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Benzocyclobutene (BCB) is a benzene ring fused to a cyclobutane ring. It has chemical formula C₈H₈. BCB is frequently used to create photosensitive polymers. BCB-based polymer dielectrics may be spun on or applied to various substrates for use in Micro Electro-Mechanical Systems (MEMS) and microelectronics processing. Applications include wafer bonding, optical interconnects, low-κ dielectrics, or even intracortical neural implants.

Electronics module having high density interconnect structures incorporating an improved dielectric lamination adhesive

InactiveUS6294741B1Improve electrical performanceAdequate processing propertyInsulating substrate metal adhesion improvementPrinted electric component incorporationComposite filmHigh density

A multi-chip electronics module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.

Owner:LOCKHEED MARTIN CORP

1 results about "Benzocyclobutene" patented technology

Electronics module having high density interconnect structures incorporating an improved dielectric lamination adhesive

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