Adhesive film backboard integrated packaging material and processing technology thereof

The invention provides a processing technology of an adhesive film backboard integrated packaging material. The processing technology comprises the following steps: a backboard layer is provided, wherein the backboard layer comprises a structure enhancement layer and a weather-proof layer, and the structure enhancement layer and the weather-proof layer are bonded through an adhesive; materials aremixed, melted and subjected to tape casting, and the adhesive film layer is obtained, wherein the material comprises the following components: 90 to 100 parts of modified EVA resin, 0.3 to 1.5 partsof a cross-linking agent, 0.4 to 2.0 parts of an auxiliary cross-linking agent, 0.4 to 2.0 parts of a coupling agent, 0.01 to 1.0 part of an ultraviolet absorbent, 0.01 to 1.0 part of an antioxidant,0.01 to 1.0 part of a light stabilizer and 0 to 15 parts of titanium dioxide; the backboard layer and the adhesive film layer are compounded and formed, so that the structure enhancement layer and theadhesive film layer are bonded in a thermal compounding mode; and after cooling, drawing and rolling, the adhesive film backboard integrated packaging material is obtained. The invention also provides an adhesive film backboard integrated packaging material. The adhesive film backboard integrated packaging material provided by the invention has relatively good bonding performance.