Organosilicon composition and preparation method thereof

A composition and silicone technology, applied in the field of silicone, can solve problems such as strong adhesion, unsatisfactory use effect, and insufficient strength, and achieve the effect of high fluidity and good storage stability

Inactive Publication Date: 2017-12-08
ZHONGKAI UNIV OF AGRI & ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Liquid crystal module device protection materials are generally required to have good insulation performance, heat resistance and aging resistance. At present, moisture-proof protective film is often used, such as blue glue, which is mainly made of thermoplastic elastomer SEBS (styr

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example

[0027] Preparation Example 1

[0028] The preparation process of the organosilicon composition of the present invention includes the following steps:

[0029] S1. Preparation of the base material: 150g of α,ω-dihydroxypolydimethylsiloxane with 20000 cPs, 75g of α,ω-dihydroxypolydimethylsiloxane with 50000 cPs, and end-capped α,ω- with 33000cPs Dihydroxy dimethicone 225g, 500cPs α,ω-dihydroxy dimethicone 10g and white carbon black 26.8g mixed well, then add 12g black paste, continue to mix until uniform, then put it into the planetary machine Evacuate air bubbles for 60 minutes, vacuumize for 15 minutes, add 300 g of volatile silicone oil and stir for 30 minutes after maintaining pressure;

[0030] S2. Preparation of the organosilicon composition: adding the matrix material prepared in S1 to 2% trimethoxysilane by weight of the matrix material prepared in S1 and 1% by weight of the matrix material prepared in S1. Butyl ester, mixed evenly under the isolation of air, ready to be obtain

Example

[0031] Preparation Example 2

[0032] The preparation process of the organosilicon composition of the present invention includes the following steps:

[0033] S1. Preparation of the base material: 150g of α,ω-dihydroxypolydimethylsiloxane with 20000 cPs, 75g of α,ω-dihydroxypolydimethylsiloxane with 50000 cPs, and end-capped α,ω- with 33000cPs Dihydroxy dimethicone 225g, 500cPs α,ω-dihydroxy dimethicone 10g and white carbon black 214.4g are mixed uniformly, then add 12g black paste, continue to mix until uniform, then put it into the planetary machine Evacuate air bubbles for 60 minutes, vacuum for 15 minutes, add 600g of volatile silicone oil, and stir for 30 minutes after maintaining pressure;

[0034] S2. Preparation of the organosilicon composition: adding the matrix material prepared in S1 to 8% trimethoxysilane by weight of the matrix material prepared in S1 and 3% by weight of the matrix material prepared in S1 tetrabutyl titanate , Mix uniformly under isolation of air, and ge

Example

[0035] Preparation Example 3

[0036] The preparation process of the organosilicon composition of the present invention includes the following steps:

[0037] S1. Preparation of the base material: 150g of α,ω-dihydroxypolydimethylsiloxane with 20000 cPs, 75g of α,ω-dihydroxypolydimethylsiloxane with 50000 cPs, and end-capped α,ω- with 33000cPs Dihydroxy polydimethylsiloxane 225g, 500cPs α,ω-dihydroxy polydimethylsiloxane 10g and white carbon black 110g are mixed uniformly, then add 12g black paste, continue to mix until uniform, and then put it into the planetary machine Evacuate air bubbles for 60 minutes, vacuum for 15 minutes, add 600g of volatile silicone oil and stir for 30 minutes after maintaining pressure;

[0038] S2. Preparation of the organosilicon composition: adding the base material prepared in S1 to 4.46% trimethoxysilane by weight of the base material prepared in S1 and 3% tetrabutyl titanate by weight of the base material prepared in S1 , Mix uniformly under isolatio

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PUM

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Abstract

The invention relates to the field of organosilicon, in particular to an organosilicon composition and a preparation method thereof. The organosilicon composition is prepared by curing catalysis of the following components in parts by weight: 150 parts of 20,000cPs alpha, omega-dihydroxy polydimethyl siloxane, 75 parts of 50,000cPs alpha, omega-dihydroxy polydimethyl siloxane, 225 parts of 33,000cPs hydroxyl-terminated alpha, omega-dihydroxy polydimethyl siloxane, 10 to 40 parts by weight of 500cPs alpha, omega-dihydroxy polydimethyl siloxane, 300 to 600 parts of a solvent, 26.8 to 214.4 parts of a reinforcing filler and 12 parts of pigment. The preparation method comprises the steps of preparation of a matrix material and preparation of the organosilicon composition. The organosilicon composition has the advantages of good storage stability, strippable property, flowability and higher strength and is a better protecting material for a liquid crystal module device.

Description

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Claims

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Application Information

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Owner ZHONGKAI UNIV OF AGRI & ENG
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