Resin composition for optical waveguide, dry film, optical waveguide, and photoelectric composite wiring board using same

a technology of optical waveguides and compositions, applied in the direction of liquid surface applicators, instruments, transportation and packaging, etc., can solve the problems of substrate warping, conduction disruption, and linear expansion coefficient difference, and achieve low linear expansion coefficient, low light loss, and high transparency

Active Publication Date: 2014-01-02
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
View PDF1 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a new type of plastic that has very good properties such as being transparent and having low coefficients of thermal expansion (CTE). This makes it suitable for use as a material for various applications like optics or electronic devices.

Problems solved by technology

The technical problem addressed in this patent text relates to improving the performance and durability of opto-optical fiber networks due to their use of optical components like optical circuits and electronic circuits. Current methods involve using expensive specialized materials called epoxy resins, which require heat during manufacturing processes. Additionally, current methods involving applying a thin film material onto a substrate through evaporation or sputtering may cause stress and damage to the substrate.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition for optical waveguide, dry film, optical waveguide, and photoelectric composite wiring board using same
  • Resin composition for optical waveguide, dry film, optical waveguide, and photoelectric composite wiring board using same

Examples

Experimental program
Comparison scheme
Effect test

examples 1 to 4

[0075]The components were compounded in compositions (parts by mass) such as shown in Table 3 below and were mixed under reflux conditions and heating at 80° C. Then, methyl ethyl ketone (MEK) was distilled off under reduced pressure to obtain 70 parts by mass thereof per 100 parts by mass of the solid fraction. An epoxy resin varnish was prepared by filtration with a membrane filter with a pore size of 1 μm and then defoaming under reduced pressure. In all of the tables below, the compounded amount of silica sol is shown by the weight of silica particles after the solvent has been removed.

[0076]Dry films with a thickness of 10 μm and 50 μm were obtained by coating the varnish on a PET film (product number A4100) manufactured by Toyo Boseki Kabushiki Kaisha by using a multi-coater with a comma coater head manufactured by HIRANO TECSEED Co., Ltd., drying to obtain a predetermined thickness, and thermally laminating a release film OPP-MA420 manufactured by Oji Specialty Paper Co., Ltd.

examples 5 and 6

[0077]Dry films were obtained in the same manner as in Example 1, except that the components were compounded in compositions (parts by mass) such as shown in Table 4 below.

examples 13 to 15

[0106](Preparation of Material for Optical Waveguide)

[0107]First, the following core dry film was prepared as a core material for an optical waveguide.

[0108]An epoxy resin varnish was prepared by dissolving 8 parts by mass of CELLOXIDE 2021P (abbreviated as CEL2021P, manufactured by Daicell Chemical Industries, Ltd.), which is 3,4-epoxycyclohexenylmethyl-3′,4′-epoxycyclohexene carboxylate, 12 parts by mass of EHPE 3150 (manufactured by Daicell Chemical Industries, Ltd.) as an epoxy resin, which is a 1,2-epoxy-4-(2-oxylanyl)cyclosexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, 37 parts by mass of Epikote 1006FC (manufactured by Japan Epoxy Resin Co., Ltd.), which is a solid bisphenol A epoxy resin, 15 parts by mass of VG-3101 (manufactured by Mitsui Chemicals, Inc.), which is a tri-functional epoxy resin, 18 parts by mass of EPPN 201 (manufactured by NIPPON KAYAKU Co., Ltd.), which is a solid novolac epoxy resin, 10 parts by mass of EPICLON 850s (manufactured by DIC Corporation), whic

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

Provided are a resin composition which offers both high transparency and a low linear expansion coefficient and can be used as a material for a dry film, and also a dry film obtained from this composition, an optical waveguide, and a photoelectric composite wiring board. The resin composition for an optical waveguide includes: (A) an epoxy resin constituted by a solid epoxy resin with one or less hydroxyl group in a molecule, and a liquid epoxy resin with one or less hydroxyl group in a molecule; (B) a curing agent with one or less hydroxyl group in a molecule; and (C) a nanosize silica sol, and contains no compound including two or more hydroxyl groups in a molecule as a resin component.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap