Double-sided aluminum base circuit board with super-high thermal conductivity and preparation method thereof

An aluminum-based circuit board, double-sided technology, applied in the electronic field, can solve the problems of not meeting the requirements of high-power heating semiconductor packaging, metal layer peeling, complex process, etc., and achieve high yield, high current-carrying capacity, and simple process Effect

Inactive Publication Date: 2012-10-17
苏州热驰光电科技有限公司
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AI Technical Summary

Benefits of technology

This patented technical effect can be attributed to improving heat conduction efficiency between electronic components mounted onto both sides of this type of circuit boards without requiring holes or other modifications that may affect their performance. Additionally, it provides better overall cooling capabilities for these circuits due to its integral design features such as insulation layers and thermally conductors inside them.

Problems solved by technology

This patented technical problem addressed in this patents relates to improving the performance of double- sided aluminate based circuit boards used for power dissipation applications while maintaining their electrical properties at reasonable levels.

Method used

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  • Double-sided aluminum base circuit board with super-high thermal conductivity and preparation method thereof
  • Double-sided aluminum base circuit board with super-high thermal conductivity and preparation method thereof

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Embodiment Construction

[0034] The continuous development of various coating technologies has brought many advances and conveniences to industrial manufacturing and people's daily life. Relying on coating technology, products or parts can obtain better surface properties, so as to make up for some characteristics that the material itself does not have. Diamond-like Carbon coating (Diamond-like Carbon), or referred to as DLC coating is a diamond structure (sp 3 bond) and graphite structure (sp 2 bond) metastable amorphous material.

[0035]In coating technology, physical vapor deposition refers to the process of evaporation, ionization or sputtering to produce metal particles and react with reactive gases to form compounds deposited on the surface of the workpiece, referred to as PVD. At present, the commonly used PVD coating technology is mainly divided into three categories, which are vacuum evaporation coating technology, vacuum sputtering coating technology and vacuum ion beam coating technology.

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Abstract

The invention provides a double-sided aluminum base circuit board with super-high thermal conductivity and a preparation method of the circuit board. The double-sided aluminum base circuit board comprises an aluminum base plate material, an electrical conductive hole formed on the aluminum base plate material for communicating the upper side and the lower side of the aluminum base plate material, an aluminum oxide layer formed on the upper and the lower sides of the aluminum base plate material and on the wall of the electrical conductive hole by oxidation method for insulation and heat conduction, and a DLC (diamond-like carbon) coating and a Cu coating adhered on the aluminum oxide layer. The double-sided aluminum base circuit board provided by the invention is excellent in comprehensive heat conducting property, and the surface insulation heat-conducting layer is free of high polymer materials and is excellent in flame retardant property and aging resistance. In addition, the insulation layer on the surface of the circuit board and the insulation layer on the wall surface of the electrical conductive hole are an integrated insulation heat-conducting body with the same composition and an integrated structure, thereby obviating the hole filling and the chemical copper deposition method, simplifying the process and improving the yield.

Description

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Claims

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Application Information

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Owner 苏州热驰光电科技有限公司
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