Substrate supporting unit and substrate treating apparatus and method

Inactive Publication Date: 2014-06-05
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0030]According to the above, the distance between the protrusions that support the substrate may be optimized. Accordingly, temperature differences between different areas of the sub

Problems solved by technology

The substrate supporting unit, which is disposed between the substrate and the cooling unit, may transfer heat from the substrate to the cooling system, and the cooling system may dissipate the heat.
The temperature differ

Method used

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  • Substrate supporting unit and substrate treating apparatus and method
  • Substrate supporting unit and substrate treating apparatus and method
  • Substrate supporting unit and substrate treating apparatus and method

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Embodiment Construction

[0039]In this specification, if an element or layer is referred to as being “on”, “connected to”, or “coupled to” another element or layer, it can be directly on, directly connected, or directly coupled to the other element or layer, or intervening elements or layers may be present. In contrast, if an element is referred to as being “directly on”, “directly connected to”, or “directly coupled to” another element or layer, there are no (intended) intervening elements or layers (except possible environmental elements, such as air) present. Like numbers may refer to like elements in the specification. As used herein, the term “and / or” may include any and all combinations of one or more of the associated listed items.

[0040]Although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms may be used to disting

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Abstract

An apparatus for treating a substrate may include a process chamber. The process chamber may include a reaction space and an opening portion for receiving the substrate into the reaction space. The apparatus may further include a dielectric layer. The apparatus may further include a plurality of support elements disposed on the dielectric layer and configured to contact a bottom surface of the substrate for supporting the substrate. The plurality of support elements may include a first support element and a second support element immediately neighboring the first support element.

Description

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Claims

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Application Information

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Owner SAMSUNG DISPLAY CO LTD
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