A
semiconductor wafer has a device area where a plurality of
semiconductor devices are respectively formed in a plurality of regions partitioned by a plurality of crossing division lines formed on the front side of the
semiconductor wafer and a
peripheral area surrounding the device area. The back side of the semiconductor
wafer corresponding to the device area is ground to thereby form a circular recess and an annular projection surrounding the circular recess. In a
chip stacked wafer forming step, a plurality of
semiconductor device chips are provided on the bottom surface of the circular recess of the semiconductor wafer at the positions respectively corresponding to the semiconductor devices of the semiconductor wafer. The
chip stacked wafer is ground to reduce the thickness of each
semiconductor device chip to a finished thickness, and a through
electrode is formed in each
semiconductor device of the semiconductor wafer.