36results about "Impedence networks" patented technology

A medical apparatus includes a medical assist device to process signals to relating biological functions. A first lead is operatively connected to the medical assist device, the first lead having a distal end and a proximal end. A second lead is operatively connected to the medical assist device, the second lead having a distal end and a proximal end. The first electrode is operatively connected to the distal end of the first lead, and a second electrode is operatively connected to the distal end of the second lead. A filter circuit is operatively connected near the distal end of the first lead and the distal end of the second lead. A compensation circuit, operatively connected to the first lead, provides a compensation voltage to enable the filter to effectively block changing magnetic fields induced current in the second lead from passing through the second electrode of the distal end of the second lead.

A microelectromechanical structure and device and methods of forming and using the structure and device are disclosed. The structure includes a mechanical element, an ion conductor and a plurality of electrodes. Mechanical properties of the structure are altered by applying a bias across the electrodes. Such structures can be used to form devices such as resonators for RF applications.

In one aspect of the invention, an acoustic device has a first coupled resonator filter (CRF) and a second CRF electrically coupled to one another in series. Each CRF has an input port, an output port, a bottom film bulk acoustic resonator (FBAR), an acoustic decoupler formed on the bottom FBAR, and a top FBAR formed on the acoustic decoupler. Each FBAR has a bottom electrode, a piezoelectric layer formed on the bottom electrode, and a top electrode formed on the piezoelectric layer. The decoupling layer capacitance arising between the two electrodes enclosing the acoustic decoupler in a CRF is configured to achieve targeted filter response. A compensating capacitance is introduced to improve the amplitude and phase imbalance performance of an unbalanced to balanced CRF by eliminating the existence of asymmetric port-to-ground or feedback capacitance at the balanced output port produced by the decoupling layer capacitance.

A piezoelectric substrate and interdigital electrode portions are covered with an insulating layer with an insulating thin film interposed therebetween. The piezoelectric substrate is made of LiTaO₃ and the insulating thin film and the insulating layer are made of silicon oxide. By intentionally making the upper surface of the insulating layer flat, the deterioration of propagation efficiency of surface acoustic waves can be suppressed, so that it is possible to reduce increase in insertion loss of a resonator. Since the upper surface of the insulating layer is flat, it is also possible to reduce variation in resonant frequency and anti-resonant frequency due to the temperature change of the surface acoustic wave device.

A piezoelectric device includes a base substrate constituting the bottom of the package; a framed resonator element layered on the base substrate; and a lid for hermetically sealing a space within the package, the lid being layered on the framed resonator element. The framed resonator element includes a frame constituting a wall surrounding the space within the package; a base having a predetermined width, which is integrally formed inside the frame; a plurality of resonating arms that extend in parallel to each other from the base in one direction in the frame; first cutouts that are provided near the base ends of the resonating arms in the base; and second cutouts formed at the joint between the base and the frame.

A transmission filter includes five series resonators that include functional electrodes provided on a piezoelectric substrate, and connected in series with each other between a transmission input terminal and an antenna terminal, and parallel resonators. Frequency differences between the anti-resonant frequencies and the resonant frequencies of the series resonators other than the series resonator connected so as to be closest to the transmission input terminal and the series resonator connected so as to be closest to the antenna terminal are smaller than frequency differences of the series resonators, and anti-resonant frequencies of the series resonators are lower than the anti-resonant frequencies of the series resonators.

The invention provides a piezoelectric acoustic wave resonator. The shape of an effective working area of the piezoelectric acoustic wave resonator is a polygon, a first side and a second side in theeffective working area correspond to an input side and an output side of the piezoelectric acoustic wave resonator respectively, and an outer frame of the effective working area is defined as a rectangle which can surround the effective working area and has the smallest area where one side coincides with the first side or the second side; one side of the outer frame that coincides with the first side or the second side has a first length, one side of the outer frame that is perpendicular to the side has a second length, and the ratio range of the first length to the second length is 1-4; and the ratio range of the sum of the lengths of the first side and the second side to the circumference of the effective working area is 0.4-0.7, wherein the ratio ranges of the lengths of the first sideand the second side to the circumference of the effective working area are both 0.2-0.35. The invention also provides a piezoelectric acoustic wave filter, a duplexer and a radio frequency communication module. Through the implementation of the invention, the electrical transmission loss of the piezoelectric acoustic wave resonator can be improved, and the insertion loss of the piezoelectric acoustic wave filter can be further improved.

An illuminating device has an LED, a lighting panel provided corresponding to the LED for guiding light emitted from the LED to illuminate an LCD. An optical membrane is provided on a surface through which the light from the LED passes so as to correct chromaticity of the light.

A band pass filter includes a longitudinally coupled resonator elastic wave filter on a piezoelectric substrate and parallel arm resonators at parallel arms, each connected between a series arm connecting an antenna terminal and a receiving terminal and one of ground terminals. The parallel arm resonators include a first parallel arm resonator having the highest resonance frequency among the parallel arm resonators and a second parallel arm resonator. A second ground terminal that is one of the ground terminals connected to the second parallel arm resonator and a third ground terminal that is one of the ground terminals connected to the longitudinally coupled resonator elastic wave filter are connected to each other. A first ground terminal that is one of the ground terminals connected to the first parallel arm resonator is not connected to the second or third ground terminals.

A liquid crystal module includes a liquid crystal panel and a back light unit. The back light unit has a rear frame, a light guide plate and a lamp reflector assembly. The lamp reflector assembly including a light source, a lamp reflector and a lamp socket. The lamp reflector has a front plate, a rear plate and a side plate with a tab. At least one of the front plate and the rear plate has a fixing hole. The lamp socket has a fixing protrusion that is fitted into the fixing hole of the lamp reflector, and a slit that receives the tab of the lamp reflector.

The present invention provides a radio frequency (RF) filtering circuit and a plasma processing apparatus employing the RF filtering circuit, wherein the RF filtering circuit comprises a primary filter and a secondary filter, the secondary filter comprises two or more filters connected in parallel, the primary filter is selectively connected to one of the secondary filters through a switch; the RFfiltering circuit further comprises a heating means and a DC power supply for heating the heating means; the primary and secondary filters are disposed between the heating device and the DC power source for filtering radio frequency signals from the heating device into the DC power supply. Utilizing the RF filtering circuit of the present invention may greatly reduce the tuning difficulty, improving the accuracy of the RF filtering circuit.

The invention provides a duplexer which is characterized by comprising a transmitting filter which is connected between a transmitting end and an antenna end and comprises a series resonator and a parallel resonator which are connected in a trapezoid form; and a reception filter, wherein the receiving filter is connected between the receiving end and the antenna end and comprises a series resonator and a parallel resonator which are connected in a trapezoid mode, wherein the LWR resonator and the parasitic inductor are connected to a series branch of the transmitting end, the receiving end orthe antenna end in series, and the parasitic inductor is close to one side of the transmitting end, the receiving end or the antenna end. According to the present invention, the LWR Lamb wave resonator is introduced into the design of the filter and the duplexer, so that the parasitic inductance exists on the signal connecting line, the parasitic inductance can be counteracted through the series connection of the LWR, and the matching and the insertion loss are improved.

A method of fabricating a case accommodating a piezoelectric vibrating piece therein in a piezoelectric oscillator including the piezoelectric vibrating piece, including the steps of: applying deep drawing to a conductive plate member to shape the plate member in a nearly cylindrical shape with a bottom; pressing an inner surface of a bottom part of the plate member by a punch for step drawing while an outer surface of the bottom part is being abutted against a surface including an opening of a hole of a die having an inner diameter smaller than the outer diameter of the bottom part, whereby a projecting portion is formed on the outer surface of the bottom part; and cutting the plate member having the projecting portion at a predetermined position on the opening side thereof, whereby a case in a nearly cylindrical shape with a bottom having the projecting portion is obtained.

The invention provides a double frequency filtering device, a processing method thereof and a semiconductor device. The double frequency filtering device comprises a low frequency filtering unit and a high frequency filtering unit. An output terminal of the low frequency filtering unit is connected to a common output terminal. An input terminal of the low frequency filtering unit is used for introducing low frequency power, and the low frequency filtering unit is used for separating high frequency power from the high frequency filtering unit to prevent the high frequency power from ground conduction. An output terminal of the high frequency filtering unit is connected to the common output terminal. An input terminal of the high frequency filtering unit is used for introducing the high frequency power, and the high frequency filtering unit is used for separating the low frequency power from the low frequency filtering unit to prevent the low frequency power from the ground conduction. According to the technical scheme of the invention, the double frequency filtering device can form an ideal low frequency channel and an ideal high frequency channel, so that the double frequency filtering device can introduce the low frequency power and the high frequency power into a bottom electrode more ideally.

The invention discloses an optical chip and inertial sensor integrated device and a manufacture method thereof. The optical areas of optical chips face a PCB; the pins of the optical chips are welded on the welding disc of the PCB by plating solder balls; an optical window corresponding to the optical chip is also formed in the PCB. The integrated device also comprises a transmitting part covering the optical window, wherein an inertial sensor chip is fixedly arranged on one side, far from the PCB, of each optical chip; the outer sides of the optical chips and the inertial sensor chip are provided with a non-transmitting plastic package body; the non-transmitting plastic package body can be used for achieving plastic package of the optical chips and the inertial sensor chip together on the PCB. According to the integrated device disclosed by the invention, the inertial sensor chip and the optical chips, which are both different in structure and principle, can be integrated in a same package structure, so that the package size of the whole integrated device is greatly reduced.

The invention belongs to the field of positioning navigation time (PNT), and particularly relates to an integrated micro PNT unit comprising a central micro clock module and an outer micro inertia module, wherein an anchor point of the central micro clock module is located at the center, a plurality of circles are distributed outside the anchor point, radial short beams are uniformly distributed between the circles, and outer electrodes are distributed at the outermost periphery. During operation, stable control is realized by electrostatic force action and closed-loop feedback, and stable frequency information is provided externally; the annular anchor point of the micro inertia module is located at the center, the circles are located on the outer side, the composite beams are evenly distributed between the circles and the annular anchor point, the inner and outer sides of the circles are evenly distributed with plane outer electrodes and plane inner electrodes, and the upper and lower surfaces of the circles are distributed with off-plane electrodes, thereby realizing the sensitivity of X, Y, Z three-axis acceleration input and X, Y, Z three-axis angular motion input. The integrated micro PNT unit can be realized by the MEMS planar process as a whole without involving multi-layer stacking and precision assembly on a microscopic level, and the process is relatively simple.

The invention discloses a common-mode noise suppression circuit adopting a complementary structure. The common-mode noise suppression circuit comprises a dielectric substrate, a differential coupling circuit, a reference grounding layer and a filter circuit, wherein the differential coupling circuit is attached to the upper surface of the dielectric substrate; the reference grounding layer and the filter circuit are attached to the lower surface of the dielectric substrate; the reference grounding layer and the filter circuit are formed by attaching a metal layer to the lower surface of the dielectric substrate and then adopting an etching process on the metal layer; the filter circuit comprises two resonator groups and two Z-shaped short-circuit branch line groups; each resonator group is composed of two complementary quarter-wavelength resonators; and each Z-shaped short-circuit branch line group is composed of two Z-shaped short-circuit branch lines. The common-mode noise suppression circuit has the advantages of being simple in structure, small in size, low in cost, wide in suppression bandwidth, deep in suppression depth and capable of guaranteeing signal integrity of differential signal transmission while achieving common-mode noise suppression.

The invention discloses a bulk acoustic wave filtering device, a forming method thereof, a radio frequency front end and a communication device. The bulk acoustic wave filtering device comprises an unpackaged bulk acoustic wave resonance device, a connecting part and a circuit board, the first end of the connecting part is connected with the unpackaged bulk acoustic wave resonance device, and the second end of the connecting part is connected with the circuit board; the unpackaged bulk acoustic wave resonance device comprises a piezoelectric layer which comprises a first side and a second side opposite to the first side in the vertical direction; the first electrode layer is located on the first side; the second electrode layer is located on the second side; the first passivation layer is located on the first side and covers the first electrode layer, and the material of the first passivation layer comprises oxide or nitride; the second passivation layer is located on the second side and covers the second electrode layer; the cavity is located on the first side, and at least one end of the first electrode layer is located in the cavity or the first electrode layer covers the cavity; the connecting part is connected with the first electrode layer or the second electrode layer. The working frequency of the filtering device is stable, the resonator is not packaged, and the packaging cost is reduced.

The invention discloses a novel surface acoustic wave or transverse wave exciter acoustic-microwave device chip structure. The chip structure comprises a surface acoustic wave or transverse wave exciter acoustic-microwave device chip circuit and a chip substrate; a first groove and a second groove are arranged in the chip substrate; a first piezoelectric material is filled in the first groove; a first electrode is arranged on the first piezoelectric material; one end of the first electrode is connected with the first piezoelectric material; the other end of the first electrode is connected with the signal input end of the chip circuit; a second piezoelectric material is filled in the second groove; a second electrode is arranged on the second piezoelectric material; one end of the second electrode is connected with the second piezoelectric material; and the other end of the second electrode is connected with the signal output end of the chip circuit. By means of the novel surface acoustic wave or transverse wave exciter acoustic-microwave device chip structure provided in the invention, the transmission loss and microwave insertion loss of the device can be reduced; and the performances of the device, such as the frequency and the quality factor, can be improved.

The invention discloses a resonance sheet fixing structure of a quartz crystal resonator. The resonance sheet fixing structure comprises a dispensing platform and a resonance sheet, wherein one end ofthe resonance sheet is fixed on the dispensing platform through a colloid; the resonance sheet fixing structure of the quartz crystal resonator is characterized in that the colloid comprises a bottomglue point and a surface glue point which are fused together, the bottom glue point is conductive glue, and the surface glue point is non-conductive glue, so that the resonance sheet fixing structureof the quartz crystal resonator has the advantages that the surface glue adopts the non-conductive glue, half of the conductive glue is saved, and the production cost is greatly reduced; in addition,the situation that electric pollution is caused to the upper surface of the resonance sheet by glue points dripped by the conductive glue is avoided; and the short-circuit condition caused by contactbetween the electrode and the metal shell due to over-high conductive adhesive points is avoided.

The invention discloses a filter extrusion forming winding module. The filter extrusion forming winding module comprises a base and a plate cover mounted on the base in a matching manner; a material carrying groove for placing a carrier which needs to be wound, and a wire inlet groove positioned besides the material carrying groove for allowing a wire material to pass through are formed in the base; the wire inlet groove has a linear section and a circular arc section connected with the linear section; the plate cover can cover the upward side of the wire inlet groove to form a wire inlet channel; the base is provided with a wire baffling embedded block for blocking a wire end winding ring of the wire material from entering along the wire inlet channel, and a driving mechanism for drivingthe wire baffling embedded block to move up and down; the wire baffling embedded block is arranged at the side end of the circular arc section of the wire inlet groove; and a blocking flange formed onthe side edge of the wire baffling embedded block is butt jointed with the circular arc section of the wire inlet groove. By virtue of the filter extrusion forming winding module, two wire ends of acoil can be extruded outwards while the coil is formed, without needing manpower to extrude the wire ends outwards in the later period in use, so that the cost is lowered, time saving and labor savingcan be realized, and the assembling efficiency is highly improved.

The invention discloses a quartz crystal resonator with low acceleration sensitivity, which comprises a ceramic base, an upper cavity and a lower cavity which are arranged on the upper end surface and the lower end surface of the ceramic base, two wafer mounting positions which are respectively arranged in the upper cavity and the lower cavity, and four cristobalite wafers which are correspondingly arranged in the wafer mounting positions and are plated with electrodes, the upper metal cover plate and the lower metal cover plate are used for packaging the upper cavity and the lower cavity; wherein in the two cristobalite wafers plated with the electrodes and installed in the upper cavity of the ceramic base, the installation direction of one cristobalite wafer is obtained by rotating the other cristobalite wafer by 180 degrees in the X-axis direction, and the installation directions of the cristobalite wafers installed in the upper cavity and the lower cavity of the ceramic base are mutually symmetrical in the Z-axis direction. The quartz crystal resonator provided by the invention can realize optimization of vibration phase noise of a vibration circuit under environment vibration conditions in three directions of an X axis, a Y axis and a Z axis. And meanwhile, the volume of the quartz crystal resonator is reduced, and the cost is reduced.

There are provided an electronic component in which two substrates are bonded to each other with a large bonding force and a method for manufacturing electronic components in which two substrates can be bonded to each other with a large bonding force and in which the substrates are not likely to be bent and broken. In an embodiment, a plurality of first connection portions 30 is formed on a first substrate 22, and in addition, a plurality of IDT electrodes 26 and a plurality of second connection portions 32 are formed on a second substrate 24. The first connection portions 30 are engaged in concave parts of the second connection portions 32, so that temporary bonding is performed. Between adjacent first connection portions 30, only the first substrate is cut. By heat application, laser irradiation, pressure application, ultrasonic application, or the like, the first connection portions 30 and the second connection portions 32 are finally bonded to each other. The second substrate 24 is cut along the cut portions of the first substrate 22, so that a plurality of electronic components 20 is formed.

A piezoelectric contains comprises a plurality of piezoelectric particles made from a piezoelectric material such as lead titanate zirconate and a dielectric made from a dielectric material, such as a composite perovskite compound, having a higher dielectric constant then the piezoelectric material, the dielectric existing in gaps between the piezoelectric particles. When poling to produce a piezoelectric ceramic, the poling is uniformly performed, and nearly all of the electric field is applied to the piezoelectric particles. Thus, the dispersion of the piezoelectric properties can be reduced, and the piezoelectric properties can be enhanced.

The invention provides a surface acoustic wave device impedance matcher. The impedance matcher comprises: a circuit substrate provided with an upper surface and a lower surface which are opposite to each other; surface acoustic wave device, wherein a gap is formed between the surface acoustic wave device and the upper surface of the circuit substrate; a bump, wherein the surface acoustic wave device is arranged on the upper surface of the circuit substrate through the bump; and a plurality of metal electrodes which are arranged on the upper surface of the circuit substrate, are electrically coupled with the bumps through wires, and are used for performing impedance matching with an external circuit. The invention further provides a method for the impedance matcher of the surface acoustic wave device and a method for determining impedance matching of the surface acoustic wave device. According to the surface acoustic wave device impedance matcher and the impedance matcher method provided by the invention, impedance matching can be effectively carried out with high precision so as to reduce the insertion loss and the noise coefficient, and meanwhile, the space of a circuit board on which a surface acoustic wave device package is mounted can be more effectively utilized.