Copper or copper alloy target/copper alloy backing plate assembly
a technology of copper alloy and backing plate, which is applied in the direction of electrolysis components, coatings, vacuum evaporation coatings, etc., can solve the problems of insufficient uniformity of film, inability to obtain sufficient uniformity, and inability to achieve sufficient uniformity of film, etc., and achieve favorable uniformity of sputtered film
Active Publication Date: 2007-03-08
JX NIPPON MINING& METALS CORP
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Benefits of technology
This patented material has been found very useful for making magnetically controlled switches with good heat dissipation properties. It does this by creating an interference fit between two materials like gold plating on one side of each metal sheet. By doing this, even if some parts expand slightly during use they won't affect their function properly. Additionally, its resistance against electric arcs can be improved without compromising its ability to conduct electrical energy effectively.
Problems solved by technology
This technical problem addressed by these inventors relates to improving the performance and efficiency of sinterbing processes when depositing metal films onto surfaces while avoiding issues associated with traditional methods including melting and fusion.
Method used
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[0044] The Examples and Comparative Example are now explained. Incidentally, these Examples are merely illustrative, and the present invention shall in no way be limited thereby. In other words, the present invention shall only be limited by the scope of claim for a patent, and shall include the various modifications other than the Examples of this invention.
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Abstract
Provided is a copper or copper alloy target/copper alloy backing plate assembly in which the anti-eddy current characteristics and other characteristics required in a magnetron sputtering target are simultaneously pursued in a well balanced manner. This copper or copper alloy target/copper alloy backing plate assembly is used for magnetron sputtering, and the copper alloy backing plate is formed from low beryllium copper alloy or Cu—Ni—Si-based alloy. Further, with this copper or copper alloy target/copper alloy backing plate assembly, the copper alloy backing plate has electrical conductivity of 35 to 60% (IACS), and 0.2% proof stress of 400 to 850 MPa.
Description
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Owner JX NIPPON MINING& METALS CORP
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