Method and apparatus for manufacturing and probing printed circuit board test access point structures

a technology of access point structure and printed circuit board, which is applied in the direction of printed circuit manufacture, circuit inspection/indentification, instruments, etc., can solve the problems of increasing difficulty in reliably and repeatably hitting lower diameter targets, increasing difficulty in matching length and symmetries, and requiring complex tester resources

Active Publication Date: 2006-05-11
KEYSIGHT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The technical effect of this patented technology is that it simplifies the process of testing printed circuit board (PCB) devices without compromising their accuracy or reliability. It achieves this by reducing disturbances caused by traces in both dimensions and using z dimension instead of just one dimension.

Problems solved by technology

The technical problem addressed by this patent is how to efficiently transmit high-density signals without generating unwanted noise during their transmission due to the presence of multiple closely spaced metallic lines called "pins," which reduces impedance and allows for better performance. Additionally, the patent addresses the issue of finding suitable test locations for testing purposes while ensuring equal spacing and alignment between the test points.

Method used

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  • Method and apparatus for manufacturing and probing printed circuit board test access point structures
  • Method and apparatus for manufacturing and probing printed circuit board test access point structures
  • Method and apparatus for manufacturing and probing printed circuit board test access point structures

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Embodiment Construction

[0042] This invention relates to U.S. patent application Ser. No. 10 / 670,649 entitled Printed Circuit Board Test Access Point Structures And Methods For Making The Same filed Sep. 24, 2003 by Kenneth P. Parker, Ronald J. Peiffer and Glen E. Leinbach and assigned to Agilent Technologies, Inc., which teaches the basic concepts of bead probes or test access point structures on a printed circuit board and is incorporated herein by reference.

[0043] Turning now in detail to the invention, on a trace defined in an x-, y-, z-coordinate system where the x-dimension represents the trace width, the y-dimension represents the trace length, and the z-dimension represents the trace thickness, it will be recognized by those skilled in the art that present techniques for test access point placement on a printed circuit board utilize only the x- and y-dimensions. The present invention takes a different approach by taking advantage of the z-dimension, that is, the trace thickness. In this regard, the

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Abstract

A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. Each test access point structure is conductively connected to a trace at a test access point and above an exposed surface of the printed circuit board to be accessible for probing by a fixture probe. The test access point structure may be designed and manufactured to permit deformation of the test access point structure upon initial probing of the test access point structure with a fixture probe to ensure electrical contact between the fixture probe and the test access point structure.

Description

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Claims

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Application Information

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Owner KEYSIGHT TECH
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