31results about "Printed circuit manufacture" patented technology

An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The assembly also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements.

A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.

A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. Each test access point structure is conductively connected to a trace at a test access point and above an exposed surface of the printed circuit board to be accessible for probing by a fixture probe. The test access point structure may be designed and manufactured to permit deformation of the test access point structure upon initial probing of the test access point structure with a fixture probe to ensure electrical contact between the fixture probe and the test access point structure.

The invention discloses a robot for punching positioning holes on a circuit board, comprising a robot body. The robot is characterized in that the robot body comprises a wrist, a forearm, a skirt and a big arm. The wrist is movably connected with one end of the forearm and can rotate round the forearm. The other end of the forearm is movably connected with one end of the big arm and the forearm can rotate round the big arm. The other end of the big arm is movably connected with skirt and the big arm can rotate round the skirt. The robot has planar three degrees of freedom, can ensure the clamped workpieces to carry out random curvilinear motion within the allowable range, can accomplish taking out the circuit board from a feed bin, clamping the circuit board onto a positioning hole punch to punch a plurality of positioning holes on the required positions and putting the circuit board back to a material receiving bin after hole punching, can completely replace manual operation and obviously improve the production efficiency, and has the advantages of high punching efficiency, small occupied space, steady running, low cost and high precision, etc.

The invention provides an aligning lamination pressing machine of a semi-automatic reinforcing sheet of a flexible printed circuit board. The aligning lamination pressing machine comprises a base, wherein a movable die is arranged on the base; the movable die comprises a bottom plate; an upward-extended guide post is arranged on the bottom plate; a fixed template is fixedly arranged at the upper end of the guide post; a movable template which is located below the fixed template is arranged on the guide post in a sliding and penetrated manner; a die air cylinder which is located below the movable template is further arranged on the bottom plate; a piston rod of the die air cylinder is connected with the movable template; a reinforcing sheet die groove is arranged on the fixed template; an ejector needle is arranged on the movable template; the ejector needle corresponds to the reinforcing sheet die groove, and can extend into the reinforcing sheet die groove; a pressing lathe is further arranged above the movable die; an electric heating mechanism is arranged in the pressing lathe; a pressing lathe air cylinder is arranged above the pressing lathe; a piston rod of the pressing lathe air cylinder is connected with the pressing lathe; a bracket is arranged on the base; and the pressing lathe air cylinder is arranged on the bracket. The invention provides the aligning lamination pressing machine of the semi-automatic reinforcing sheet of the flexible printed circuit board, which can automatically carry out patching treatment, greatly improves the production efficiency, and ensures the product quality.

A component assembly that can be easily built in a main substrate with high accuracy is formed such that a glass transition temperature of a built-in-component layer of an assembly substrate in which multiple capacitors are embedded is higher than a glass transition temperature of a built-in-component layer of a built-in-component substrate. Thus, thermal deformation of the component assembly is prevented when the built-in-component substrate in which the component assembly is built is heated during reflow, for example. The component assembly can thus be highly accurately built in the built-in-component substrate. Moreover, when the component assembly in which the multiple capacitors are embedded is built in the built-in-component substrate, electrode pads of the component assembly in which the multiple capacitors are embedded can be electrically connected to wiring layers of the built-in-component substrate by soldering despite the variation in height among the capacitors.

A light bulb includes a glass bulb having a top part and a bottom part which is connected to the top part. A light unit is located in a space defined between the top and bottom parts. The light unit has a transverse circuit board and at least one upright circuit board. Multiple Light Emitting Diodes are connected to the top surface and the bottom surface of the transverse circuit board. The at least one upright circuit board is connected to the top surface of the transverse circuit board. Multiple Light Emitting Diodes are connected to the outside surface of the at least one upright circuit board.

The light beams from the Light Emitting Diodes go through the glass bulb and toward different directions.

An inkjet head assembly and a printing method using the same. The inkjet head assembly includes an ultraviolet (UV) emitting unit to emit UV light, and a printhead to move together with the UV emitting unit and to eject ink through nozzles using inkjet technology.

A paste supply apparatus includes a plurality of paste pots each including a bottomed tubular container storing paste and a movable inner lid provided in the tubular container and having a through hole formed in a center portion thereof, and a pot holder which holds the paste pots so as to be horizontally arranged along an arrangement direction such that the through hole of each of the paste pots is directed downward and downward movement of the inner lid thereof is regulated. The paste supply apparatus further includes a pot holder moving device which moves the pot holder along the arrangement direction and selectively positions one of the plurality of paste pots at an ejection position, and a paste ejecting device which presses the tubular container of the paste pot positioned at the ejection position and which ejects the paste in the tubular container from the through hole.

In the manufacture of RFID tags, electronic components are connected with soldered connections to antennas stamped from a thin strip of electrically conductive metal, utilizing methods and intermediate products which enable accurate registration of the leads of the electronic components with contacts on the antennas. Thus, a strip of metal is provided with contact members unitary with the strip and coupled to the strip through compliant coupling arrangements which allow compliant movement of the contact members relative to the strip for accurate alignment with electronic components juxtaposed with the contact members for soldered connections between the leads of the electronic components and the corresponding contact members. The antennas, with the electronic components soldered in place, are carried by a substrate, and the sequence of the stamping and soldering operations avoids exposing the substrate to the heat of soldering.

Provided is an acrylic flame retardant adhesive composition, including: (A) 100 parts by mass of an acrylic polymer containing a carboxyl group, with a glass transition temperature of 5 to 30° C., (B) 1 to 20 parts by mass of a resol-type phenol resin, (C) 1 to 20 parts by mass of an epoxy resin, (D) 0.1 to 5 parts by mass of a curing accelerator, (E) a bromine-based flame retardant, in sufficient quantity to produce a bromine content within the entire composition, excluding the component (F), of 15 to 40% by mass, and (F) 10 to 100 parts by mass of an inorganic filler. Also provided are an acrylic adhesive sheet that contains an adhesive layer including this composition and a method of bonding two substrates using this acrylic adhesive sheet. The acrylic adhesive sheet exhibits excellent adhesiveness, heat resistance, workability, handling properties and flame retardancy, and the acrylic adhesive composition is useful in the production of such an adhesive sheet.

The invention discloses an integrated circuit board processing and drilling device in the field of circuit board processing. The integrated circuit board processing and drilling device comprises a bottom assembly, a moving assembly, a drilling assembly and a cleaning assembly, and is characterized in that the bottom assembly comprises a bottom plate and a control panel arranged at the upper end ofthe bottom plate. The integrated circuit board processing and drilling device has the beneficial effects that a bearing table stably and movably supports a movable placing plate through symmetrical clamping rails, a pushing screw is installed in the bearing table and connected with the output end of a servo motor, and the servo motor can accurately control the pushing screw, so that the moving distance of the movable placing plate is accurately controlled; four pressing air cylinders are connected to the movable placing plate, one end of each pressing air cylinder is connected with an L-shaped clamping jaw, and the four corners of a circuit board are pressed through the clamping jaws, so that placement is stable, subsequent punching is facilitated, and the punching precision is improved;the movable placing plate facilitates placement of the circuit board, and the clamping jaws pushed by the pressing air cylinders achieve synchronous and rapid pressing; and the automation degree is high.

The invention provides an electroplating copper plating system of a high-aspect-ratio printed wiring board and a copper plating method. The electroplating copper plating system comprises a fixed baseplate, a copper plating component basket and a copper plating master basket; at least one set of clamping grooves is symmetrically formed in two ends of the fixed baseplate; at least one copper plating component basket is movably arranged in the copper plating master basket; the clamping grooves are fixedly clamped with the copper plating master basket; the copper plating component basket is matched and connected with the copper plate master basket; a vibration motor is arranged on the fixed baseplate; and the vibration motor can be arranged in front of the clamping grooves or among the clamping grooves or on any sides of the clamping grooves. Through innovation of tools and change of operation modes, a production mode of once copper plating and once padpower is used for improving the problem of no copper in holes with high aspect ratio; in particular, the system relates to design of the copper plating component/master basket of key parts thereof, installation of the vibration motor and the baseplate, matched application method of each equipment and control indexes of each key item, and guarantees the electrical test after downstream procedure assembly; and meanwhile, through the manufacturing mode of once copper plating and once padpower, the production efficiency is improved, and the manufacturing cost is reduced.

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

The invention discloses a tree core groove machining method and a printed circuit board. The method comprises the steps that two symmetrical small round holes are manufactured in a to-be-machined areaof the printed circuit board through a drill bit; a large circular hole is formed between the two small circular holes through a first grooving cutter, and the large circular hole intersects with thetwo small circular holes; back drilling is performed on the two small circular holes through a second groove cutter with the same size as the drill bit to manufacture a dust removal hole so as to remove drilling dust; and deburring holes are formed in each intersection position of the small circular hole and the large circular hole through a milling cutter so as to remove drilling burrs. According to the tree core groove machining method and the printed circuit board provided by the invention, drill holes used for removing burrs, dust and cellosilk are additionally formed in a processing technology so that the burrs and the cellosilk can be completely removed, the burrs generated after copper deposition and electroplating are completely eradicated, requirements of component installation are met, and groove hole processing quality is improved.

A smart part comprising: a body, manufactured by a three dimensional (3D) additive manufacturing (AM) process, having high-stress and low-stress sections, wherein when the smart part is in operational use the high-stress section is subjected to higher stress than the low-stress section; a resistive strain gauge embedded within the body during the AM process at the high-stress section, wherein the strain gauge is configured to produce a variable output; and a temperature sensor embedded within the body during the AM process at the low-stress section, wherein the temperature sensor is configured to produce a variable output based on temperature.

The invention discloses a circuit board, including a mixed dielectric structure, two soft dielectric layers and a first circuit layer. The mixed dielectric structure includes at least two hard dielectric sections and at least a soft dielectric section which is provided between these hard dielectric sections. These soft dielectric layers are respectively allocated at the opposite sides of the mixed dielectric structure. Each soft dielectric layer is contacted these hard dielectric sections and soft dielectric section, and the material of the soft dielectric section is different from that of the soft dielectric layer. The first circuit layer is arranged on one of these soft dielectric layers. The circuit board has relatively low material cost. In addition, the invention also discloses a preparing method for the circuit board.

An interposer substrate includes a first insulating layer having opposite first and second surfaces; a first wiring layer formed in the first insulating layer, with a surface of the first wiring layer exposed from the first surface; first conductive pillars formed in the first insulating layer; a second wiring layer formed on the second surface; second conductive pillars formed on the second wiring layer; a second insulating layer formed on the second surface and covering the second conductive pillars and the second wiring layer, with end surfaces of the second conductive pillars exposed from the second insulating layer; and immersion tin layers formed on the first wiring layer and the end surfaces of second conductive pillars. The immersion tin layers are used as surface processing layers to be applied to products having ball pads that need to be exposed extensively. A method for fabricating the interposer substrate is also provided.

The present invention provides a technology for, in copper electrolytic plating containing silver ions as an alloy component, obtaining a copper electrolytic plating film in which co-deposition of sulfur can be significantly suppressed and which is excellent in physical properties such as strength and hardness even after a high-temperature heat treatment at about 200° C. or higher. The present invention is a copper electrolytic plating bath comprising copper ions, an acid, chloride ions, and a complexing agent, wherein the copper electrolytic plating bath further comprises silver ions as an alloy component, and wherein methionine or a derivative thereof is contained as the complexing agent.

A wired circuit board includes a first insulating layer, a conductive pattern disposed on the first insulating layer and including a plurality of terminals arranged in parallel to be spaced apart from each other, and a second insulating layer disposed on the first insulating layer so as to cover the conductive pattern. Each of the terminals includes a main body portion and a protruding portion protruding from the main body portion and having a dimension in a parallel arrangement direction of the terminals which is shorter than a dimension of the main body portion thereof. The second insulating layer includes a plurality of end-portion covering portions disposed individually on both end portions of the main body portion in the parallel arrangement direction and exposing a middle portion of the main body portion and the protruding portion.

The invention discloses a laser light path system and a method for processing a flexible circuit board by using the laser light path system. According to the key points of the technical scheme, the laser light path system comprises a laser, and the output end of the laser is provided with an acousto-optic deflector for splitting light; and laser divided into two beams by the acousto-optic deflector passes through a zoom beam expander and a half-wave plate respectively and then is combined into one beam through a polarization beam combiner, and a galvanometer scanning system and a focusing lensare sequentially arranged at the output end of the polarization beam combiner. The processing method comprises the following steps: continuously processing one hole site by using the focusing laser and the out-of-focus laser, moving the flexible circuit board, and continuously processing the other hole site. Compared with the prior art that all holes are punched through focusing laser and then punched through out-of-focus laser again, the continuous punching mode can greatly shorten the machining path, and therefore the machining efficiency is greatly improved.

The invention relates to a full-automatic feeding device of a board grinding machine, and belongs to the technical field of printed circuit board production, the full-automatic feeding device of the board grinding machine comprises a board grinding machine body, the feeding end of the board grinding machine body is provided with a machine base, and the inner side wall of the machine base is provided with a containing platform used for containing a printed circuit board; a feeding mechanism for automatically feeding printed circuit boards into the feeding end of the board grinding machine body one by one is arranged on the top face of the machine base, an induction mechanism is further arranged on the top face of the machine base, a lifting mechanism used for lifting the containing platform is arranged at the bottom of the containing platform, and the induction mechanism is electrically connected with the lifting mechanism and the feeding mechanism. The board grinding machine has the effects that the printed circuit boards can be automatically conveyed into the board grinding machine body one by one, and the working efficiency is improved.

Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, “skinned surface,” and “rough and crumbling,” and is excellent in printability and solderability. The flux contains, as elements, a resin, a thixo agent, an activator, a solvent and glucopyranosylamine type nanotube. The soldering paste further contains a solder powder. Preferably, the solder powder is free from lead.

The invention provides a bearing device for PCB production. The bearing device for PCB production comprises a bearing plate; two first supporting blocks fixedly mounted at the top of the bearing plate; two second supporting blocks fixedly installed at the top of the bearing plate, wherein the two first supporting blocks and the two second supporting blocks are symmetrically arranged; two positioning blocks fixedly mounted at the tops of the two first supporting blocks correspondingly; two positioning grooves which are formed in the bottoms of the two second supporting blocks correspondingly, wherein the positioning grooves are matched with the positioning blocks; and two positioning lifting mechanisms which are installed on the two second supporting blocks correspondingly. The bearing device for PCB production has the advantages of being convenient to use and capable of being suitable for PCBs with different thicknesses.

The present invention relates to an apparatus and a method for molding a metal PCB, the structure of which is as follows: a metal PCB inserted for bending is supported by a fixing unit, and the metal PCB is bent by applying pressure by a first jig having a protruding part on both sides of the metal PCB and a second jig having a groove part corresponding to the protruding part.

The invention relates to a printed circuit board arrangement (20) having at least two printed circuit boards (11; 12′), which are located alongside one another on a common, electrically conductive base plate (13′), have two mutually opposite edges, forming an intermediate space (14), and are connected to one another, bridging the intermediate space (14) by means of electrical connections (21), in order to transmit extremely high frequencies. In the case of a printed circuit board arrangement such as this, RF-compatible electrical connections are made between the printed circuit boards in a simple and space-saving manner when the printed circuit boards are fitted on the base plate and without any further necessary additional tasks or reworking, in that the electrical connections are each made via at least one contact-making element (21), via which the printed circuit boards make detachable electrical contact with one another when mounted on the base plate (13′).