Heat conduction adhesive tape and heat conduction double-side adhesive tape

A double-sided tape and tape technology, applied in the direction of adhesives, film/sheet adhesives, adhesive additives, etc., can solve the problems of high temperature and insignificant heat effect, avoid excessive temperature and achieve good thermal conductivity. , the effect of uniform heat conduction

Active Publication Date: 2016-12-07
HUNAN PROVINCE PURUIDA INTERIOR MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This technology helps keep things cool during operation at very hot temperatures while also allowing for more efficient use of space within an electronics package. By placing certain types of materials (thermoplastic or metal) along one side with tiny holes called pads made up of carbon fibers), this material allows for good conduction of heat without burning any parts inside them. A special type of pad known as a heat sink is placed near these small spaces where there are other components like transistors. These techniques help improve performance and efficiency over time.

Problems solved by technology

This patented describes how adding layers or pads made up of special material called thermoconductor (TC) improves the ability to transfer heat effectively without causing damage during use.

Method used

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  • Heat conduction adhesive tape and heat conduction double-side adhesive tape
  • Heat conduction adhesive tape and heat conduction double-side adhesive tape
  • Heat conduction adhesive tape and heat conduction double-side adhesive tape

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Embodiment Construction

[0021] The present invention will be further described below with reference to the drawings and embodiments.

[0022] See also figure 1 with figure 2 ,among them, figure 1 Is a perspective view of the thermally conductive adhesive tape of the present invention; figure 2 for figure 1 A cross-sectional view of line A-A shown in. The present invention provides a thermally conductive adhesive tape 100 for the connection between electronic components in electronic devices, which includes a first release paper 110, a first adhesive layer 120, a first ceramic powder 130, a substrate layer 140, The first heat dissipation layer 150, the first thermal conductive graphite patch 160 and the first heat sensitive layer 170. The first adhesive layer 110 and the base layer 140 are arranged directly oppositely and spaced apart. The number of the first thermally conductive graphite patch 160 is two, and the two first thermally conductive graphite patches 160, the first adhesive layer 120 and the b

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Abstract

The invention provides a heat conduction adhesive tape. The heat conduction adhesive tape is used for connecting electronic assemblies of electronic devices. The heat conduction adhesive tape comprises a first stripping paper, a first adhering layer, a first ceramic powder, a substrate layer and two heat conduction graphite patches, wherein the heat conduction graphite patches are respectively arranged at the two sides of the substrate layer along the width direction; the two heat conduction graphite patches, and the opposite first adhering layer and substrate layer at interval form an accommodation space; the first ceramic powder is accommodated into the first accommodation space; the first stripping paper is adhered onto the outer surface of the first adhering layer. The heat conduction adhesive tape and a heat conduction double-side adhesive tape have the advantage that the heat can be conducted in the width direction of the adhesive tape.

Description

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Claims

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Application Information

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Owner HUNAN PROVINCE PURUIDA INTERIOR MATERIAL CO LTD
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