Method for producing electrolytic copper foil

A technology of electrolytic copper foil, manufacturing method, applied in electrolytic process, electroforming, electrode, etc., can solve problems such as coarse roughness, peeling of tin plating layer, etc.

Active Publication Date: 2021-03-23
泰科斯科技股份有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0006] In addition, Patent Document 2 proposes that by improving the electrolytic solution, the surface on the "rough side" side of the aforementioned

Method used

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  • Method for producing electrolytic copper foil
  • Method for producing electrolytic copper foil
  • Method for producing electrolytic copper foil

Examples

Experimental program
Comparison scheme
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Embodiment 1～8、 comparative example 1～7

[0114] Preparation containing sulfuric acid (H 2 SO 4 ) 100g / L, and copper sulfate pentahydrate (CuSO 4 ·5H 2 (0) sulfuric acid-copper sulfate aqueous solution of 280g / L. Hereinafter, this electrolytic solution is referred to as "basic electrolytic solution".

[0115] As additives to be added to the above-mentioned basic electrolytic solution, the following components were respectively prepared.

[0116] Additives (A): hydroxyethyl cellulose with a molecular weight of 250,000, hydroxyethyl cellulose with a molecular weight of 500,000 (both manufactured by DAICEL FINECHEM Co., Ltd.), polyglycerin (manufactured by DAICEL CHEMICAL INDUSTRIES CO., abbreviated as PGL )

[0117] ・Additive (B): Collagen peptide with a molecular weight of 5000 (manufactured by Asahi Chemical Industry Co., Ltd.)

[0118] ・Additive (C): Sodium 3-mercapto-1-propanesulfonate (manufactured by Koei Chemicals Co., Ltd.)

[0119] ・Additive (D): Thiourea (manufactured by Nippon Chemical Industries), N,

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Abstract

The present invention relates to a method for producing an electrolytic copper foil, the method enabling providing an electrolytic copper foil such that the electrical conductivity is 99% or more, thethickness is 10 [mu]m or less, a problem of a bend is suppressed, the front side and the rear side are flat, the tensile strength is 500 MPa or more, and the elongation percentage is 5.5% or more. The method for producing an electrolytic copper foil includes forming an electrolytic copper foil by using, as an electrolytic solution, a sulfuric acid-copper sulfate aqueous solution not containing aheavy metal other than a copper metal, using an insoluble anode and a cathode drum facing the insoluble anode, and passing a direct current between these electrodes, wherein, in the electrolytic solution, particular additives (A) to (E) are contained each in a particular amount, and the additive (D) and the additive (A) are each added in a ratio such that (D)/(A) is 0.2 to 0.7.

Description

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Claims

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Application Information

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Owner 泰科斯科技股份有限公司
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