Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

80results about "Metal layered products" patented technology

Microcapsule composition

InactiveUS20050164116A1Lower resistanceGood workmanshipPhotosensitive materialsRadiation applicationsPolymer sciencePolystyrene
This invention relates to a composition comprising microcapsules suspended in an aqueous media, said microcapsules comprising a water immiscible material contained within an encapsulating wall of polymeric material, wherein the aqueous media contains a stabilizer comprising an anionic polymer mixture comprising a first sulfonated polystyrene polymer and a second sulfonated polystyrene polymer wherein the ratio of the weight average polymer molecular weight of the first polymer to the second polymer is greater than 2. It further relates to an imaging element comprising said microcapsules.
Owner:EASTMAN KODAK CO

Method for metallizing ceramic surface and method for connecting ceramic with aluminum

ActiveUS20120121896A1Hot-dipping/immersion processesSoldering apparatusMicrometerAlloy thin film
A process for metalizing a ceramic surface or attaching a ceramic to a metal is provided. The process may comprise: immersing the ceramic into an aluminum or aluminum alloy melt, making the ceramic move or stay still relative to the melt to adhere the melt to the ceramic; and then removing the ceramic from the melt to unaffectedly cool the film adhered thereto. The process can attach an aluminum or aluminum alloy thin film having a thickness of several to tens of micrometers on a ceramic surface. The thin film is formed by solidification, and does not have microscopic faults such as oxide film inclusions or pores, therefore having proper physical of mechanical properties of aluminum. Ceramics or a ceramic and a metal can be brazed via the surface metalizing film, the bonding strength of their interface can over the strength of aluminum itself.This invention discloses a process for metalizing the surface of a ceramic and a process for attaching a ceramic to a metal. A process for attaching an aluminum or aluminum alloy thin film to a ceramic surface comprises the steps of: immersing a ceramic surface to be metalized into a aluminum or aluminum alloy melt, and making the ceramic move or stay still relative to the melt to adhere the melt of the aluminum or aluminum alloy to the metalizing surface of the ceramic; and then removing the metalizing surface of the ceramic from the melt to unaffectedly cool the aluminum or aluminum alloy liquid film adhered thereto to obtain a ceramic having the aluminum or aluminum alloy thin film attached to the surface. The process to attaching aluminum or aluminum alloy thin film on the surface of a ceramic of the present invention can attach an aluminum or aluminum alloy thin film having a thickness of several micrometers to tens of micrometers on the surface of a ceramic. The thin film is formed by the solidification of the aluminum of aluminum alloy liquid film attached on the surface of a ceramic, and it does not have the microscopic faults such as oxide film inclusions or pores, therefore having the proper physical of mechanical properties of aluminum. Ceramics or a ceramic and a metal can be brazed via the surface metalizing film, the bonding strength of their interface can over the strength of aluminum itself.
Owner:TSINGHUA UNIV

High surface area and low structure carbon blacks for energy storage applications

ActiveUS20120214000A1Increase capacitanceEfficient separationPigmenting treatmentCapacitor and primary/secondary cellsApparent densityElectrochemical double layer capacitor
The present invention, in part, relates to a carbon black having a) a nitrogen BET surface area (BET) of from about 600 m2 / g to about 2100 m2 / g, b) a CDBP value in mL / 100 g of from about (−2.8+(b*BET)) to about (108+(b*BET)), where b is 0.087 and BET is expressed in m2 / g, and c) an apparent density (p, g / cm3) of at least about 0.820+q*BET, where q=−2.5×10−4, as determined at a compressive force (P) of 200 kgf / cm2 on dry carbon black powder. Energy storage devices, such as electrochemical double layer capacitors (EDLC's), containing the carbon black are also disclosed. Methods for making the carbon blacks and EDLC's made with them are also provided.
Owner:CABOT CORP

Systems and methods for enhancing mobility of atomic or molecular species on a substrate at reduced bulk temperature using acoustic waves, and structures formed using same

ActiveUS20140199550A1Improve mobilityReduce the temperatureRadiation applicationsVacuum evaporation coatingChemical physicsAcoustic wave
Under one aspect of the present invention, a method for enhancing mobility of an atomic or molecular species on a substrate may include exposing a first region of a substrate to an atomic or molecular species that forms a molecular bond with the substrate in the first region; directing a laser pulse to a second region of the substrate so as to generate an acoustic wave in the second region, the acoustic wave having spatial and temporal characteristics selected to alter the molecular bond; and transmitting the acoustic wave from the second region to the first region, the acoustic wave altering the molecular bond between the substrate and the atomic or molecular species to enhance mobility of the atomic or molecular species on the substrate in the first region.
Owner:THE AEROSPACE CORPORATION

Halogen-free flame-retardant copper-plastic composite belt and preparation thereof

InactiveCN103165237AHas an ultra-thin structureReduce manufacturing costConductive layers on insulating-supportsLaminationPolyesterEngineering
The invention relates to the field of cable belts, in particular to a copper-plastic composite belt suitable for a communication cable and an optical cable and preparation thereof. The copper-plastic composite belt is coated on the outer surface of the communication cable or the optical cable and sequentially comprises a red copper layer (1), an adhesive layer (2) and a polyester film layer (3), wherein the red copper layer (1), the adhesive layer (2) and the polyester film layer (3) are bonded and heated to form a composite structure. The tensile strength of the copper-plastic composite belt is larger than or equal to 180MPa, the elongation at break of the copper-plastic composite belt is larger than or equal to 15%, the interlayer peeling strength between a copper belt and a plastic layer is larger than or equal to 15N / cm, the conductivity of the copper-plastic composite belt is larger than or equal to 90% IACS, and no punchthrough happens on the single side of the copper-plastic composite belt 1 kvd.c,1min.
Owner:JIUXING HLDG GRP

Epoxy resin composition and prepreg and printed circuit board made therefrom

ActiveCN102260402AImprove heat resistanceGood chemical resistanceCircuit susbtrate materialsMetal layered productsEpoxyManganese oxide
The invention relates to an epoxy resin composition which comprises (a) epoxy resin; (b) a hardening agent; and (c) manganese oxide used as inorganic filler.
Owner:TAIWAN POWDER TECH CO LTD

Sound attenuated enclosure

The invention relates to a sound attenuated enclosure. The sound attenuated enclosure comprises a first shell; a second shell, which is located in the first shell, wherein the space between the second shell and the first shell is filled with a sound insulation material structure; and a detection chamber, which is arranged in the second shell, wherein the space between the detection chamber and the second shell is filled with a super-structure sound absorption material structure and a porous sound absorption material structure. The sound wave incident surface of the super-structure sound absorption material structure faces the detection chamber, and in a preset frequency band, the combined acoustic impedance formed by superposing the acoustic impedance of the super-structure sound absorption material structure and the acoustic impedance of the porous sound absorption material structure is matched with the acoustic impedance of air. According to the sound attenuated enclosure, the full-band sound absorption effect of the sound attenuated enclosure can be effectively improved, and the full-band sound insulation effect of the sound attenuated enclosure is further enhanced.
Owner:NANJING INST OF PHOTOACOUSTIC METAMATERIALS CO LTD +1
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products