Epoxy resin composition and prepreg and printed circuit board made therefrom

一种环氧树脂、组合物的技术，应用在印刷电路零部件、电路基板材料、化学仪器和方法等方向，能够解决加工成本高等问题

Active Publication Date: 2011-11-30
TAIWAN POWDER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The method of reducing the dielectric constant in the prior art is to fill the resin of the prepreg of the printed circuit board with an inorganic filler to reduce the dielectric constant of the prepreg or laminate, such as US Patent No. 4798762 No. glass beads are used as inorganic fillers, which have a significant effect on reducing the dielectric constant, or refer to Taiwan Patent No. 1264446, which uses processed multi-honeycomb polymeric microspheres as the filling of cured polymer resin additives to lower the dielectric constant of prepregs, laminates or printed circuit boards, but the materials are more expensive to process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] With the epoxy resin (brand Hexion1134) of 100 parts by weight of brominated bisphenol A novolac epoxy as the main component, the diaminodiphenyl sulfone (DDS) of 20 parts by weight, the trimanganese tetraoxide (factory) of 1 part by weight brand Unigue Enterprise), 30 parts by weight of silicon dioxide (brand name Pauline 925), 0.5 parts by weight of boron trifluoride-ethylamine complex (brand name Hashimoto) and 0.3 parts by weight of silane coupling agent (brand name Dow Corning Z-6040), mixed with a stirrer for 60 minutes at room temperature, and then added 60 parts by weight of methyl ethyl ketone. After the above materials were stirred at room temperature for 120 minutes, an epoxy resin composition varnish was formed.

Embodiment 2

[0038] With the epoxy resin (brand name Changchun CCP 330) of the o-cresol novolac type of phosphorus (DOPO) of 100 weight parts as the main component, the diaminodiphenyl sulfone of 18 weight parts, the trimanganese tetraoxide of 1 weight part, 30 parts by weight of silicon dioxide, 0.5 parts by weight of boron trifluoride-ethylamine complex and 0.3 parts by weight of silane coupling agent were mixed at room temperature for 60 minutes using a stirrer, and then 60 parts by weight of methyl ethyl ketone was added. After the above materials were stirred at room temperature for 120 minutes, an epoxy resin composition varnish was formed.

Embodiment 3

[0040] The epoxy resin (brand name Kolon8100) of 50 parts by weight of bisphenol F type novolac epoxy resin as main component, the orthocresol type epoxy resin of 50 parts by weight of phosphorus (DOPO) as main component , 20 parts by weight of diaminodiphenyl sulfone, 1 part by weight of trimanganese tetraoxide, 30 parts by weight of silicon dioxide, 0.5 parts by weight of boron trifluoride-ethylamine complex and 0.3 parts by weight of silane The mixture was mixed with a stirrer for 60 minutes at room temperature, and then 60 parts by weight of methyl ethyl ketone was added. After the above materials were stirred at room temperature for 120 minutes, an epoxy resin composition varnish was formed.

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PUM

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Abstract

The invention relates to an epoxy resin composition which comprises (a) epoxy resin; (b) a hardening agent; and (c) manganese oxide used as inorganic filler.

Description

technical field [0001] The present invention relates to a kind of epoxy resin composition, especially a kind of epoxy resin composition and prepreg (Prepreg) and printed circuit board made of it, and this prepreg and this printed circuit board have low Dielectric constant (Dielectric constant, Dk) and low dissipation factor (Dissipation Factor, Df). Background technique [0002] In recent years, electronic products tend to be light, thin, short, and small, and are transmitted at high frequencies, so that the wiring of printed circuit boards must be high-density to increase transmission speed, but at the same time, signal integrity must be maintained. However, this high-density wiring method will have some negative effects on electronic products, such as signal delay and signal transmission loss. In the past, the general substrate material was mainly thermosetting epoxy resin, but the dielectric constant and dissipation factor of thermosetting epoxy resin are relatively high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08K13/02C08K3/22C08J5/24H05K1/03B32B15/092
Inventor 陈宪德
Owner TAIWAN POWDER TECH CO LTD
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