10 results about "Resin adhesive" patented technology

The invention discloses bamboo plywood and a preparing method thereof, and belongs to the field of building materials. The method comprises the steps that according to weight parts, raw materials are obtained, the phenolic resin 2124, polyvinyl alcohol, nonylphenol polyoxyethylene ether and a diluent are stirred and mixed, a phenolic resin adhesive is obtained, then a filter cake is placed in the phenolic resin adhesive for gum dipping and dried, gum-dipped bamboo skin is obtained, the gum-dipped bamboo skin is placed in a hot press machine which uses steam as a hot source, a blank is obtained by pressing, the blank is cooled, and the bamboo plywood is obtained. The bamboo plywood and the preparing method thereof have the beneficial effects that the bamboo plywood has good glue strength, after being used, the bamboo plywood is not prone to warping, deforming or degumming, and the bamboo plywood is worthy of being used and promoted.

The invention relates to a friction coating with a light-emitting early-warning function and a preparation method of the friction coating. According to the invention, firstly, a ball milling and stirring process is adopted to prepare composite friction powder with different proportions such as oxide, graphene, fluorescent powder with different colors and the like, and luminous powder with different colors are mixed in conventional friction powder; then the composite powder is uniformly mixed with an epoxy resin adhesive and a film forming agent by using an ultrasonic dispersion technology, sothat the composite friction powder can have a good film forming effect on the surface of a metal matrix; and finally, a material containing the composite friction powder uniformly forms a film on thesurface of the matrix by utilizing a spin coating method, and the thickness and quality of the film forming are controllable. The method is simple and rapid in preparation, is low in cost, and is suitable for large-area production.

The invention provides application of a waste artificial board in covering wood, a method for preparing the covering wood from the waste urea-formaldehyde resin adhesive artificial board and the covering wood, and belongs to the technical field of waste utilization. The waste urea-formaldehyde resin adhesive artificial board is used as a raw material, belongs to a B-type waste wood material, has no recycling value, is used for preparing the covering wood, is wide in raw material source, low in price, simple in processing technology and low in energy consumption, can realize harmless and resourceful treatment of the waste urea-formaldehyde resin adhesive artificial board, and is wide in product application range. The prepared covering wood is free of biological poison and metal poison to plants, not only is high in water absorption rate and strong in covering function, but also has the effect of slowly releasing nitrogen fertilizer.

The invention discloses an integrated circuit, which comprises a circuit substrate body. A chip is bonded to the top of the circuit substrate body. A square groove is formed in the top of the circuitsubstrate body. The inner surface of the square groove is bonded to the outer surface of the chip. A glue absorption soft board is fixedly connected to the bottom of an inner cavity of the square groove, and the top of the glue absorption soft board is bonded to the bottom of the chip. The invention relates to the technical field of integrated circuits. According to the integrated circuit and themanufacturing method thereof, the square groove is arranged, the glue absorption soft board is arranged at the bottom of the inner cavity of the square groove and coated with epoxy resin glue, epoxy resin glue overflowing from the two sides of the chip is preliminarily absorbed through glue blocking grooves formed in the inclined bottoms of triangular glue blocking plates, and the redundant epoxyresin glue is further absorbed through L-shaped grooves. Therefore, the overall stability is enhanced, the epoxy resin glue cannot overflow even if the amount of the epoxy resin glue is not well controlled, and the workload for installing the chip on the circuit substrate body is greatly reduced.

The invention discloses polyurethane resin for a winding process, a resin/fiber composite material and a preparation method and application of the resin/fiber composite material, and belongs to the field of resin synthesis and composite material preparation. The preparation method comprises the following steps of: (1) preparing an epoxy-terminated carbamate mixture; (2) preparing a curing agent component; (3) mixing resin and a curing agent according to a certain proportion to prepare a sizing material, and putting the sizing material into a resin glue tank of winding equipment; (4) adopting winding equipment with an internal curing function to fully mix continuous fibers with resin through a glue tank and then wind the fibers on a mold according to a pre-designed direction and angle, andstarting a mold temperature controller connected with a mold core rod to heat the mold to a specified temperature, thus completing post-curing of the product; and (5) demoulding. The obtained resin sizing material has the advantages that the operable time is long, the mechanical property is good, a heating channel does not need to be additionally built, and a prepared composite material tower is high in flexibility.