97results about "Electric discharge tubes" patented technology

A compact plasma generating apparatus providing high efficiency of plasma excitation is presented. A plasma generating apparatus (100) comprises a microwave generating apparatus (10) for generating microwaves, a coaxial waveguide (20) having a coaxial structure comprising an inner tube (20a) and an outer tube (20b), a monopole antenna (21) being attached to one end of said inner tube (20a), for directing the microwaves generated by said microwave generating apparatus (10) to the monopole antenna (21), a resonator (22) composed of dielectric material for holding the monopole antenna (21), and a chamber (23) in which a specific process gas is fed for plasma excitation. The chamber (23) has an open surface and the resonator (22) is placed on this open surface, and the process gas is excited by the microwaves radiated from the monopole antenna (21) through the resonator (22) into the interior of the chamber (23) to generate plasma.

A plasma reactor for processing a workpiece includes a reactor enclosure defining a processing chamber, a base within the chamber for supporting the workpiece during processing thereof, a semiconductor window electrode overlying the base, a gas inlet system for admitting a plasma precursor gas into the chamber, an electrical terminal coupled to the semiconductor window electrode, an inductive antenna adjacent one side of the semiconductor window electrode opposite the base for coupling power into the interior of said chamber through the semiconductor window electrode.

Provided is a copper or copper alloy target/copper alloy backing plate assembly in which the anti-eddy current characteristics and other characteristics required in a magnetron sputtering target are simultaneously pursued in a well balanced manner. This copper or copper alloy target/copper alloy backing plate assembly is used for magnetron sputtering, and the copper alloy backing plate is formed from low beryllium copper alloy or Cu—Ni—Si-based alloy. Further, with this copper or copper alloy target/copper alloy backing plate assembly, the copper alloy backing plate has electrical conductivity of 35 to 60% (IACS), and 0.2% proof stress of 400 to 850 MPa.

An internal member of a plasma processing vessel includes a base material and a film formed by thermal spraying of ceramic on a surface of the base material. The film is formed of ceramic which includes at least one kind of element selected from the group consisting of B, Mg, Al, Si, Ca, Cr, Y, Zr, Ta, Ce and Nd. In addition, at least a portion of the film is sealed by a resin.

The plasma processing apparatus includes main electrodes 5, 31 opposed to each other with a plasma processing space 15 interposed therebetween. The plasma processing apparatus further has a side electrode 6 opposed to side faces 5B-1, 5B-2 of the main electrode 5, as well as a side electrode 32 opposed to side faces 31B-1, 31B-2 of the main electrode 31. Therefore, in addition to the plasma processing space 15 between the main electrode 5 and the main electrode 31, an electric field can be formed in spaces between the side faces of the main electrodes 5, 31 and the side electrodes 6, 32, the spaces serving as predischarge areas 16-1, 16-2. By this electric field, processing gas present in the predischarge areas 16-1, 16-2 can be transformed into plasma. Electrons and excitation species of the plasma generated in these predischarge areas 16-1, 16-2 can be supplied directly to the plasma processing space 15.

Embodiments of a cover ring for use in a plasma processing chamber are provided. In one embodiment, a cover ring for use in a plasma processing chamber includes a ring-shaped body fabricated from a yttrium (Y) containing material. The body includes a bottom surface having an inner locating ring and an outer locating ring. The inner locating ring extends further from the body than the outer locating ring. The body includes an inner diameter wall having a main wall and a secondary wall separated by a substantially horizontal land. The body also includes a top surface having an outer sloped top surface meeting an inner sloped surface at an apex. The inner sloped surface defines an angle with a line perpendicular to a centerline of the body less than about 70 degrees.

A method and apparatus for terminal sterilization. The method orients a wall of a container in relation to at least one flashlamp, where the wall has an inner surface and an outer surface. The method creates a vortex in a fluid held by the container. The method generates from each flashlamp at least one pulse of high-intensity light in a broad spectrum and exposes the container to each pulse of high-intensity light.

This approach generally pertains to a miniature receptacle terminal with a connection section and a mating section. The mating section has a dual primary contact beam component that includes contact springs having resilient contact beams and a secondary beam. Each contact beam has a contact point opposing the opposing wall of the receptacle terminal, which can include a contact bump. A distributed and balanced contact force is exerted on a male terminal pin that is inserted between the primary contact beams and the contact bumps. Overstress protection of the contact spring is provided and the terminal is economical to produce.

A test socket 10 of the present invention includes a base member 20, a cover member 30 which is installed on base 20 to move in reciprocal straight line movement between a first position away from the base and a second position adjacent the base and a plurality of contact members 40 that are fixed in the base and are capable of making contact with terminals 2 on a semiconductor device 1 when such device 1 is mounted on base 20. A latch member 60 is supported on base 20 in a rotatable manner to move in linkage with the movement of cover member 30. A compression member 80 is pivotably attached to a tip portion 62 of latch member 60 for pressing semiconductor part 1 onto base 20 to achieve reliable contacting between terminals 2 and contacts 40 in response to movement of cover member 30. This socket design will provide for wide area engagement between the surface of semiconductor part 1 and compression member 80 to prevent damage to the semiconductor part 1 during testing.

A connector with a built-in substrate includes an insulating housing, and a terminal and a substrate, which are secured in the insulating housing. The insulating housing has a substrate mounting section to mount the substrate in the insulating housing, and a terminal mounting section to mount a terminal. The direction of mounting the substrate in the substrate mounting section is same as that of mounting the terminal in the terminal mounting section. According to this invention, there is provided a connector with a built-in substrate, in which the substrate has various functions and can be easily mounted in a connector. In addition, the connector can be easily manufactured, and is comprised of less components.

A processing system is provided for irradiating a substrate with a gas cluster ion beam (GCIB). The system includes a vacuum vessel that has an interior and is configured to support the substrate therein, and at least one nozzle for forming and emitting a gas cluster beam. The at least one nozzle is configured to direct the gas cluster beam within the vacuum vessel toward the substrate. An ionizer is positioned to ionize the gas cluster beam to form the GCIB. A main gas supply of the system is in fluid communication with the at least one nozzle for supplying gas to the nozzle. The system also includes a plasma-generating apparatus that communicates with the interior of the vacuum vessel and which is configured to receive a cleaning gas and selectively emit plasma for cleaning the interior of the vacuum vessel.

A measurement system for measuring a consumption amount of a focus ring in a plasma etching apparatus including a processing chamber, a lower electrode and the focus ring surrounding a periphery of the lower electrode, comprises a sensor substrate having a distance sensor and a measurement unit configured to measure a consumption amount of the focus ring. The measurement unit includes a transfer instruction unit, an acquisition unit and a measurement unit. The transfer instruction unit is configured to instruct a transfer unit to transfer the sensor substrate into the processing chamber. The acquisition unit is configured to acquire information on a physical amount corresponding to a distance from the distance sensor to the focus ring, which is measured by the distance sensor. The measurement unit is configured to measure a consumption amount of the focus ring based on the acquired information on the physical amount.

A method and tool for conducting charged-particle beam direct write lithography is disclosed. A disclosed method involves condensing an initial design file down to a set of profiles and a pattern of relative locations to form a formatted pattern file. The formatted pattern file is adjusted to accommodate desired pattern corrections. Portions of the formatted pattern records are extracted to form data strips that have a plurality of channels with a pattern of profiles and spatial indicators. Data strips are sequentially read to construct a printable pattern of profiles and spatial indicators that specify the locations of the profiles. Additionally, the pattern of profiles are sequentially printed from each data strip onto a substrate to form the desired pattern on the substrate.

An object of the present invention is to provide methods and equipment capable of providing highly accurate matching using a template including multiple patterns even when the shapes of some patterns of the template are different from corresponding ones of a SEM image, and when the template and the SEM image have a magnification error. Proposed, as a technique for achieving the object, is a method for performing matching by selectively using some of multiple patterns provided in a predetermined region of design data, and equipment for implementing the method. Moreover, proposed, as another technique for achieving the object, is a method for performing first matching by using multiple patterns provided in a predetermined region of design data and thereafter performing second matching by using some of the multiple patterns provided in the predetermined region, and equipment for implementing the method.

A beam writing apparatus according to an embodiment includes a selection unit configured to select a dose equation from a plurality of dose equations for calculating a dose of a beam, for each small region of a plurality of small regions made by virtually dividing a writing region of a target workpiece into mesh-like regions, a dose calculation unit configured to calculate a dose of a beam which is shot into a small region of the plurality of small regions, by using a selected dose equation, for the each small region, and a writing unit configured to write a desired pattern in the small region, by using a calculated dose, for the each small region.

This disclosure describes systems, methods, and apparatus for frequency tuning a power source so as to optimize power delivery to a plasma load as well as systems, methods, and apparatus for identifying characteristics and/or changes in characteristics of a plasma load. In particular, a secondary power signal can be applied concurrently with a primary power signal, the secondary power signal having a substantially lower power level, so as to tune for a global optimum of a measure of performance and/or identifying characteristics and/or changes in characteristics of a plasma load. The secondary power signal can comprise a low level signal that is jointly generated with or combined with the primary power signal, or it can comprise noise either inherent to the primary power signal or added to the primary power signal.

The present invention relates to preparation of patterned reticles to be used as masks in the production of semiconductor and other devices. Methods and devices are described utilizing resist and transfer layers over a masking layer on a reticle. The methods and devices produce small feature dimensions in masks and phase shift masks. The methods described for masks are in many cases applicable to the direct writing on other workpieces having similarly small features, such as semiconductor, cryogenic, magnetic and optical microdevices.

The invention relates to an ion beam emission source capable of outputting single iron energy so as to solve the problems of the prior art that the extracted ion does not have single energy, the quality of the film is greatly influenced and the repeatability of ion beam assistance is difficult to realize. The technical proposal is as follows: the emission source comprises a gas discharge chamber, a focusing magnetic field generating unit, an ion energy selector and a beam expanding magnetic field generating unit; the gas discharge chamber comprises an anode, a cathode and an extracting grid plate; the ion energy selector comprises an upper magnetic polar plate and a lower magnetic polar plate which are oppositely arranged, and a selecting cylinder which is formed by a first electrode plate and a second electrode plate which are oppositely arranged; polar plate insulating members are arranged among the upper magnetic polar plate, the first electrode plate, the lower magnetic polar plate and the second electrode plate; and the centers of an inlet cover plate and an outlet cover plate at two ends of the selecting cylinder are respectively provided with an energy band limit through hole. Compared with the prior art, the emission source has the advantages that: 1. ion with single energy can be generated and extracted; 2. the energy of the ion is adjustable; and 3. the manufacture process is simple.

To provide a magnetron sputtering cathode, a magnetron sputtering apparatus, and a method of manufacturing a magnetic device, capable of generating a leakage magnetic field sufficiently large to form a magnetic tunnel necessary for discharge on the surface of a target even when the target is a magnetic body and thick and a ferromagnetic body is used as the target. The magnetron sputtering cathode of the present invention includes a target having a second annular groove provided on the sputtering surface of the target, a third annular projection provided on the non-sputtering surface of the target, a fourth annular groove provided outside the third annular projection on the non-sputtering surface, and a fourth annular projection provided outside the fourth annular groove on the non-sputtering surface. Further, the magnetron sputtering cathode includes a first magnet and a second magnet 6 having a polarity different from that of the first magnet on the non-sputtering surface side.

An electrical connector comprises: an insulating housing having an accommodating chamber at a rear portion thereof and a tongue plate protruding forwards from a front portion thereof; a plurality of conductive terminals comprising an upper row of conductive terminals and a lower row of conductive terminals which are mounted on upper and lower sides of the tongue plate respectively, each conductive terminal including a butting portion, a soldering portion, and a bending portion connected between the butting portion and the soldering portion, the butting portions of said upper row of conductive terminals and lower row of conductive terminals being mounted on the upper and lower sides of the tongue plate respectively, the soldering portions of each row of conductive terminals extending from below the rear portion of the insulating housing and being arranged in a front column and a rear column; a shielding casing covering periphery of the insulating housing; and two positioning modules being mounted into the accommodating chamber of the insulating housing and enveloping periphery of the bending portions of said plurality of conductive terminals. The electrical connector can efficiently prevent bending portions of the conductive terminals from further bending and contacting with each other when an external force is applied and thus can prevent the short circuit failure.

In a scanning electron microscope having the function of observing an attentional object on a specimen, an error in an in-focus position can be corrected at high speeds. When moving the field of view to an object to be observed on a specimen on which an electron beam is scanned, an error between an in-focus position indicated by a mechanism for measuring a height of surface of the specimen and an actual in-focus position is corrected on the basis of information concerning points which are among a plurality of measured points and are adjacent to the target observing point.

The present invention is configured to: form, on a substrate, a neutral layer having an intermediate affinity to a hydrophilic polymer and a hydrophobic polymer; form a resist pattern by performing exposure processing on a resist film formed on the neutral layer and then developing the resist film after the exposure processing; perform a surface treatment on the resist pattern by supplying an organic solvent having a polarity to the resist pattern; apply the block copolymer onto the neutral layer; and phase-separate the block copolymer on the neutral layer into the hydrophilic polymer and the hydrophobic polymer.