 2.5% Zn but not more than 5%, and less than 2.5% V. In addition, the tie layer formed of a copper alloy containing Zn—Ta has a component ratio of Zn in the copper alloy larger than that of Ta, and preferably, includes more than 2.5% Zn but not more than 5%, and less than 2.5% Ta.

Description

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Claims

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Application Information

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Owner TORAY SAEHAN
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