IC die support structures for ball grid array package fabrication

Inactive Publication Date: 2006-07-18
AVAGO TECH INT SALES PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0017]In a further aspect, additional assembly process steps in addition to mounting the IC die are performed before removing the IC die support structure. Such additional steps include, for example, connecting a bond pad of the IC die to a contact pad on the

Problems solved by technology

Various assembly process steps for the BGA package may cause harmful stresses and shocks to the IC die.
As a result of the stress occurring during these processes, the package stiffener may become deformed.
The deformation of the stiffener

Method used

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  • IC die support structures for ball grid array package fabrication
  • IC die support structures for ball grid array package fabrication
  • IC die support structures for ball grid array package fabrication

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Embodiment Construction

Overview

[0045]The present invention is directed to a method and system for improving assembly processes for BGA packages, and therefore to improving the mechanical, thermal, and electrical performance of BGA packages. The present invention is applicable BGA packages of all types of BGA substrates, including ceramic, plastic, and tape (flex) substrates. Furthermore the present invention is applicable to die-up (cavity-up) and die-down (cavity-down) orientations.

[0046]Numerous embodiments of the present invention are presented herein. First, ball grid array package types are described below. Next, further detail on the above described embodiments for assembling BGA packages with IC die support, and additional embodiments according to the present invention, are described. The embodiments described herein may be combined as required by a particular application.

Ball Grid Array (BGA) Package

[0047]A ball grid array (BGA) package is used to package and interface an IC die with a printed circui

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PUM

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Abstract

A system and method of assembling a ball grid array (BGA) package with IC die support is described. A stiffener is attached to a substrate that includes a centrally located opening with an integrated circuit (IC) die support structure removably held therein. An IC die is mounted to a central region of the stiffener. Further assembly process steps may be performed on the BGA package with IC die support. The IC die support structure is removed from the centrally located opening. In aspects of the invention, the IC die support structure is removably held in the opening by an adhesive tape or by one or more substrate tabs.

Description

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Claims

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Application Information

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Owner AVAGO TECH INT SALES PTE LTD
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