Method for determining tin-soldering paste amount of glue dispenser on pads

[0024] When using the dispenser of Asymtek D-585 to apply solder paste to printed boards, we choose the following examples to further illustrate the present invention:

[0025] 1. In the first embodiment, the pad size is 1.1×1.1P,

[0026] At this time, the pad area is 1 mm2

[0027] After calculation, Y=29.7,

[0028] n=B / A=1, m selects the closest value of 25 from the preferred value, then directly apply 25mg of solder paste on the pad.

[0029] 2. In the second embodiment, the pad size is 1.0×3.0P

[0030] The first step: estimate the Y value, by calculation, Y=72

[0031] (1) If it is a high-end device, such as a capacitor, this value can be selected, and it can be 70. At this time

[0032] Y=m1 n1 + m2 n2,

[0033] Among them, n1=n2+1, at this time m1 takes 15 or 20, m2 takes 10, when

[0034] a) m1 takes 15, m2 takes 10

[0035] 70=15·(n2+1) + 10·n2, get n2≈2, n1=3

[0036] That is, three 15mg and two 10mg points are placed on the pad.

[0037] b) m