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29 results about "Interconnection" patented technology

In telecommunications, interconnection is the physical linking of a carrier's network with equipment or facilities not belonging to that network. The term may refer to a connection between a carrier's facilities and the equipment belonging to its customer, or to a connection between two (or more) carriers.

Building blocks

InactiveUS20140106108A1Reducing local tensionImprove connectivityWallsLayered productsEngineeringInterconnection
A building block comprising a panel member having a forward panel surface and a rearward panel surface, and a peripheral skirt extending rearward from the rearward panel surface and defining a receptacle; wherein an interconnection means adapted for making sidewise locked interconnection with an adjacent building block having a complementary or counterpart interconnection means is formed on the peripheral shirt, the interconnection means being a female connection member or a male connection member complementary to the female member; wherein the female member is shaped or adapted to permit a male connection member of the adjacent building block to enter into sidewise locked interconnection by entering at the free end of the peripheral skirt which is distal from the panel member, to move towards the forward panel surface, and to stop before reaching the forward panel surface.
Owner:LIN TSZ CHUNG

Airport passenger registered luggage real-time tracking system and usage method

InactiveCN106327121AFlexible timeFlexible scheduleCo-operative working arrangementsNavigation instrumentsInformatizationMonitoring system
The invention provides an airport passenger registered luggage real-time tracking system. The airport passenger registered luggage real time tracking system is characterized by comprising a radio frequency label adhered to the passenger registered luggage, an identification and reading device, a background monitoring system, a database and a personal mobile terminal APP; the background monitoring system can realize functions of query, display, statistics and abnormal alarm on the registered luggage of the passenger; the database is used for storing information data of passengers and registered luggage thereof; the personal mobile terminal APP can realize real-time query and can display positions and state information of the registered luggage of the passengers, and can perform luggage abnormal state broadcasting through text information and a voice prompt; and the personal mobile terminal is in interconnection and intercommunication with an airport passenger registered luggage real time tracking system through an airport mobile communication network. The airport passenger registered luggage real time tracking system and the usage method use the informatization mean to manage and monitor the safety check and the transport state of the registered luggage, and can make the passenger quickly master the real-time position and state information of the registered luggage.
Owner:贾鹏

UWB radar signal simulator based on FPGA and UWB radar signal generation method

InactiveCN101576619ASimplify writingGuaranteed flexibilityWave based measurement systemsRadar waveformsPci interface
The invention relates to a UWB radar signal simulator based on FPGA, comprising a PC104 interface module, an RAM module, an FPGA module and a high-speed DAC module; the PC104 interface module completes data transmission with a host with PC104 mode by a PCI protocol; the RAM module adopts six ZBT-SRAMs with the bit width of 32 as data cache; the FPGA module adopts Virtex-4 series of product XC4VLX40 offered by Xilinx company and comprises a PCI interface control module, a RAM control module, a high-speed DAC control module and a radar waveform control module; the high-speed DAC control module selects AD9736 of ADI company; the interconnection of all the modules is realized by control modules in the FPGA module, the PC104 interface control module completes butting joint of the FPGA module and the PC104 interface module; data generated by controlling a host computer is transmitted to the inner part of the FPGA module from the PC 104 interface module; the RAM control module completes butting joint of the FPGA module and the RAM module so as to realize the transmission of data between the FPGA and the ZBT-SRAM; and the high-speed DAC control module completes butting joint of the FPGA module and the high-speed DAC module and controls the high-speed DAC module to generate various radar waveforms.
Owner:BEIHANG UNIV

Multi-target random fuzzy dynamic optimal energy flow modeling and solving method for multi-energy coupling transmission and distribution network

ActiveCN105703369ARealize comprehensive coordination and optimization of schedulingAc networks with different sources same frequencyElectric power systemEnergy coupling
The invention relates to a multi-target random fuzzy dynamic optimal energy flow modeling and solving method for a multi-energy coupling transmission and distribution network and belongs to the field of day-ahead scheduling plan research of electric power systems in an energy interconnection environment. The method comprises the following steps: basic data in a system scheduling period are obtained,; random fuzzy space-time sequence models for large-scale wind power, distributed power source and multi-energy loads are obtained via historical data mining; power and voltages of a power transmission network and all active distribution networks at joint nodes are used as share variables; multi-target SoS dynamic optimal energy flow models characterized by high economic performance, low carbon emission, renewable energy absorption, loss reduction and the like are built within static state security constraints; multi-energy source charge forecast can be realized through random fuzzy simulation; a Pareto solution set, an optimal compromise solution and an energy flow result can be obtained via adoption of an improved SoS layered optimizetion algorithm based on approximate dynamic programming and NSGA-11. The method can adapt to a development trend of energy interconnection, and comprehensive coordination optimization of day-ahead scheduling of transmission and distribution parties can be realized on the premise that requirements for static state safety and stabilization of systems can be satisfied.
Owner:马瑞

Multi-layer multi-chip fan-out structure and manufacturing method

ActiveCN103594451ALow costPackage Size OptimizationSemiconductor/solid-state device detailsSolid-state devicesSolder maskInterconnection
The invention provides a multi-layer multi-chip fan-out structure. The multi-layer multi-chip fan-out structure comprises a bearing plate, and a plurality of packaging sub bodies which are stacked are arranged on the bearing plate; at least one die is packaged into each packaging sub body; in each packaging sub body, the die is coated by a dielectric material of a dielectric layer, and the die is attached to a metal cushion block with the front face faces upwards; an RDL layer is arranged on the dielectric layer of each packaging sub body; a bonding pad of the front face of each die is electrically connected with the RDL layer of the corresponding packaging sub body where the die exists; insulating layers are arranged between adjacent packaging sub bodies, and the RDL layers of the adjacent packaging sub bodies are electrically connected through second interconnection holes between the layers. The metal cushion blocks in the bottom packaging sub bodies are pressed on the surface of the bearing plate, and the metal cushion blocks in the middle or top packaging sub bodies are pressed on the insulating layers of the packaging sub bodies; the surface of each top packaging sub body is provided with a solder mask layer in a distributed mode. According to the multi-layer multi-chip fan-out structure, three-dimensional multi-chip stacking can be easily achieved.
Owner:JIANGSU CAS MICROELECTRONICS INTEGRATION TECH CO LTD

Reconfigurable microprocessor hardware architecture

ActiveUS20170300333A1Reduce operational latencyEfficient programmingCAD circuit designArchitecture with single central processing unitSelf routingMemory interface
A reconfigurable, multi-core processor includes a plurality of memory blocks and programmable elements, including units for processing, memory interface, and on-chip cognitive data routing, all interconnected by a self-routing cognitive on-chip network. In embodiments, the processing units perform intrinsic operations in any order, and the self-routing network forms interconnections that allow the sequence of operations to be varied and both synchronous and asynchronous data to be transmitted as needed. A method for programming the processor includes partitioning an application into modules, determining whether the modules execute in series, program-driven parallel, or data-driven parallel, determining the data flow required between the modules, assigning hardware resources as needed, and automatically generating machine code for each module. In embodiments, a Time Field is added to the instruction format for all programming units that specifies the number of clock cycles for which only one instruction fetch and decode will be performed.
Owner:WANG XIAOLIN +1

General tester for testing different types of aviation products

ActiveCN106645812AEasy maintenanceRealize mobile operationElectrical testingMeasurement instrument housingAviationInterconnection
The invention relates to a general tester for testing different types of aviation products. The tester is composed of a detachable touch control display screen, a test cabinet, a mass interconnection device and an adapter. A hard connector in the back of the detachable touch control display screen is connected with a hard connector of a cabinet part, the cabinet part is connected and fixed via L-shaped buckles and quickly-detached screws, and after that the quickly-detached screws are opened and the display screen is dismounted, the display screen can be moved by only connecting a switching cable of the display screen and the cabinet part. When the adapter is connected to the test cabinet via the mass interconnection device and all cables are connected, the different types of products can be tested. The cabinet part is modularized in design, different panels can be mounted and dismounted rapidly, the rear panel is provided with a overturn panel, and an overturning function can be realized by connecting the rear panel and the overturn panel via a rotating shaft. The adapter installing handle is placed transversely, and the front panel of the adapter is connected to a frame via hinges to realize the overturning function.
Owner:AVIC LUOYANG PHOTOELECTRIC TECH CO LTD

Regional multi-microgrid dynamic networking method based on graph theory

InactiveCN107546773AImprove power supply reliabilityGood for the economySingle network parallel feeding arrangementsAlgorithmPower grid
The invention relates to a regional multi-microgrid dynamic networking method based on a graph theory. The regional multi-microgrid dynamic networking method is technically characterized by comprisingthe following steps that 1, according to a multi-objective function optimum in global economic operation and highest in system power supply reliability of an intra-regional multi-microgrid and presetconstraint conditions, an optimization model of a regional multi-microgrid is established; 2, a regional multi-microgrid dynamic networking model based on the graph theory is established by combiningwith network topology connection of a regional multi-microgrid system based on the regional multi-microgrid optimization model established in the step 1; 3, an improved particle swarm algorithm is adopted to solve the regional multi-microgrid dynamic networking model based on the graph theory, and dynamic networking of the regional multi-microgrid is achieved. By combining with interconnection and intercommunication characteristics of the regional multi-microgrid and power output constraint of the microgrid, the optimization model optimum in global economic operation and highest in system power supply reliability of the regional multi-microgrid is established, and a solution is provided for dynamic multi-microgrid networking in a regional range.
Owner:TIANJIN UNIV +1

Projection illuminating system

ActiveCN103470992AIncrease flexibilityMeet the needs of brightnessPoint-like light sourceElectric lightingProjection PrincipleControl system
The invention discloses a projection illuminating system which comprises a projection system, a control system and a reflection system, wherein the projection system is used for providing projection light of the projection illuminating system; the control system is used for controlling interconnection and communication between the systems; and the reflection system is used for converting the projection light emitted by the projection system into illuminating light in a specific range. According to the scheme disclosed by the invention, a projection principle is utilized to project basic light to the reflection system, a projection region is used as an illuminating light source and the reflected light is used for common illumination or special illumination. The projection illuminating system can provide the optimal flexibility for the illuminating environment and the high-efficiency light source and the projection system provide sufficient light utilizing efficiency for the projection illuminating system.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Method of fabricating semiconductor memory device and semiconductor memory device driver

Disclosed is a method of fabricating a semiconductor memory device including the step of irradiating ultraviolet rays on a metal interconnection at a bonding pad part, so that the metal interconnection can be prevented from being corroded because of a corrodent element in the process of erasing charges stored in a charge storage part. An oxide coating film is formed on the surface of the metal interconnection at the bonding pad part, and ultraviolet rays are irradiated onto the oxide coating film for erasing of charges from the floating gate.
Owner:MONTEREY RES LLC

Chip, chip interconnection system and method for calibrating chip interconnection

InactiveCN101334444ASimple technologyEasy to testDigital circuit testingComputer engineeringInterconnection
The invention discloses an interconnecting system for checking chips, which comprises a pre-chip and a post-chip which are interconnected, the pre-chip comprises a check sequence sending unit, the post-chip comprises a check sequence receiving unit, the check sequence sensing unit uses a plurality of single-bit data for generating a displacement check sequence, the data of the displacement check sequence is sequentially sent to the post-chip; the check sequence receiving unit uses the data in the displacement check sequence for generating a displacement comparison sequence, and the displacement comparison sequence is compared with the received displacement check sequence for obtaining a check result. The invention further discloses an interconnecting method for checking the chips and a chip, the check of the chip interconnection can be realized through the comparison of the check sequence and the comparison sequence, the technology is simple and practicable, and the test is convenient.
Owner:HUAWEI TECH CO LTD

Ultrahigh-frequency surface-mounted ceramic vertical interconnection structure and packaging structure

The invention provides an ultrahigh-frequency surface-mounted ceramic vertical interconnection structure and a packaging structure, belonging to the technical field of chip packaging microwave signal interconnection. The ultrahigh-frequency surface-mounted ceramic vertical interconnection structure comprises a ceramic medium, a front pin bonding pad, a back pin bonding pad and a similar coaxial structure, wherein the front pin bonding pad is arranged on the front surface of the ceramic medium, and a GND region is arranged around the front pin bonding pad; the back pin bonding pad is arranged on the back surface of the ceramic medium, and another GND region is arranged around the back pin bonding pad; the similar coaxial structure comprises a radio frequency signal vertical transition hole and a grounding vertical transition hole which are arranged in parallel; and the radio frequency signal vertical transition hole is arranged to be perpendicular to the ceramic front pin bonding pad. The packaging structure comprises the ultrahigh-frequency surface-mounted ceramic vertical interconnection structure. The ultrahigh-frequency surface-mounted ceramic vertical interconnection structure of the invention has the advantages that the vertical transmission performance of radio frequency can be improved, and the transmission of DC-40GHz broadband high-frequency signals can be realized between ceramics; and the structure is a vertical interconnection structure, good vertical transmission of radio frequency signals can be realized within 40 GHz, and return loss S11 and S22 are superior to -10 dB.
Owner:THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP

Multi-section sleeving-type security sensor

ActiveCN104833382AAvoid destructionMeasurement apparatus componentsInterconnectionCooperative work
The invention relates to a multi-section sleeving-type security sensor. The multi-section sleeving-type security sensor is formed by at least two sections of sleeving assemblies which are connected end-to-end in a plug-in manner. Each section of sleeving assembly comprises a cylindrical housing, a rotating disk, a rotating disk cover, a rotating disk seat and a PCB circuit board. In assembling, the PCB circuit board is inserted into rib positions on the inner side surface of the cylindrical wall of the cylindrical housing. The rotating disk is arranged in a stepped annular chamber in the inner circle of the rotating cover in a tightly matched manner. The rotating disk seat and the rotating disk cover are mutually fixed in a buckled manner. The rotating disk, the rotating disk cover and the rotating disk seat are all connected to an opening position of the cylindrical housing. Rotating disk wiring grooves are correspondingly and electrically connected with the PCB circuit board and wiring terminals through connecting wires. When the two sections of sleeving assemblies are connected in the plug-in manner, the cylindrical housing of one sleeving assembly is clamped into assembling through grooves corresponding to the rotating disk of the other sleeving assembly through buckling positions on a base plate, and end-to-end clamping is formed. In this way, the multi-section sleeving-type security sensor has the characteristics that end-to-end mutual plugging connection is realized, interconnection and cooperative work of buses are achieved, and plugging interchange is available according to actual requirements.
Owner:INNOPRO TECH CO LTD

Switch cabinet rapid assembly fixture

ActiveCN109048735AReasonable designAvoid inconvenienceWelding/cutting auxillary devicesWork holdersInterconnectionEngineering
The invention discloses a switch cabinet rapid assembly fixture. The switch cabinet rapid assembly fixture comprises a strip-type guide rail, bearing strip plates, hydraulic push rods, supporting square blocks, T-shaped sliding grooves, long bolts, T-shaped sliding blocks, first motors, first U-shaped plates, second U-shaped plates, second motors, first pneumatic push rods, electric push rods, a cross-shaped plate, a cross-shaped sliding hole, first clamping plates, strip-type steel plates, an I-shaped supporting plate, conveying belts, U-shaped strip frames, second pneumatic push rods, bearings, round rods, strip-type penetrating holes, second clamping plates, pulling plates, bearing seats, horizontal plates, micro motors, gears, circular tubes and threaded rods. The switch cabinet rapidassembly fixture has reasonable design, corresponding framework of a switch cabinet is erected conveniently in a three-dimensional distributed mode, the inconvenience of placing and distributing of switch cabinet framework plates during assembling is overcome, the switch cabinet rapid assembly fixture has the function of orderly and correctly assembling the switch cabinet framework plates used forseamed edge interconnection, facilitates performing rapid bolted connection or welding by an operator, and is suitable for rapid assembling of switch cabinet frameworks with different specifications,and the working efficiency is improved.
Owner:上电电气(江苏)有限公司

Multilayer interposer with high bonding strength

Disclosed is a multilayer interposer with high bonding strength, which is used in wafer testing. The multilayer interposer with high bonding strength comprises a plurality of thin-film layer structures overlapping sequentially. One of the thin-film layer structures comprises at least one first conductive blind via. An interconnection layer electrically connected to the first conductive blind via is configured on the surface of the one of the thin-film layer structures, and the interconnection layer comprises at least one head portion. Another one of the thin-film layer structures comprises at least one second conductive blind via. The bottom of the second conductive blind via contacts both of the corresponding head portion and part of the surface of the one of the thin-film layer structures. Thereby, the bonding strength between layers can be dramatically increased, and the resistance to the thermal shock can be also increased.
Owner:CHUNGHWA PRECISION TEST TECH

Duplexer

InactiveCN107276555AMultiple-port networksInterconnectionDuplexer
The invention discloses a duplexer, which comprises a piezoelectric substrate and an electrode structure formed on the piezoelectric substrate. The electrode structure includes a transmitting pad, a receiving pad, a ground wire electrode pad, a signal wiring electrode, An annular pad and an interconnection line, the piezoelectric substrate is provided with a transmitting filter and a receiving filter, the transmitting pad is connected to the transmitting filter through a connecting line, and the receiving pad is connected to the receiving filter through a connecting line , the ground electrode pad is connected to the ground potential, the annular pad wraps the transmitting pad and the receiving pad, the ground electrode pad is connected to the ring pad through an interconnection wire, and the ring pad is connected to the ring pad through an interconnection wire The signal wiring electrode is connected to the transmitting pad and the receiving pad, and the signal wiring electrode is connected to the transmitting pad, thereby improving the isolation effect of the duplexer.
Owner:CHENGDU FUYOUTE TECH CO LTD

Multifunctional mobile phone interface conversion method and equipment thereof

InactiveCN110290264ASolve the problem of compatible transferSolve resource problemsSubstations coupling interface circuitsTelephone set constructionsControl signalComputer module
The invention discloses a multifunctional mobile phone interface conversion method and equipment thereof. The method comprises the following steps: connecting a mobile communication device with a pre-configured output interface; enabling the application program in the mobile communication device to transmit the control signal to the signal processing module through the output interface; enabling the signal processing module to receive a control signal output by the mobile communication device through the output interface; enabling the signal processing module to receive an input signal of the USB interface and perform signal processing conversion to form a processing signal; and using the signal processing module for detecting, identifying and pairing the processed signal and the control signal to realize interconnection with the mobile communication device. The beneficial effects are that by expanding different joint types, the problem of compatible switching between the USB interface and other various standard interfaces is solved, the function of being compatible with various types of data lines in the market is realized, and the problems of resource waste and environmental pollution caused by the fact that an existing data line is single and cannot be converted and used in a diversified manner are solved.
Owner:重庆安连普电子有限公司
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