1 results about "Electrical structure" patented technology

A multi-chip electronics module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.