The invention discloses an organic
silicon electronic
potting adhesive for a PCB circuit board with stable
dielectric insulation performance. The organic
silicon electronic
potting adhesive is prepared from the following raw materials in parts by weight: 40 to 50 parts of vinyl-terminated
silicone oil-1, 50 to 60 parts of vinyl-terminated
silicone oil-2, 0.38 to 0.5 part of 12% of a
platinum catalyst, 0.02 to 0.04 part of acetenyl
cyclohexanol, 25 to 30 parts of vinyl
silicon resin, 14.8 to 16.8 parts of 1-allyloxy-2,3-epoxypropane, 23 to 25 parts of 1,3,5,7-tetramethyl cyclotetrasiloxane, 2.7 to 3.6 parts of a
silane coupling agent A171, an appropriate amount of silicon-containing silicon oil, 2.6 to 3 parts of
mica powder, 1.8 to 3 parts of porcelain
powder, 0.2 to 0.3 part of dimethyl
silicone polymer, 4.6 to 5 parts of carboxylated latex, 1.1 to 1.6 parts of
polyvinyl alcohol and an appropriate amount of deionized water. The
potting adhesive disclosed by the invention has
high heat conduction,
dielectric insulation,
impact resistance and adhesive performance, is high in fluidity, and is extremely suitable for potting electronic products.