Copper electrolytic plating bath and copper electrolytic plating film

[0069]Hereinafter, the present invention will be specifically described with reference to examples, but the invention is not limited to the following examples and can be carried out by appropriate modifications within a range adaptable to the above-mentioned and the later-described purposes, and all the modifications are encompassed within the technical scope of the invention. In the following, unless specified otherwise, the term “%” means “mass %”.

[0070]In this example, using a copper plating bath (without the addition of an alloy component and a complexing agent, the conventional example), and a copper-silver alloy plating bath [with the use of thiourea as a complexing agent (the comparative example); or with the use of DL-methionine, N-acetyl-DL-methionine, or DL-methionine sulfoxide (the examples of the present invention)], various properties were examined when electroplating was carried out as described below.

No. 1 (Conventional Example)

[0071]A copper plating solution having the