Halogen-free resin composition and cover film prepared from the same

A resin composition and covering film technology, applied in the field of flexible circuit boards, can solve problems such as dendrite growth, and achieve the effects of high adhesion, excellent ion migration resistance, flexibility and heat resistance.

Inactive Publication Date: 2016-04-13
GUANGDONG SHENGYI SCI TECH
View PDF19 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This new type of material uses special chemical compounds called bifunctional esters or acids (BETA) instead of traditional materials like bisphenols A). These BFAs are used together by mixing them into one mixture before curing it over another layer on top. They create strong networks between different molecules without leaving any residues after they have been mixed during manufacturing process. By doing this, these types of compositions provide better properties such as strength, durability, impact absorption, elongation at break, water repellency, etc., compared to existing products containing conventional plasticizers.

Problems solved by technology

This patented technical solution involves improving the performance of electronic components made up of flexible circuits without causing any issues like short or open circuits caused by static charge buckling when bent at very small angles. By adding specific materials called ion mobility resistants onto this material beforehand, they help prevent electrical discharge between different parts within the device's structure. These coatings enhance its ability to maintain their integrity over long periods under various conditions including temperature changes and mechanical shock. Additionally, there should include a special type of covering film called a seal around each part where the electrodes enter through holes, allowing them to function properly while still being protected against external factors like humidity and cleanliness.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Halogen-free resin composition and cover film prepared from the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Halogen-free resin composition, by weight, comprising: polyester type polyurethane resin (UR-3500, solid content 40%, acid value 35KOHmg / g) 40 solid weight parts, biphenyl type epoxy resin (NC-3000H, epoxy equivalent 285±20g / eq, solid content 100%) 15 parts, phosphorus-containing phenolic resin (LC-950PM60, solid content 60%) 10 solid parts by weight, 2-ethyl-4-methylimidazole 0.1 part, containing 15 parts of phosphorus flame retardant (OP-935) and an appropriate amount of solvent butanone;

[0025] Preparation of halogen-free resin composition (resin glue): weigh the above components according to the formula, dissolve biphenyl type epoxy resin and 2-ethyl-4-methylimidazole with methyl ethyl ketone in advance, and then mix them with other components. Partially mixed to make resin glue, so that its solid content is 40%;

[0026] Preparation of cover film for flexible circuit boards: use a coating machine to coat the resin glue on a polyimide film with a thickness of 12

Embodiment 2

[0028] Halogen-free resin composition, by weight, comprising polyester polyurethane resin (UR-3500, acid value 35KOHmg / g, solid content 40%) solid weight 60 parts, biphenyl epoxy resin (NC-3000H, ring Oxygen equivalent 285±20g / eq, solid content 100%) 25 parts, phosphorus-containing phenolic resin (LC-950PM60, solid content 60%) 20 solid weight parts, 2-ethyl-4-methylimidazole 0.3 parts; phosphorus-containing 25 parts of flame retardant (OP-935) and appropriate amount of solvent butanone;

[0029] Preparation of halogen-free resin composition (resin glue): weigh the above components according to the formula, dissolve biphenyl type epoxy resin and 2-ethyl-4-methylimidazole with methyl ethyl ketone in advance, and then mix them with other components. Partially mixed to make resin glue, so that its solid content is 40%;

[0030] Preparation of cover film for flexible circuit boards: use a coating machine to coat the resin glue on a polyimide film with a thickness of 12.5 μm, con

Embodiment 3

[0032]Halogen-free resin composition, by weight, comprising polyester type polyurethane resin (UR-3500, acid value 35KOHmg / g, solid content 40%) 50 solid weight parts, biphenyl type epoxy resin (NC-3000H, cyclic Oxygen equivalent 285±20g / eq, solid content 100%) 20 parts, phosphorus-containing phenolic resin (LC-950PM60, solid content 60%) 15 solid weight parts, 2-ethyl-4-methylimidazole 0.2 parts, phosphorus-containing 20 parts of flame retardant (OP-935) and appropriate amount of solvent;

[0033] Preparation of halogen-free resin composition (resin glue): weigh the above components according to the formula, dissolve biphenyl type epoxy resin and 2-ethyl-4-methylimidazole with methyl ethyl ketone in advance, and then mix them with other components. Partially mixed to make resin glue, so that its solid content is 40%;

[0034] Preparation of cover film for flexible circuit boards: use a coating machine to coat the resin glue on a polyimide film with a thickness of 12.5 μm, c

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Acid valueaaaaaaaaaa
Epoxy equivalentaaaaaaaaaa
Login to view more

Abstract

The invention relates to the technical field of flexible circuit boards, in particular to a halogen-free resin composition. The halogen-free resin composition comprises, by weight, 40-60 parts of polyester-type polyurethane resin, 15-25 parts of polyfunctional epoxy resin, 10-20 parts of phosphorus-containing phenolic resin, 15-25 parts of phosphorus-containing flame retardant and a proper quantity of organic solvent. The polyester-type polyurethane resin contains carboxyl, the acid value is 35 KOHmg/g, and the number-average molecular weight is 10,000-50,000. The polyester-type polyurethane resin containing the carboxyl can be reacted with biphenyl type epoxy resin, and the biphenyl type epoxy resin can be reacted with the phosphorus-containing phenolic resin so that an interpenetrating polymer network structure can be formed. In this way, a cured product has excellent ionic migration resistance and has high flexibility and high heat resistance. The invention further relates to a cover film prepared from the halogen-free resin composition, the excellent ionic migration resistance is achieved, and dendritic crystals can be avoided during ionic migration resistance testing.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner GUANGDONG SHENGYI SCI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap