87results about "Non-macromolecular adhesive additives" patented technology

A high-performance acidic transparent silicone sealant belongs to the technical field of the adhesive. The sealant comprises the following components in parts by weight: 90-130 parts of hydroxyl-terminated polydimethylsiloxane, 10-60 parts of alkyl-terminated polydimethylsiloxane, 5-15 parts of crosslinking agent, 20-90 parts of silicon dioxide, 0.01-0.9 part of anti-yellowing agent and 0.005-0.15 part of catalyst, wherein crosslinking agent is the mixture of methyltriacetoxysilane and ethyltriacetoxysilane; anti-yellowing agent is one or more of ultraviolet absorbent and light stabilizer; and catalyst is dibutyltin diacetate or dibutyltin dilaurate. The invention does not depend on the foreign product and provides the high-performance acidic sealant so as to fills the gap that neutral transparent silicone sealant can not be used in the glass fishbowl; and the sealant has good bonding property to the substrate, and can not have blushing and yellowing and can have no pollution to the environment. The sealant can satisfy the demands of the specific curtain wall, glass roof and glass fishbowl.

An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

The invention relates to the technical field of flexible circuit boards, in particular to a halogen-free resin composition. The halogen-free resin composition comprises, by weight, 40-60 parts of polyester-type polyurethane resin, 15-25 parts of polyfunctional epoxy resin, 10-20 parts of phosphorus-containing phenolic resin, 15-25 parts of phosphorus-containing flame retardant and a proper quantity of organic solvent. The polyester-type polyurethane resin contains carboxyl, the acid value is 35 KOHmg/g, and the number-average molecular weight is 10,000-50,000. The polyester-type polyurethane resin containing the carboxyl can be reacted with biphenyl type epoxy resin, and the biphenyl type epoxy resin can be reacted with the phosphorus-containing phenolic resin so that an interpenetrating polymer network structure can be formed. In this way, a cured product has excellent ionic migration resistance and has high flexibility and high heat resistance. The invention further relates to a cover film prepared from the halogen-free resin composition, the excellent ionic migration resistance is achieved, and dendritic crystals can be avoided during ionic migration resistance testing.

The invention relates to the field of nano materials and particularly relates to a mildew-resistant and antibacterial nano-silver decorative laminated board. The mildew-resistant and antibacterial nano-silver decorative laminated board is formed by a decorative veneer and a base material which are bonded by an adhesive layer, wherein the decorative veneer and the base material are dipped by nano aqueous solution; the adhesive layer contains nano-silver substances; the decorative veneer and the base material are made of technical wood; the nano-silver aqueous solution is formed by adopting deionized water as a solvent, adopting nano silver as solute to be dissolved into the deionized water, adopting acrylic resin as a complexing agent and a stabilizing agent to be dissolved into the deionized water, and adding a dispersing agent and a first reducing agent simultaneously; the concentration of nano silver in the adhesive is 75-150ppm; the mass content of flour in solution is 18-45%; environmental-friendly glue comprises the following materials in parts by weight: 40-80 parts of acrylic resin solution emulsion with the solid content being 40-55%, 20-40 parts of acrylic resin powder, 5-20 parts of EVA emulsion with the solid content being 40-60%, 1-4 parts of dibutyl phthalate and 7-13 parts of chlorinated polypropylene or polyolefin substrate adhesive-force promoter. The mildew-resistant and antibacterial nano-silver decorative laminated board has the advantages that the stability and the dispersibility are good and the mildew can be fully resisted.

The invention discloses a rapidly solidified anisotropic conducting resin and preparation method thereof, wherein, the prepared anisotropic conducting resin comprises the following components by weight: 100 parts of epoxy resins, 20-100 parts of epoxy acrylic resins, 0-60 parts of active diluents, 10-150 parts of conductive particles, 1-30 parts of flexibilizers, 0.5-30 parts of curing agents, 0.01-6 parts of nanometer inorganic filling materials, and 0.01-5 parts of coupling agents. The anisotropic conducting resin prepared by the invention can be rapidly solidified at middle temperature with good reliability, and is suitable for rapid reverse package of IC.

The invention relates to a solvent-free unfoamed polyurethane structured adhesive which contains a component A and a component B, wherein the mass ratio of the component A to the component B is 4:1; the component A contains the following raw materials in parts by mass: 30-45 parts of polyol, 50-47 parts of packing, 8-6 parts of a water removing agent, 4-2 parts of phthalic acid bi(2-ethylhexyl) ester, 3-0 parts of xylene formaldehyde resin, 4-0 parts of lyophobic gaseous silicon and 1-0 parts of an amino curing agent; and the component B contains the following raw material in part by mass: 100 parts of polymethylene polyphenyl isocyanate. The solvent-free unfoamed polyurethane structured adhesive provided by the invention is small in moisture influence, and is barely affected by ambient humidity, a foaming phenomenon in the gluing curing process can be avoided, and later reliability can be greatly improved.

The invention discloses a high-strength environment-friendly composite board which is characterized by being prepared from the following raw materials in parts by weight: 5-10 parts of debregeasia orientalis powder, 5-10 parts of corncobs, 20-30 parts of bamboo powder, 5-10 parts of wollastonite powder, 5-10 parts of brucite fibers, 0.5-1 part of sodium lignosulfonate, 0.5-1 part of polyethylene wax micropowder, 0.1-0.2 part of sodium benzoate, 0.5-1 part of a titanate coupling agent TMC-201 and 10-20 parts of a bonding aid. The composite board has high strength, high toughness and excellent impact resistance, and is strong in water-proof and corrosion-proof performances, good in durability, stable in property, uniform in texture, good in use performance, wide in raw material source, low in price, simple in process, environment-friendly, nontoxic, harmless, economic and practical.

A thermoplastic polymer composition which is excellent in flexibility, mechanical properties, and moldability, capable of adhering to ceramics, metals, and synthetic resins without a treatment with a primer, and exhibits a high adhesion strength even when exposed to a high temperature environment, and a molded product obtained by using the thermoplastic polymer composition. The thermoplastic polymer composition includes 100 parts by mass of a thermoplastic elastomer (A), 1 to 100 parts by mass of a polyvinyl acetal resin (B), and 0.1 to 300 parts by mass a softener (C). The thermoplastic elastomer (A) is a block copolymer including a polymer block constituted by aromatic vinyl compound units and a polymer block constituted by conjugated diene units or a hydrogenated product of the block copolymer. The polyvinyl acetal resin (B) has a glass transition temperature of 80 to 130° C.

The invention relates to the technical field of epoxy structural adhesives, in particular to a single-component epoxy structural adhesive for waterproof sealing. The single-component epoxy structuraladhesive is prepared from the following raw materials in parts by weight: 100 to 150 parts of epoxy resin, 30 to 90 parts of multifunctional epoxy resin, 50 to 150 parts of a curing agent and 30 to 120 parts of a hydrophobic filling material. The invention further discloses a preparation method of the single-component epoxy structure adhesive for waterproof sealing. The single-component epoxy structure adhesive for waterproof sealing is high in bonding strength, low in water vapor transmittance, excellent in high-temperature and high-humidity resistance, excellent in high-temperature and low-humidity resistance, and is excellent in universality on bonded base materials.

It is an object to provide a near infrared light absorbable dye composition which absorbs near infrared light efficiently, has a high visible light transmittance, is excellent in light resistance, heat resistance and wet heat resistance, is hardly deteriorated in durability even when blended so as to have an absorption in a wide range of 800 to 1100 nm, and requires a low cost for synthesis and isolation thereof upon production, and provide a near infrared light absorbable filter containing the same. Provided is the near infrared light absorbable dye composition containing compounds represented by the following formulae (1), (2) and (3):

wherein R¹ to R⁴ represent an organic group which has a carbon atom at a binding position and may have a substituent or a hydrogen atom, R⁵ to R⁸ represent an aliphatic hydrocarbon group or an aryl group which may have a substituent, R¹ and R² and the like may together form a ring; R⁹ and R¹⁰ in the general formula (3) represent R¹ and R² or R³ and R⁴ in the general formula (1), and R¹¹ and R¹² in the general formula (3) represent R⁵ and R⁶ or R⁷ and R⁸ in the general formula (2), respectively.

The invention relates to a preparation method of special coating resin composition for polyethylene. The preparation method comprises the following steps of: adding a peroxide crosslinking agent accounting for 0.001-0.5% of low-density polyethylene into the low-density polyethylene, and mixing and granulating to prepare the coating resin for the polyethylene, wherein the peroxide crosslinking agent consists of alkyl peroxide, lipid peroxide, diacyl peroxide and hydroperoxide, each of which accounts for 55-85%/5-15%/5-15%/5-15% according to the percentage by weight; the extrusion temperature of an extrusion machine is 150-250 DEG C, and the rotating speed of a screw is 20-60r/min; and the MFR (Melt Flow Rate) of the low-density polyethylene is 5.0-10.0g/10min, and the density is 0.915-0.925g/cm<3>. The special coating resin composition has the characteristics of high strength, good toughness, strong adhesive force and uniform filing forming and the like and is mainly used for surface coating, paper-plastic lamination, a bonding layer and film lamination of plastic woven bags.

The invention provides a novel acrylic pressure-sensitive adhesive. The raw materials for preparing the novel acrylic pressure-sensitive adhesive at least comprise acrylic acid, acrylate, a solvent, an initiator and a plasticizer. The novel acrylic pressure-sensitive adhesive provided by the invention has a simple formula, is not added with additives such as an anti-aging agent, tackifying resin,and a softener, and has good adhesive property to most polar material surfaces or porous material surfaces, such as metals, cement, paper, wood, and ceramics. At the same time, the novel acrylic pressure-sensitive adhesive also has good adhesive property to plastics and fibers such as polyvinyl chloride, polyester, polystyrene and polyolefin treated by corona. The pressure-sensitive adhesive provided by the invention can be reused, can still maintain good adhesive characteristics after being pasted and peeled off for many times, and the peeling strength does not obviously drop; and the pressure-sensitive adhesive can be easily separated from an adhered object and does not cause transfer of an adhesive layer after being adhered for a long period of time or after being subjected to a large amount of pressure.

This invention provides a UV-curable resin composition for use in a touchscreen. Said resin composition excels in terms of workability and storage stability and makes it possible to obtain, with high productivity, an optical member, such as a display unit, that exhibits low volatility, low permittivity, good curing performance, and good adhesion. Said resin composition, which is used to bond two or more optical substrates together, is characterized by containing the following: (A) a monofunctional (meth)acrylate that has a C10 - 30 aliphatic chain containing a branched chain; (B) a softening component; (C) a photopolymerizable oligomer; and (E) a photopolymerization initiator.

The invention discloses a halogen-free flame retardant polyamide hot-melt adhesive and a preparation method thereof. The halogen-free flame retardant polyamide hot-melt adhesive consists of the following components in parts by weight: 100 parts of a dimer acid polyamide hot-melt adhesive, 15-65 parts of a halogen-free flame retardant and 0.3-3 parts of an antioxidant, wherein the halogen-free flame retardant is one or a compound of the following substances: melamine cyanurate, melamine pyrophosphate, ammonium polyphosphate, pentaerythritol and zinc oxide. The halogen-free flame retardant polyamide hot-melt adhesive is superior in flame retardant property, can pass UL-94V0 grade flame retardancy test, is consistent with the environmental requirements of RoSH and the like, and is high in the bonding strength.

It is an object of the present invention to provide an adhesive substance capable of being easily peeled off without damaging an adherend by means of irradiation with light, an adhesive product, and a connected structure. The present invention relates to an adhesive substance containing an azo compound generating gas by means of irradiation with light, at least part of gas generated from said azo compound being discharged to the outside of said adhesive substance.

The invention belongs to the technical field of optical functional materials. A mixture system of a diimonium salt dye and a polyacrylate pressure-sensitive adhesive which contains alkoxy acrylate and has good compatibility with the diimonium salt dye is used, and a conventional coating preparation technology is used. The invention relates to a near infrared blocking membrane which is a single layer structure, and comprises a substrate, an adhesive glue film and an isolation film, the adhesive glue film thickness is between 5 ~ 50 mum, and an adhesive glue film coating liquid includes at least the following components by mass: 100 parts of the polyacrylate pressure-sensitive adhesive containing 9% ~ 50% of alkoxy acrylate, 0.5-10 parts of diimonium salt and 0.1-10 parts of a curing agent. The preparation method also includes curing process, and the curing conditions are 40-70 DEG C, 30-60% of RH, and 24-168 hours. The near infrared blocking membrane has good visible light region light transmittance, lower near infrared region light transmittance, and good stability of spectral integral blocking effect, and is applicable to the fields of electronics optical instruments and the like with shielding requirements on near infrared. The preparation method is simple in process and easy in operation and control, and production efficiency and rate of good product are high.

The invention provides a heat conduction adhesive tape. The heat conduction adhesive tape is used for connecting electronic assemblies of electronic devices. The heat conduction adhesive tape comprises a first stripping paper, a first adhering layer, a first ceramic powder, a substrate layer and two heat conduction graphite patches, wherein the heat conduction graphite patches are respectively arranged at the two sides of the substrate layer along the width direction; the two heat conduction graphite patches, and the opposite first adhering layer and substrate layer at interval form an accommodation space; the first ceramic powder is accommodated into the first accommodation space; the first stripping paper is adhered onto the outer surface of the first adhering layer. The heat conduction adhesive tape and a heat conduction double-side adhesive tape have the advantage that the heat can be conducted in the width direction of the adhesive tape.

The invention relates to a high-temperature-resistant conductive silver adhesive used for production of an LED. The conductive silver adhesive comprises the following materials in parts by weight: 50parts of polyester resin; 50 parts of epoxy resin; 40 parts of silver powder; 10 parts of nickel powder; 10-12 parts of polymethyl methacrylate; 10-12 parts of an ethylene-ethyl acrylate copolymer; and 6-7 parts of a surfactant. According to the conductive silver adhesive provided by the invention, the formula of a conductive silver adhesive with a low silver content is improved and optimized, sothat the conductive silver adhesive has excellent high-temperature-resistant performance and higher and more stable bond strength with a circuit board and components after being cured, and helps to improve the structural stability of the LED after being used for a long time.

The invention relates to an FPC film for an LED lamp strip and a preparation method thereof. According to the FPC film for an LED lamp strip, the FPC film is a single-sided film, including a high temperature resistant PET film, a hot melt adhesive layer and a protective film, wherein the hot melt adhesive layer is coated on one side of the high temperature resistant PET film, and the protective film covers the hot melt adhesive layer; or the FPC film is a double-sided film, including a high temperature resistant PET film, a hot melt adhesive layer and a protective film, wherein the hot melt adhesive layer is coated on two sides of the high temperature resistant PET film, and the protective film covers the hot melt adhesive layer. By using the high temperature resistant PET as a substrate of the novel FPC film, production cost can be effectively reduced. Meanwhile, by using the hot melt adhesive of the modified epoxy system, the novel FPC film has strong adhesion to a copper foil, has excellent temperature resistance and flexibility, and can be applied to the production of LED lamp strips through a simple process.

The invention provides a processing technology of an adhesive film backboard integrated packaging material. The processing technology comprises the following steps: a backboard layer is provided, wherein the backboard layer comprises a structure enhancement layer and a weather-proof layer, and the structure enhancement layer and the weather-proof layer are bonded through an adhesive; materials aremixed, melted and subjected to tape casting, and the adhesive film layer is obtained, wherein the material comprises the following components: 90 to 100 parts of modified EVA resin, 0.3 to 1.5 partsof a cross-linking agent, 0.4 to 2.0 parts of an auxiliary cross-linking agent, 0.4 to 2.0 parts of a coupling agent, 0.01 to 1.0 part of an ultraviolet absorbent, 0.01 to 1.0 part of an antioxidant,0.01 to 1.0 part of a light stabilizer and 0 to 15 parts of titanium dioxide; the backboard layer and the adhesive film layer are compounded and formed, so that the structure enhancement layer and theadhesive film layer are bonded in a thermal compounding mode; and after cooling, drawing and rolling, the adhesive film backboard integrated packaging material is obtained. The invention also provides an adhesive film backboard integrated packaging material. The adhesive film backboard integrated packaging material provided by the invention has relatively good bonding performance.

The invention relates to the technical field of high polymer materials, in particular to an organic silicon pouring sealant and a preparation method thereof. The organic silicon pouring sealant is prepared from a component A and a component B. The component A is prepared from the following raw materials in parts by mass: 100 parts of base glue, 20-100 parts of double hydroxyl-terminated polydisiloxane A, 6-12.8 parts of liquid MQ resin, 0-9.6 parts of a plasticizer A, 1.3 parts of pigment and 1.2 parts of a deep curing agent. The component B is prepared from the following raw materials in parts by mass: 100 parts of a plasticizer B, 10-40 parts of a cross-linking agent, 5-25 parts of a coupling agent and 0.5-2 parts of an organic tin catalyst; wherein the viscosity of the double hydroxyl-terminated polydimethylsiloxane is 200 to 750 mPa.s, and the base rubber is prepared from the following raw materials: double hydroxyl-terminated polydisiloxane B and a semi-reinforcing filler. The organic silicon pouring sealant provided by the invention is an organic silicon pouring sealant with good leveling property and high UV resistance, and can be well used as a pouring sealant for LED small-spacing display screen modules.