Electronic module and method of manufacturing the same

[0018]In the following, further specific exemplary embodiments of the electronic module and the method of manufacturing the same will be explained. It should be noted that embodiments described in the context of the electronic module may also be combined with embodiments of the method of manufacturing the electronic module and vice versa.

[0019]In particular, accordingly a gist of an exemplary embodiment may be seen in providing an electronic module comprising an electronic chip sandwiched between a first conductive board and a spacing element and an adjoining second conductive board, wherein the electronic module comprising a mold compound at least partially enclosing the electronic chip and the spacing element, wherein an coefficient of thermal expansion (CTE) of the spacing element is adapted to at least one coefficient of thermal expansions selected out of the group of coefficients of thermal expansion consisting of: a CTE of the first conductive board, a CTE of the second conductiv