34results about How to "Reduce area" patented technology

A circuit scale of a receiving device, which receives signals of a plurality of communication systems, is reduced. The receiving device, which receives base band signals and modulated signals, is provided with a first PLL circuit which generates a first internal clock based on an external clock synchronized with the base band signal; a demodulator which demodulates the modulated signal and outputs the demodulated signal; a selector which selects either the base band signal or the demodulated signal; and a first CDR circuit which generates a reproduction clock and reproduction data from the signal selected by the selector, by using the first internal clock.

The present invention provides a display device. The display device includes a display substrate, a transfer glass substrate, a first flexible circuit board, and a second flexible circuit board. The display substrate has a display area and a blank area. The transfer glass substrate is used to carry at least one chip. The first flexible circuit board is coupled between the transfer glass substrateand the display substrate as a signal transmission interface between the chip and the display substrate. The second flexible circuit substrate is coupled between the signal transmission end and the transfer glass substrate as a signal transmission interface between the signal transmission end and the chip. The display device of the present invention can effectively reduce the height of the blank area in the display substrate and reduce the area required for the display substrate.

The invention relates to the technical field of communication equipment, in particular to a multiplexer. The multiplexer comprises a first chip and a second chip which are superposed. The first chip comprises a first wafer and a thin layer wrapping and packaging the first wafer, and the first wafer is provided with a first resonator layout area comprising a plurality of resonators. The second chipcomprises a second wafer and a third wafer, and the second wafer is provided with a second resonator layout area comprising a plurality of resonators. According to the technical scheme, the sizes ofthe chips are further reduced compared with the prior art, and miniaturization of the multiplexer is facilitated.

The invention discloses a maintenance repair apparatus for closed water bodies, which is can be used in closed water bodies required to be rebuilt or repaired such as landscape water and lake. The apparatus provided by the invention is divided into a nitratlon reaction zone, a micro electric field processing zone and a biology phosphorus removal zone. The nitratlon reaction zone mainly uses a slope surface of a water body bulkhead, the vertical cobblestones with orderly arrangement are provided on the slope surface, a soft material is placed in an included angle formed by cobblestones and the slope surface for fixing nitrobacteria to realize the nitrification. The water flowed downwardly from the slope surface enters into the micro electric field processing zone, a cathode and an anode are provided in the zone, and a certain proportion of particle electrode and insulation particles is filled in the whole zone. The biology phosphorus removal zone uses a high efficiency adsorption material to form a phosphor absorption layer, and an ecological plant is planted on the phosphor adsorption layer. The power supply source of the maintenance repair apparatus depends on solar energy, thereby non energy consumption is realized; the slope surface water bodies and atmosphere are fully contacted, and an aeration system is saved. The maintenance repair apparatus and the nature landscapes are formed into one whole body, and the eutrophication problem of the water bodies can be solved, and the natural environment enables beautification.

The invention belongs to the field of electrochemical batteries and particularly relates to an electrochemical battery. The electrochemical battery comprises a bare battery cell, an electrolyte solution and an external package, wherein a rubber tape layer is arranged between the bare battery cell and the external package; the rubber tape layer comprises a base material and a bonding layer; the base material is 0.5-500 microns in thickness h1, and when the base material is heated to above 45 DEG C, the base material shows the bonding performance; the bonding layer is 0.5-500 microns in thickness h2, and when the temperature is lower than or equal to 45 DEG C, the bonding layer shows the bonding performance; and a rubber tape (before glue overflow) covers 2-90% of the surface area of the bare battery cell. The electrochemical battery has the advantages that the bonding layer has bonding force at a relatively low temperature, so that the operation is convenient when the battery cell is manufactured; the bonding layer is pasted to the surface of the bare battery cell or/and the inner side of the external package; and the base material shows bonding force after being heated, so that a bonding area between the bare battery cell and the external package can be effectively enlarged, the coverage area of the rubber tape on the bare battery cell is reduced, the glue consumption is reduced, the total amount of overflowed glue is reduced, and a mucilage glue layer is prevented from being diffused to a degassing packaging edge to influence the packaging effect.

A semiconductor device facilitates securing a high breakdown voltage and reducing a chip area thereof includes a low-potential gate driver circuit disposed on a semiconductor substrate, a high-breakdown-voltage junction edge-termination structure disposed in a peripheral portion of a high-potential gate driver circuit, disposed on the semiconductor substrate, for separating the low-potential gate driver circuit and the high-potential gate driver circuit from each other. A trench is disposed in the edge termination structure and between an n⁺-type source layer and an n⁺-type drain layer in a level shift circuit in the high-potential gate driver circuit, and an oxide film fills the trench to form a dielectric region in trench.

The invention provides an interface circuit, a signal transmission circuit and electronic equipment, and a control unit is configured to control a second on-off unit and a first on-off unit to be turned off when a target pin needs to output a high-level output signal; when the target pin needs to output a low-level logic state signal, the second on-off unit is controlled to be switched on, and the first on-off unit is controlled to be switched off; when the target pin needs to output a low-level digital communication signal, the first on-off unit is controlled to be switched on, and the second on-off unit is controlled to be switched off; the feedback unit can be used for feeding back a first signal to the control module in response to a high-level input signal when the target pin obtains the high-level input signal; and when the target pin obtains a low-level input signal, a second signal is fed back to the control module in response to the low-level input signal.

The invention discloses a power-on reset circuit with low power consumption, small area and high precision. The power-on reset circuit comprises a first voltage division module for providing a first input voltage for a comparison module; the second voltage dividing module provides a second input voltage for the comparison module, and the first input voltage controls the change of the second input voltage; when the first input voltage is higher than the second input voltage, an output signal of the comparison module is a high level, and when the first input voltage is lower than the second input voltage, the output signal of the comparison module is a low level; the pull-up module pulls up the second input voltage to a high level at the power-on moment of the power supply, so that the comparison module outputs a low level at the initial stage of power-on; and the hysteresis module is used for reducing the second input voltage when the power supply is reduced, so that the threshold inversion point of the comparison module is reduced. The area is reduced through the first voltage division circuit and the second voltage division circuit, weak pull-up is provided at the power-on moment through the pull-up module, and then the robustness of the circuit is improved.

The invention provides electronic equipment. The electronic equipment comprises a transmission part, a plurality of functional devices and a cover plate; the cover plate is provided with a signal penetration part; the transmission part moves relative to the cover plate; the plurality of functional devices are arranged on the transmission part; and at least one of the plurality of functional devices is over against the signal penetration part under the driving of the transmission part. The invention further provides a control method of the electronic equipment. The electronic equipment providedby the invention improves the screen-to-body ratio of the electronic equipment.

The invention provides an interrupt processing method and device and an interrupt controller. The method includes the steps that a CPU receives an interrupt request sent by the interrupt controller, executes interruption corresponding to the interrupt request and writes in a first value in the interrupt controller, wherein the first value is used for indicating that the CPU receives the interrupt request; after the CPU executes the interruption, the CPU writes in a second value in the interrupt controller, wherein the second value is used for indicating that the CPU finishes execution of the interruption. According to the interrupt processing method and device and the interrupt controller, the problems that in the relative technique, an interrupt controller uses much logic and occupies a large area, by means of asynchronous sampling, loss of an interrupt signal is avoided, software procedures are simplified, and accordingly the effects that amount of the logic of the interrupt controller is reduced and the area is saved are achieved.

A phase shifter and method include a hybrid coupler being ground shielded. The hybrid coupler with reflective terminations connected to the hybrid coupler is configured to phase shift an applied signal wherein the reflective terminations include a parallel LC circuit.

The embodiment of the invention provides a T-type double-channel transistor and a manufacturing method thereof, and a semiconductor device and a manufacturing method thereof, and the manufacturing method of the T-type double-channel transistor comprises the steps: providing a wafer which is provided with a plurality of transistor forming regions, wherein each transistor forming region is provided with a transistor column, each transistor column is provided with a first step side wall and a second step side wall which are relatively exposed in the first direction; forming a gate oxide layer with a step structure and a gate with a step structure on the side wall of the first step and the side wall of the second step in sequence respectively; forming a source electrode at the first end of the transistor column; forming a drain electrode at the second end of the transistor column, wherein the first end and the second end are the two opposite ends of the transistor column in the second direction respectively, the second direction is the thickness direction of the wafer, and the second direction is perpendicular to the first direction; and enabling the transistor column between the source electrode and the drain electrode to form a double-channel region of the T-shaped double-channel transistor.

The invention discloses an unmanned aerial vehicle (UAV) landing shock-absorbing device. The UAV landing shock-absorbing device comprises a UAV body, wherein a horizontally-arranged double-shaft motoris connected to the inner wall of the bottom of the UAV body; the ends of the output shafts of the double-shaft motor are welded with horizontally-arranged rotating shafts; the end, away from the double-shaft motor, of each rotating shaft is fixedly sleeved and connected with a corresponding gear; bushings welded to the outer wall of the bottom of the UAV body are arranged below the gears; movable rods arranged in the vertical direction are movably connected to the inside of the bushings in a sleeving manner; mounting grooves are formed in the height direction of the movable rods and at the sides where the movable rods are near the gears; the mounting grooves are internally welded with racks; the racks mesh with the gears for drive; and two sides of each rack are provided with position-limiting grooves positioned on the corresponding movable rod. The UAV landing shock-absorbing device is simple in structure and novel in design, and can not only provide shock-absorbing protection for aUAV when the UAV lands, but also retract most of the movable rods during the flight of the UAV to reduce air resistance.

The invention provides a ship warning main circuit board and a ship warning system. The main circuit board is provided with multiple paths of control circuits, wherein each path of control circuit comprises a monitoring input terminal, a voice control circuit and an indication lamp output circuit, the voice control circuit and the indication lamp output circuit both are electrically connected withthe monitoring circuit terminal, the voice control circuit comprises a noise reduction input terminal, a relay switch and a voice output terminal, the noise reduction input terminal is electrically connected with an electromagnetic coil terminal of the relay switch by a first diode, the monitoring input terminal is electrically connected with a normally-closed first terminal of the relay switch by a second diode, the voice output terminal is electrically connected with a normally-closed second terminal of the relay switch, the indication lamp output circuit comprises a fourth diode and a first indication lamp output terminal, a first end of the fourth diode is electrically connected with the monitoring input end, and a second end of the fourth diode is electrically connected with the first indication lamp output terminal. The system is applied to the main circuit board. The main circuit board is simple in structure and is stable to work.