64results about "Decorative surface effects" patented technology

Method and apparatus for bonding a polarizing plate high in operating efficiency and yield. The apparatus includes a cutting unit for cutting at least a polarizing plate of a strip-shaped film, composed of the polarizing plate and a release film bonded to the polarizing plate, leaving the release film uncut, when a forward end side pre-severed end face of the strip-shaped film perpendicular to the longitudinal direction of the strip-shaped film has traveled up to a length corresponding to a length of a substrate, to form a film piece, a release film separating unit for separating the release film from the film piece thus severed, and a bonding unit for bonding the tacky surface of the film piece freed of the release film to a mating position of the substrate so that the forward end side end face of the transported substrate is parallel to the pre-severed end face of the film piece.

A micromachined acoustic transducer comprising a parylene diaphragm piezoelectric transducer. The parylene diaphragm has far lower stiffness than the silicon nitride. The method for fabricating the parylene diaphragm acoustic transducer utilizes a prestructured disphragm layer utilizing silicon nitride which is compatible with high temperature semiconductor process. A silicon nitride layer is patterned and partially removed after forming the parylene diaphragm layer in order to enhance the structural qualities of the parylene diaphragm. The diaphragm may be flat or dome-shaped.

A supported graphene device comprises at least one graphene feature of 1 to about 10 graphene layers having a predetermined shape and pattern, with at least a portion of each graphene feature being supported on a substrate. In some embodiments the device comprises graphene features supported on crystalline semiconductor substrate, such as silicon or germanium. The graphene features on a crystalline semiconductor substrate can be fabricated by forming an amorphous carbon doped semiconductor on the crystalline semiconductor substrate and then epitaxially crystallizing the amorphous semiconductor with carbon migration to the surface to form a graphene feature of one or more graphene layers. The epitaxy can be promoted by heating the device or by irradiation with a laser. Methods for fabricating graphene on a variety of substrates, over large areas with controlled thicknesses employ ion implantation or other doping techniques followed by pulsed laser annealing or other annealing techniques that result in solid phase regrowth are presented.

A covering unit for use in combination with similar units for covering a surface with a natural random look, the unit having an hexagonal body comprising first, second and third pairs of opposed and parallel sides. Each side has a central point of angular symmetry. The second and third pairs are similar to each other while the first pair is different from the others. The sides of the second and third pairs are provided with at least one split deviation along their length arranged so that each side of the second pair is a rotational image of the sides of the third pair, whereby in use in combination with other covering units: each side is matingly engageable with the sides of an equivalent pair of a neighbouring unit; and the unit has a central point of angular symmetry and is matingly engageable with a plurality of neighbouring unit.

A method and system for controlling a silicon nitride etching bath provides the etching bath including phosphoric acid heated to an elevated temperature. The concentration of silicon in the phosphoric acid is controlled to maintain a desired level associated with a desired silicon nitride/silicon oxide etch selectivity. Silicon concentration is measured while the silicon remains in soluble form and prior to silica precipitation. Responsive to the measuring, fresh heated phosphoric acid is added to the etching bath when necessary to maintain the desired concentration and silicon nitride:silicon oxide etch selectivity and prevent silica precipitation. The addition of fresh heated phosphoric acid enables the etching bath to remain at a steady state temperature. Atomic absorption spectroscopy may be used to monitor the silicon concentration which may be obtained by diluting a sample of phosphoric acid with cold deionized water and measuring before silica precipitation occurs.

A cross point memory array includes a structure in which holes are formed in an insulating layer and a storage node is formed in each of the holes. The storage node may include a memory resistor and a switching structure. The master for an imprint process used to form the cross-point memory array includes various pattern shapes, and the method of manufacturing the master uses various etching methods.

The invention discloses a multilayer thin film OTFT (organic thin film transistor) formaldehyde gas sensor and a preparation method thereof. The sensor is in a bottom-grid bottom-contact device structure, and is provided with a source a, a drain b and a grid c, wherein a trench between the source and the drain is designed as an interdigital structure; the source and the drain are respectively a gold/titanium double-layer film, the gold material is used as an electrode layer, and the titanium material is used as a transition layer; and a sensitive thin film, which is an organic semiconductor material-inorganic nano oxide multilayer thin film, is arranged between the source and the drain. The invention combines the organic semiconductor material with the inorganic nano oxide, and adopts a multilayer thin film mode to prepare the sensitive thin film, thereby greatly enhancing the sensitivity and response speed of the sensor. On the premise of implementing formaldehyde gas detection, the invention breaks through the limitation in material selection in the traditional OTFT device, and adopts the MEMS technology to prepare the OTFT device. The invention has the advantages of small size, low cost and the like, can be integrated into an array, and opens up a new way for preparation and application of the OTFT formaldehyde sensor.

In an infrared detection sensor according to the present invention, all material constituting an upper portion of a sensing electrode in a supporting arm region is removed so that a supporting arm has low thermal conductivity. As a result, thermal conductivity of the infrared sensor structure is reduced, and the infrared detection sensor has excellent sensitivity.

The present invention provides a series of methods, compositions, and articles for patterning a surface with multiple, aligned layers of molecules, by exposing the molecules to electromagnetic radiation. In certain embodiments, a single photomask acts as an area-selective filter for light at multiple wavelengths. A single set of exposures of multiple wavelengths through this photomask may make it possible to fabricate a pattern comprising discontinuous multiple regions, where the regions differ from each other in at least one chemical and/or physical property, without acts of alignment between the exposures. In certain embodiments, the surface includes molecules attached thereto that can be photocleaved upon exposure to a certain wavelength of radiation, thereby altering the chemical composition on at least a portion of the surface. In some embodiments, the molecules attached to the surface may include thiol moieties (e.g., as in alkanethiol), by which the molecule can become attached to the surface. In some embodiments, the molecules may be terminated at the unattached end with photocleavable groups. In other embodiments, a molecule that was photocleaved may be exposed to another molecule that binds to the photocleaved molecule. In certain cases, the molecules may be terminated at the unattached end with hydrophilic groups that may, for example, be resistant to the adsorption of proteins. In other cases, the molecules may be terminated at the unattached end with end groups that are not resistant to the adsorption of proteins. In certain embodiments, the techniques are used to pattern simultaneously two different regions that are resistant to the adsorption of proteins, and a third region that does not resist the adsorption of proteins.

An insert film having a printed part is integrally molded to a surface of a panel body made of a resin by an insert molding. The printed part is printed on a first binder layer applied to a resin film and also is formed on the resin film in a state such of being sealed with the first binder layer and a second binder layer applied on the printed part. The printed part is formed as a trimming portion (blackout) along a peripheral portion of the resin film, and an area is formed between the peripheries of the first binder layer and the second binder layer and the periphery of the resin film.

A method for manufacturing a semiconductor device having a movable portion includes the steps of: forming a trench on a semiconductor layer so that the trench reaches an insulation layer; and forming a movable portion by etching a sidewall of the trench so that the semiconductor layer is separated from the insulation layer. The steps of forming the trench and forming the movable portion are performed by a reactive ion etching method. The insulation layer disposed on the bottom of the trench is prevented from charging positively in the step of forming the trench. The insulation layer disposed on the bottom of the trench is charged positively in the step of forming the movable portion.

A fluorescent image-printed article including a substrate, and an image formed on the substrate, wherein the image is formed from a fluorescent ink containing a binder, and a fluorescent substance which is dispersed in the binder, is capable of emitting fluorescence when irradiated with ultraviolet rays, and is substantially transparent to visible light, the fluorescent substance being formed of a rare earth complex containing, as a ligand, a compound represented by the following formula (1):

The present invention provides a resin porous membrane with an adhesive layer that exhibits excellent bonding precision and can be bonded to an adherend while maintaining the gas permeability of the porous membrane even when the porous membrane is small, and a method for producing the resin porous membrane with the adhesive layer. The present invention also provides the filter member including the resin porous membrane with the adhesive layer.

A TMR element includes: a free layer formed on a lower gap layer; a tunnel barrier layer formed on the free layer; and a pinned layer formed on the tunnel barrier layer. The pinned layer and the tunnel barrier layer have sidewalls formed through etching. The TMR element further comprises a deposition layer made of a material that is separated by etching and deposits on the sidewalls and undergoes oxidation.

A resist removing device 1 functions to remove a resist from a substrate while preventing occurrence of popping phenomenon and at the same time attains reduction in cost of energy for the resist removing and has a simplified constitution. The resist removing device 1 is equipped with a chamber 2 for containing therein a substrate 16 (for example, a substrate having a high-doze ion implanted resist), and with a pressure below the atmospheric pressure, the chamber 2 is fed with ozone gas, unsaturated hydrocarbons and water vapor. The ozone gas may be an ultra-high concentrated ozone gas that is produced by subjecting an ozone containing gas to a liquefaction-separation with the aid of a vapor pressure difference and then vaporizing the liquefied ozone. For cleaning the substrate 16 thus treated, it is preferable to use ultra-pure water. The chamber 2 is equipped with a susceptor 15 for holding the substrate 16. The susceptor 15 is heated to a temperature of 100° C. or below. An example of the means of heating the susceptor is a light source that emits infra-red rays.

The invention discloses a method for manufacturing a three-dimensional craft picture. The method comprises the following steps: selecting an applicable basis material and a picture to be manufactured; manufacturing a three-dimensional effect layer on the basis material; performing spray-painting and coloring processing according to the picture to be manufactured to form a spray-painting layer, wherein oil-based printing ink is adopted in the spray-painting and coloring process. According to the method, a spray-painting layer is positioned at the outermost layer of the three-dimensional craft picture, so that a picture effect displayed by the three-dimensional craft picture is more three-dimensional and lifelike; meanwhile, the three-dimensional craft picture has better water proofness, sun proofness, color retention and wearing resistance, and is convenient to be conserved for long time, and applicable to industrial mass production.

An apparatus for treating a substrate may include a process chamber. The process chamber may include a reaction space and an opening portion for receiving the substrate into the reaction space. The apparatus may further include a dielectric layer. The apparatus may further include a plurality of support elements disposed on the dielectric layer and configured to contact a bottom surface of the substrate for supporting the substrate. The plurality of support elements may include a first support element and a second support element immediately neighboring the first support element.

Provided are a resin composition which offers both high transparency and a low linear expansion coefficient and can be used as a material for a dry film, and also a dry film obtained from this composition, an optical waveguide, and a photoelectric composite wiring board. The resin composition for an optical waveguide includes: (A) an epoxy resin constituted by a solid epoxy resin with one or less hydroxyl group in a molecule, and a liquid epoxy resin with one or less hydroxyl group in a molecule; (B) a curing agent with one or less hydroxyl group in a molecule; and (C) a nanosize silica sol, and contains no compound including two or more hydroxyl groups in a molecule as a resin component.

In an etching method for achieving a dual damascene structure by using at least one layer of a low-k film and at least one layer of a hard mask, a dummy film, which is ultimately not left in the dual damascene structure, is formed in at least one layer over the hard mask in order to prevent shoulder sag. By adopting this method, a dual damascene structure in which the extent of the shoulder sag at the hard mask is minimized can be achieved through etching.

The invention relates to a manufacturing method of a wall painting, in particular to a muddy substrate simulation wall painting and a manufacturing process thereof, and aims to provide the muddy substrate simulation wall painting and the manufacturing process thereof, which have the advantages of high production and manufacturing speed, high simulation and convenience in mounting and construction. The muddy substrate simulation wall painting and the manufacturing process thereof are characterized in that: the manufacturing process comprises three major steps of manufacturing a substrate, printing and performing distressing treatment, wherein a printable requirement can be met by coating a muddy cover layer (2) on a bottom plate (1); the manufacturing speed and efficiency of the wall painting are greatly increased by utilizing a UV (Ultraviolet) printing technology; and thus, the muddy substrate simulation wall painting and the manufacturing process thereof have the beneficial effects of high production and manufacturing speed, capability of realizing large-scale production in short time, high simulation, convenience in mounting and construction and high applicability.

To provide a planarization method which does not depend upon the size and the density of a wiring pattern and in which a reliable wiring system and a Josephson device can be formed and wiring structure, an insulation layer is planarized by forming a reversal pattern mask of wiring and selectively removing the insulation layer on the wiring.