36 results about "Copper foil" patented technology

The invention belongs to a material used for preparing printed circuit board, more specifically a resin combination and a prepreg used for preparing the printed circuit board. The resin combination uses phenoxy resin, epoxy resin composition, epoxy thinner, amine curing agent, imidazole enhancer and solvent as materials and is prepared in accordance with a certain weight, then the resin combination solution is immersed in glass fiber cloth to make the prepreg. Non-flowing character and the wetting quality of the glass fiber cloth are improved because of the excellent formula of the resin combination, thereby the prepreg used for the printed circuit board has a better non-flowing character, and moisturizing capability, heat resistance, flame retardant, high connectivity with copper foil, and provides high performance material for the printed circuit board product which has a special structure and flexibility-combines with steel.

The invention discloses a lead-free copper-clad laminate manufacturing method, which comprises: (1), preparing a glue solution by mixing a brominated epoxy resin, a phenol formaldehyde curing agent, a toughening agent, dimethylimidazole and ethanediyl methoxy methyl ethyl acetate according to weight portion; (2), spreading glue by soaking glass fiber cloth in the glue solution prepared in the step (1) in a glue basin of a glue spreading machine; (3), making a prepregs by placing the glass fiber impregnated with the glue solution in the step (2) in an oven of the glue spreading machine; (4) covering copper foil layers by laminating the prepregs made in the step (3) and covering copper foil layers on the surfaces of the utmost two layers after lamination; and (5) pressing by placing the composite laminate made in the step (4) in a vacuum press for pressing. The copper-clad laminate made by the method has high Tg, toughness and heat resistant and can meet the requirement for lead-free manufacturing. In addition, due to the high toughness, the copper-clad laminate is insusceptible to delamination during punching and V cutting after the lead-free manufacturing of a PCB.

The invention discloses a process for pressing galvanized PCB boards. The process comprises the following steps of: the first pressing step, after sequentially covering a bonding sheet, a copper foil and an elastic pad on a core board assembly to be pressed, pressing the core board assembly under the high-temperature and high-pressure condition, and pressing the bonding sheet into grooves among copper foil lines on the surface of the core board assembly; the copper removing step, after detaching the silica gel pad, removing the overlaid copper foil to expose the cured bonding sheet; and the second pressing step, after covering another bonding sheet on the semi-finished product of which an insulating sheet is removed, pressing the bonding sheet and the core board assembly to be pressed with the bonding sheet under the high-temperature and high-pressure condition. The invention also discloses a corresponding multi-layer PCB board. The invention can effectively prevent the gel shortage problem due to the excessive thickness of inner-layer copper foil lines after pressing and various quality problems caused by gel shortage, and avoids the waste of processing resources in subsequent procedures as a result of gel shortage.

The invention relates to a manufacturing process of a graphene transparent conductive film. The manufacturing method includes the steps of 1), uncoiling a copper foil in a vacuum chamber, heating a copper-clad chemical deposition reaction zone by using a resistor, feeding in methane gas and hydrogen, subjecting a copper-clad surface to chemical sedimentation to generate a graphene layer, and then adopting plasma to perform etching processing on the graphene layer; 2), adopting a gravure printing process to obtain an oxidize graphene layer; 3), obtaining an oxide graphene film; 4), coating a copper chloride etching solution which is 200g/L in concentration on a copper-clad face of the oxidize graphene film; 5), subjecting the oxidize graphene film to thermal annealing and reduction; 6), coating resin adhesive, sticking the film for packaging, and finally obtaining the patterned graphene transparent conductive film. The manufacturing process is short in film forming time, and low-cost and large-scale mass manufacturing can be realized; the graphene transparent conduction film is high in electric conductivity, good in flexibility, high in pattern definition, higher in acid and alkali resistance of the transparent conductive film and lower in cost.

The invention relates to the technical field of circuit board production, in particular to a multilayer printed circuit board and a preparation method thereof. The multilayer printed circuit board comprises two outer layer boards and prepregs, wherein the two outer layer boards are integrally pressed through the prepregs; an inner layer route pattern is arranged on one surface of each outer layer board, and a baseplate with an outer layer route pattern is arranged on the other surface of each outer layer board; the multilayer printed circuit board is prepared from the procedures of board cutting, inner layer pattern transferring, pressing, outer layer pattern transferring and the like in sequence. By the adoption of the outer layer boards with the inner layer patterns on one surfaces and integral copper-clad surfaces on the other surfaces to form an outer layer copper foil of the multilayer printed circuit board, the media between the outer layer copper foil and a secondary outer layer copper foil are uniform in thickness, the influence of the media on the outer layer of the multilayer printed circuit board on the impedance can be steadily controlled, and uniformity of the impedance in different regions of the same large board is improved; the structural features of the multilayer printed circuit board are matched with the specific pressing process parameters to reduce the swell-shrink characteristic of the multilayer printed circuit board.

Disclosed are copper foil or net comprising a Cu-nitrile compound complex formed on the surface thereof, a method for preparing the same, and a lithium secondary battery that comprises an electrode using the same copper foil or net as a collector. The lithium secondary battery, which uses a copper collector comprising a Cu-nitrile compound complex formed on the surface thereof through the application of a certain voltage level, can prevent the corrosion of Cu occurring at a voltage of 3.6V or higher under overdischarge conditions away from the normal drive condition, and thus can significantly improve the capacity restorability after overdischarge.

The embodiment of the invention discloses a ceramic PCB manufacturing method through metal line filling. The ceramic PCB manufacturing method comprises the following steps of (1) pattern transferring; (2) pattern electroplating; (3) film stripping; (4) fitting; (5) sintering; and (6) surface treatment. According to the ceramic PCB manufacturing method through metal line filling, etching is not required in line preparation, a metal line with high thickness range and high precision can be obtained, and the metal line can be a copper foil line or a nickel foil line so that a ceramic substrate with the copper foil line or the nickel foil line can be used for welding of LED lamp beads and wiring. Besides, the ceramic PCB manufacturing method through metal line filling has advantages of being simple in technology, relatively low in cost and relatively high in reliability.

The invention relates to a graphene optical fiber sensor and a preparation method and application thereof. The graphene optical fiber sensor comprises a photonic crystal optical fiber and two monomodeoptical fibers, wherein both ends of the photonic crystal optical fiber are respectively coupled with the monomode optical fibers, and optical fiber thick cones with expanded waists are respectivelyformed at two coupling points; a graphene layer is coated at the surface of the photonic crystal optical fiber. The preparation method comprises the following steps of preparing a graphene and PMMA (polymethyl methacrylate) composite film on a copper foil; transferring the composite film to the surface of the photonic crystal optical fiber by a copper dissolving method; removing the PMMA out of the composite film which is transferred to the surface of the photonic crystal optical fiber, and calcining, so as to obtain the graphene optical fiber composite material; respectively coupling the twoends of the graphene optical fiber composite material and the two monomode optical fibers by an optical fiber melting machine, and respectively forming the optical fiber thick cones with expanded waists at the two coupling points, so as to obtain the graphene optical fiber sensor. The graphene optical fiber sensor can be used as a reflectivity sensor, and be effectively applied to detect the concentrations of matters of hydrogen sulfide gas, sugarcane and the like.

Disclosed is a method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method comprises pre-routing a portion of an adhesive meeting the optical waveguide to remove said portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad.

The present invention relates to a method for producing an electrolytic copper foil, the method enabling providing an electrolytic copper foil such that the electrical conductivity is 99% or more, thethickness is 10 [mu]m or less, a problem of a bend is suppressed, the front side and the rear side are flat, the tensile strength is 500 MPa or more, and the elongation percentage is 5.5% or more. The method for producing an electrolytic copper foil includes forming an electrolytic copper foil by using, as an electrolytic solution, a sulfuric acid-copper sulfate aqueous solution not containing aheavy metal other than a copper metal, using an insoluble anode and a cathode drum facing the insoluble anode, and passing a direct current between these electrodes, wherein, in the electrolytic solution, particular additives (A) to (E) are contained each in a particular amount, and the additive (D) and the additive (A) are each added in a ratio such that (D)/(A) is 0.2 to 0.7.

The invention belongs to the technical field of lubricants, and relates to a functional rolling liquid of water-based nano Cu and a preparation method of the functional rolling liquid. The functional rolling liquid is used for lubricating a rolled copper foil in a rough rolling process. The preparation method comprises the following steps: by taking nano Cu with good anti-corrosion and anti-rusting performance as an extreme pressure agent and taking methylbenzene, polyethylene glycol and sodium dodecyl benzene sulfonate as a dispersing agent, sequentially adding deionized water, the sodium dodecyl benzene sulfonate, the methylbenzene, the polyethylene glycol, triethanolamine, oleic acid, aniline and mercapto-1,3,4-thiazole and putting into a reaction kettle at a revolving speed of 80 to 120 revolutions per minute, heating and stirring, adding the nano Cu when a temperature reaches 70 DEG C to 80 DEG C, carrying out heat preservation and further stirring for 45 to 60 minutes, then stopping the heating and further stirring until reaching a room temperature so as to obtain a turbid suspension liquid in red brown, namely, a required water-based rolling liquid. As the water-based rolling liquid is used, the pollution caused by the traditional cold-rolling emulsified oil is reduced, and the slow-release anti-rusting performance of a rolled copper plate/strip can be obviously improved. Thus, the rolled copper plate/strip is good in surface quality and long in anti-corrosion period.

The invention is applicable to the technical field of circuit boards, and provides a method for manufacturing a circuit of a circuit board through laser etching, which comprises the following steps of: pressing conductive copper foil on a base material to form a copper-clad plate; performing laser etching on the copper-clad plate by using a laser engraving machine, laminating the conductive copper foil to form a conductive copper layer, etching a groove on the conductive copper layer, and reserving the conductive copper layer with a certain thickness at the bottom of the groove; putting the copper-clad plate subjected to laser etching into a vacuum two-fluid etching device, and etching the conductive copper layer to form a circuit interval; performing laser etching by using a laser engraving machine to form a groove with a fine circuit on the conductive copper layer; and carrying out etching through a vacuum two-fluid etching device, so that the residual conductive copper layer in the groove can be etched to form a circuit interval, and a required circuit pattern is completed. Through the preparation method, the processes of film manufacturing, photosensitive film pasting, exposure and development, electroplating, film stripping and the like are reduced; therefore, the circuit board has the characteristics of simple preparation process flow, less material consumption and short production period.

The invention relates to an FPC film for an LED lamp strip and a preparation method thereof. According to the FPC film for an LED lamp strip, the FPC film is a single-sided film, including a high temperature resistant PET film, a hot melt adhesive layer and a protective film, wherein the hot melt adhesive layer is coated on one side of the high temperature resistant PET film, and the protective film covers the hot melt adhesive layer; or the FPC film is a double-sided film, including a high temperature resistant PET film, a hot melt adhesive layer and a protective film, wherein the hot melt adhesive layer is coated on two sides of the high temperature resistant PET film, and the protective film covers the hot melt adhesive layer. By using the high temperature resistant PET as a substrate of the novel FPC film, production cost can be effectively reduced. Meanwhile, by using the hot melt adhesive of the modified epoxy system, the novel FPC film has strong adhesion to a copper foil, has excellent temperature resistance and flexibility, and can be applied to the production of LED lamp strips through a simple process.

The invention relates to a pair-twist shielding instrument cable for a flame-retardant fireproof boat and a manufacturing method thereof. Flame-retardant fireproof ethylene propylene rubber insulating layers are extruded on the peripheries of stranded copper conductors in a wrapping way to form insulated cores; the insulated cores are stranded in pairs to form pair-twist wire pairs; gaps of the pair-twist wire pairs are filled with flame-retardant non-absorbent fiber fillers; the periphery of each group of pair-twist wire pairs is wrapped in a copper foil polyester composite belt shielding layer to form a pair-twist group; the copper foil surfaces of the copper foil polyester composite belt shielding layers are inward and tinned stranded copper-wire drainage wires are arranged inside the copper foil polyester composite belt shielding layers; a plurality of groups of pair-twist wire pairs are stranded to form a cable core; and the periphery of the cable core is sequentially coated with a low-intensity non-woven fabric longitudinally-covered layer, an inner jacket, an armor braid and an outer jacket sequentially from inside out. The low-intensity non-woven fabric longitudinally-covered layer is completely in fit with each insulated core in shape, so that gaps between the low-intensity non-woven fabric longitudinally-covered layer and the insulated cores are eliminated, and flame can be conveniently prevented from being spread inwards; and meanwhile, the inner jacket and the insulated cores are guaranteed not to be adhered, so that the insulated cores are not damaged when the jacket is stripped in the constructing process.

The invention discloses a ceramic support for pre-oxidating a copper sheet. The ceramic support comprises a ceramic sheet body and copper foils; ceramic bending parts are arranged at two ends of the ceramic sheet body; the copper foils are attached to the inner surfaces of the ceramic sheet body and the ceramic bending parts; the central lines of the copper foils are coincided with the folding marks of the connecting parts of the ceramic sheet body and the ceramic bending parts; the ceramic bending parts are vertical to the ceramic sheet body. The ceramic sheet body and the ceramic bending parts are 0.635mm thick; the copper foils are 0.1-0.4mm thick. According to the ceramic support for pre-oxidating the ceramic sheet, the copper sheet is directly placed on the support to be oxidated instead of being placed on a conveyor belt to be pre-oxidated with one surface, so a certain dangling degree exists between the copper sheet and the conveyor belt, the smooth flowing of oxygen is ensured, and double surfaces of the copper sheet are uniformly oxidated. The surface grain state after the product is sintered is improved, and the roughness is uniform. According to the ceramic support for pre-oxidating the copper sheet, the ceramic sheet made of Al2O3 and the copper foils are adopted as the making material of a jig which is made with a DBC (Direct Bonding Copper) method, and the jig is simple in structure and durable.

Disclosed is a surface-treated copper foil, which exhibits excellent weldability when copper foils or a copper foil and an other metal are welded with each other by ultrasonic welding. Specifically disclosed is a surface-treated copper foil which is characterized in that an organic antirust coating film is formed on at least one surface of the copper foil and the reciprocal of the electric double layer capacity representing the thickness of one surface (1/C) is 0.3-0.8 cm²/μF. The organic antirust coating film is formed from a triazole compound, a dicarboxylic acid and an amine, or alternatively formed from a tetrazole compound, a dicarboxylic acid and an amine.

The invention discloses a high-stability thermistor manufacturing process which comprises the following steps: firstly, manufacturing an inner layer on a thermistor material, performing laser treatment on a side of a gong groove, pressing a prepreg with a copper foil, filling the gong groove with a resin, further performing laser treatment on the other side of the gong groove, pressing the prepregwith the copper foil, filling the gong groove with the resin, wrapping a thermistor inside the gong groove completely, and finally performing patterning, thereby obtaining a finished product of the thermistor. By adopting the high-stability thermistor manufacturing process, the thermistor is manufactured in modes that groove holes are formed through laser and mechanical means and the resin is repeatedly pressed and supplied, the thermistor is surrounded by the resin, very high reliability and stability are achieved, the characteristics that the resistance of a thermistor plate is increased incase of heat and large current and normal resistance is recovered after the heat and the current are recovered are met, then relatively high market requirements are met, and product diversity is achieved.

The invention provides a manufacturing process of a copper clad laminate substrate. The substrate is characterized in that the work is completed by a supporting plate, an erected frame, a suction device, a conveying cylinder and a suction device in a cooperative mode. During superimposition, a copper foil on the lowermost side is usually cut from a copper foil reel, the cut copper foil is placed on a table in a natural state and easily re-rolled, one hand of a worker is required to assist in flattening the copper foil, the other hand is required to press a semi-cured film against an upper endof the copper foil, completely flattening the copper foil with one hand is difficult, and the pressed copper foil may wrinkle, which affects the later pressing process. Problems that before the copperfoil is placed on the table, the copper foil needs to be cut out from the copper foil reel, the cut end is difficult to be flattened, and the time of the lamination process is delayed to some extentcan be solved through the manufacturing process.

The present invention discloses an FPC board. The FPC board comprises an upper layer, a middle layer and a lower layer. The upper layer is a protective film made of an insulating material, the lower layer is a substrate made of an insulating material, and the middle layer is a circuit layer made of copper foil. The FPC board is provided with a first through hole for cooperating with the coil; oneend of the protective film is provided with a plurality of first escape grooves for cooperating with the lead wire of the coil; and the circuit layer is provided with a plurality of first connection portions corresponding to the first escape grooves. The present invention also provides a linear motor to which the FPC board is applied. According to the technical scheme of the present invention, thefirst escape groove reserves a mounting space for the lead wire of the coil, and is convenient to install; and the lead wire of the coil is placed in the first escape groove and soldered to the firstconnection portion on the circuit layer, so that not only a certain protection function for the lead wire of the coil can be realized, and good stability, safety and reliability can be achieved, butalso the vibration space of the motor is increased, the vibration amount of the motor is improved, and a good vibration effect is achieved.

The invention provides a shielding window mounting structure and an electromagnetic information safety protection display, and belongs to the technical field of electromagnetic information safety protection. The invention can solve the technical problems of Moire fringes and poor light transmittance of a low-emission display in the prior art. The shielding window mounting structure comprises shielding glass and a shielding shell, wherein the shielding shell comprises a shielding front shell and a shielding rear shell connected with the shielding front shell through sunk screws, an installationstructure is arranged on the shielding front shell, the shielding glass can be installed on the shielding front shell in an attached mode through the installation structure, the shielding glass is provided with a conductive layer, and the four edges of the shielding glass are wrapped with conductive copper foils. The shielding glass with the conductive layer is adopted, so that the transmittanceof the display is greater than 80%, and no Moire phenomenon exists; and secondly, the shielding window mounting structure can enable the shielding glass to be stably and reliably mounted in the shielding shell.

Lithium-containing anodes, high performance electrochemical devices, such as secondary batteries, including the aforementioned lithium-containing electrodes, and methods for fabricating the same are provided. In one implementation, an anode electrode is provided. The anode electrode comprises a first diffusion barrier layer formed on a copper foil. The first diffusion barrier layer comprises titanium (Ti), molybdenum (Mo), tungsten (W), zirconium (Zr), hafnium (H), niobium (Nb), tantalum (Ta), or combinations thereof. The anode electrode further comprises a wetting layer formed on the first diffusion barrier layer. The wetting layer is selected from silicon (Si), tin (Sn), aluminum (Al), germanium (Ge), antimony (Sb), lead (Pb), bismuth (Bi), gallium (Ga), indium (In), zinc (Zn), cadmium (Cd), magnesium (Mg), oxides thereof, nitrides thereof, or combinations thereof. The anode electrode further comprises a lithium metal layer formed on the wetting layer.