59 results about "Ceramic" patented technology

A process for metalizing a ceramic surface or attaching a ceramic to a metal is provided. The process may comprise: immersing the ceramic into an aluminum or aluminum alloy melt, making the ceramic move or stay still relative to the melt to adhere the melt to the ceramic; and then removing the ceramic from the melt to unaffectedly cool the film adhered thereto. The process can attach an aluminum or aluminum alloy thin film having a thickness of several to tens of micrometers on a ceramic surface. The thin film is formed by solidification, and does not have microscopic faults such as oxide film inclusions or pores, therefore having proper physical of mechanical properties of aluminum. Ceramics or a ceramic and a metal can be brazed via the surface metalizing film, the bonding strength of their interface can over the strength of aluminum itself.This invention discloses a process for metalizing the surface of a ceramic and a process for attaching a ceramic to a metal. A process for attaching an aluminum or aluminum alloy thin film to a ceramic surface comprises the steps of: immersing a ceramic surface to be metalized into a aluminum or aluminum alloy melt, and making the ceramic move or stay still relative to the melt to adhere the melt of the aluminum or aluminum alloy to the metalizing surface of the ceramic; and then removing the metalizing surface of the ceramic from the melt to unaffectedly cool the aluminum or aluminum alloy liquid film adhered thereto to obtain a ceramic having the aluminum or aluminum alloy thin film attached to the surface. The process to attaching aluminum or aluminum alloy thin film on the surface of a ceramic of the present invention can attach an aluminum or aluminum alloy thin film having a thickness of several micrometers to tens of micrometers on the surface of a ceramic. The thin film is formed by the solidification of the aluminum of aluminum alloy liquid film attached on the surface of a ceramic, and it does not have the microscopic faults such as oxide film inclusions or pores, therefore having the proper physical of mechanical properties of aluminum. Ceramics or a ceramic and a metal can be brazed via the surface metalizing film, the bonding strength of their interface can over the strength of aluminum itself.

Provided is a method of fabricating, with satisfactory adhesion, a thin film of a metal or a metallic-compound, such as a metal oxide or nitride, on a substrate made of a high-melting-point material such as silicon or ceramics by using a metal or metallic-compound target as the primary raw material so as to eliminate the necessity of using harmful gases such as organometallic gas, and by using an atmospheric-pressure plasma generated under atmospheric pressure as a reaction field and also as a heat source. Additionally provided is an apparatus for fabricating the thin film. The thin-film fabrication method by microplasma processing includes the steps of disposing a raw material for thin-film fabrication in one or more tubes (A) having a uniform inner diameter throughout, introducing an inert gas and applying a high-frequency voltage to the narrow tubes (A) to generate high-frequency plasma in the narrow tubes (A), heating / evaporating the raw material while maintaining the flow rate of the plasma gas in the narrow tubes (A) and maintaining the plasma gas temperature high, ejecting the evaporated material from the narrow tubes (A) to spray it onto the substrate, heating the substrate with the plasma, and depositing the sprayed material on the substrate under atmospheric pressure.

The invention discloses a full-automatic material distribution device and production process used for producing micro powder polished tiles. The full-automatic material distribution device comprises a main conveying belt for conveying micro powder, a line micro powder distribution mechanism, a material distribution mechanism, a material supplement mechanism, a grid feeding mechanism and an extrusion machine are sequentially arranged above the main conveying belt in the conveying direction, the line micro powder distribution mechanism, the material distribution mechanism and the material supplement mechanism sequentially distribute different types of powdery materials on the main conveying belt and then overlap the powdery materials step by step, and the grid feeding mechanism cuts the mixed powdery materials on the main conveying belt according to the specification of polished tiles and then feeds the materials into the extrusion machine for extrusion formation. The full-automatic material distribution device is ingenious and practical in structure. Ceramic micro power polished tiles produced through the full-automatic material distribution device are fine in texture, natural and vivid, the patterns of finished tiles are natural in transition, novel and irregular, and the decoration effect of ceramic micro powder polished tiles is greatly improved.

The present invention provides a window glass with conductive ceramic fired body which is capable of not only ensuring a good conductivity of the fired body but also exhibiting an improved appearance on both an interior side and an exterior side of a vehicle when the window glass is used for vehicles. The window glass with conductive ceramic fired body according to the present invention includes at least one glass plate having main surfaces, and the conductive ceramic fired body including a feeding point and a linear portion which is disposed on either one of the main surfaces of the glass plate, at least a part of the linear portion being placed in a visible region of the window glass and formed by successively laminating a first colored layer, a conductor layer and a second colored layer on the main surface, wherein the first colored layer and the second colored layer each include a pigment and a glass component, and the conductor layer includes silver and the glass component.

The invention discloses a method for producing silicon carbide (SiC) ceramics by polysilicon wire-electrode cutting scraps and belongs to the field of production of functional materials, aiming to solve the problem that scraps are always discarded directly at present. The method includes adding SiC powder to a raw material, namely the polysilicon wire-electrode cutting scraps, and then sintering the mixture to obtain the SiC ceramics. As the polysilicon wire-electrode cutting scraps are taken as the raw material for producing the SiC ceramics, production process is simplified and production cost is lowered.

The invention provides an ultrahigh-frequency surface-mounted ceramic vertical interconnection structure and a packaging structure, belonging to the technical field of chip packaging microwave signal interconnection. The ultrahigh-frequency surface-mounted ceramic vertical interconnection structure comprises a ceramic medium, a front pin bonding pad, a back pin bonding pad and a similar coaxial structure, wherein the front pin bonding pad is arranged on the front surface of the ceramic medium, and a GND region is arranged around the front pin bonding pad; the back pin bonding pad is arranged on the back surface of the ceramic medium, and another GND region is arranged around the back pin bonding pad; the similar coaxial structure comprises a radio frequency signal vertical transition hole and a grounding vertical transition hole which are arranged in parallel; and the radio frequency signal vertical transition hole is arranged to be perpendicular to the ceramic front pin bonding pad. The packaging structure comprises the ultrahigh-frequency surface-mounted ceramic vertical interconnection structure. The ultrahigh-frequency surface-mounted ceramic vertical interconnection structure of the invention has the advantages that the vertical transmission performance of radio frequency can be improved, and the transmission of DC-40GHz broadband high-frequency signals can be realized between ceramics; and the structure is a vertical interconnection structure, good vertical transmission of radio frequency signals can be realized within 40 GHz, and return loss S11 and S22 are superior to -10 dB.