38results about How to "Easy to integrate" patented technology

The invention provides a multi-layer multi-chip fan-out structure. The multi-layer multi-chip fan-out structure comprises a bearing plate, and a plurality of packaging sub bodies which are stacked are arranged on the bearing plate; at least one die is packaged into each packaging sub body; in each packaging sub body, the die is coated by a dielectric material of a dielectric layer, and the die is attached to a metal cushion block with the front face faces upwards; an RDL layer is arranged on the dielectric layer of each packaging sub body; a bonding pad of the front face of each die is electrically connected with the RDL layer of the corresponding packaging sub body where the die exists; insulating layers are arranged between adjacent packaging sub bodies, and the RDL layers of the adjacent packaging sub bodies are electrically connected through second interconnection holes between the layers. The metal cushion blocks in the bottom packaging sub bodies are pressed on the surface of the bearing plate, and the metal cushion blocks in the middle or top packaging sub bodies are pressed on the insulating layers of the packaging sub bodies; the surface of each top packaging sub body is provided with a solder mask layer in a distributed mode. According to the multi-layer multi-chip fan-out structure, three-dimensional multi-chip stacking can be easily achieved.

An object of the invention is to provide a probe card capable of properly performing a measurement. A probe card according to the invention includes: probes 100 shaped to allow vertical elastic deformation; a supporting substrate 200 with the probes provided on the lower surface thereof; a main substrate 300 positioned opposing the upper surface of the supporting substrate 200; an intermediate substrate 400 disposed between the supporting substrate 200 and main substrate 300; a supporting member 500 that is a column-shaped member with one end thereof attached to the center of the supporting substrate 200 and the other end thereof attached to the intermediate substrate 400 and holds the supporting substrate 200 so that the supporting substrate 200 is inclinable; and elastic members for holding the supporting substrate 200 so that the supporting substrate 200 is in a horizontal position relative to the main substrate 300, which are provided between the supporting substrate 200 and main substrate 300.

A method is disclosed for the integration of an integrated circuit into a standardized software architecture for embedded systems. The method includes a definition of a computer readable standardized data structure which is completed with the properties of the integrated circuit. The completed standardized data structure is then used for the definition of a hardware module which includes the integrated circuit. The hardware module definition thus generated is exported in a form which can be imported by the standardized software architecture for embedded systems for further processing.

The invention discloses a digital interface radio frequency chip and an implementation method thereof. The digital interface radio frequency chip comprises a receiving antenna, a radio frequency analog front-end subsystem and an analog baseband subsystem, wherein the analog baseband subsystem comprises an oversampling analog-to-digital converter, an internal clock generating module, a digital signal processor and a multiplexing parallel module, an output end of the receiving antenna is connected with an input end of the multiplexing parallel module through the radio frequency analog front-end subsystem, the oversampling analog-to-digital converter and the digital signal processor sequentially, and an output end of the internal clock generating module is connected with a clock input end of the oversampling analog-to-digital converter and a clock input end of the multiplexing parallel module respectively. According to the digital interface radio frequency chip, clocks generated inside the radio frequency chip serve as reference clocks, so that the correctness of the baseband chip data collection can be guaranteed; and no complex first-in first-out (FIFO) structure is required, the structure is simple, the integration is easy, and the cost and the power consumption are reduced. The digital interface radio frequency chip and the implementation method thereof are widely applied in the technical field of communications.

The invention provides a manufacturing method for a display screen, the display screen, and a mobile terminal, and solves a problem that the fluorescence effect lighting, caused when an organic light-emitting layer absorbs light during illumination, liable to cause poor display of an AMOLED screen. The display screen comprises a pixel unit which comprises a substrate and an anode region located onthe substrate; and a shading layer which is located between the substrate and the anode region. According to the invention, the shading layer is disposed between a light source and the organic lightemitting layer of the pixel unit, and can block the irradiation of the light emitted by the light source of the display screen to the effective organic light emitting layer, thereby preventing the organic light emitting layer from absorbing the light, avoiding the fluorescence effect lighting, and solving the problem of poor display. Moreover, the shading layer is disposed in the pixel unit, and the exterior of the pixel unit does not need to be provided with the shading layer, thereby reducing the assembly space. During integrated assembly with other circuits, the display screen does not needto give consideration to the change of the shape of the pixel unit, and facilitates the subsequent circuit integration and assembly.

The present invention provides an optical detection system in which a first mirror of the control unit is used to receive light beam and redirect it into a first one-dimensional off-axis parabolic mirror. The first one-dimensional off-axis parabolic mirror then directs the light beam to a cylindrical lens. Through the mechanism of reflection, the cylindrical lens further directs the light beam to a second one-dimensional off-axis parabolic mirror. The second one-dimensional off-axis parabolic mirror then directs the light beam into a second mirror. The detection unit of the system is used to detect the light beam coming from the control unit, so as to convert the light signals into electric signals for the analysis in the process unit afterwards.

A modular switching network node for a communications network, i.e., an industrial communications network, where the modular switching network node comprises a switching network node base unit and at least one port module, the at least one port module comprises at least one connection interface for coupling to the communications network, and where the modular switching network node is configured to forward communication data over one of the connection interfaces of the modular switching network node to at least one additional connection interface of the modular switching network node. The switching network node base unit is configured such that at least one of the port modules is swappable for a functional module to expand the functionality of the switching network node.

Disclosed is a manufacturing method of a micro spring mechanics sensor used for the film performance test in the testing technology field; the method includes the steps that: the metal Ti layer is sputtered on the glass sheet and processed with oxidation treatment; the whirl coating of negative photoresist, front drying and development are processed on the glass sheet after the sputtering and oxidation treatment; the graphical display of the photoresist structure is realized according to the shape of the micro spring mechanics sensor designed by the mask plate; the Ni spring layer is electroformed on the processed titanium oxides layer; the micro spring mechanics sensor is processed with flatness machining; the sedimentation of the aligning marking and the displacement marking is processed on the Ni electroplated coating through the electrodeposition technology; the micro spring mechanics sensor is finally obtained after negative photoresist, the residual glass and the Ti sputtering layer are removed. The micro spring mechanics sensor prepared by the manufacturing method in the invention has the advantages of good linearity, simple process, high resolution, low cost and being easy to be integrated with the film mechanics performance test system.

An electrical energy management apparatus is disclosed. The apparatus comprises: a plurality of interface ports for establishing electrical connections with electrical energy sources and / or electricalenergy loads and / or electrical energy storage devices; a plurality of electrical power converters each having input ports and output ports; a relay array comprising a plurality of relay cells arranged to be switchable between connections to input ports and output ports of the plurality of electrical power converters; and a controller configured to generate control signals for the relay cells of the relay array and thereby configure connections between the input ports and output ports of each of combinations of the electrical power converters.

A resonant tunneling micro sound transducer is prepared as fabricating out resonant tunneling piezo ¿C resistance on super lattice film, fabricating super lattice film substrate to be force transmission structure of indent resonant cavity and setting four resonant tunneling piezo ¿C resistances on edge of indent resonant cavity. The said transducer is actually a quantum component prepared by MEMS process.

The invention discloses a textile cleaning and drying integrated machine and relates to the technical field of textile processing equipment. The textile cleaning and drying integrated machine includesa box body, a filtering mechanism, a lifting mechanism, a material guiding mechanism, a water inlet pipe, a water outlet pipe, a partition plate, a long hole, strip-shaped holes, mounting plates, bearings, rotating shafts, mounting holes, connecting rods, motors, bobbins, a hot air fan, a three-way pipe, air outlet pipes, air exhaust pipes, a box door and a water tank. The middle of the front face of the box body is movably connected to the box door through hinges, and the water tank is fixedly installed in the inner bottom wall of the box body. According to the textile cleaning and drying integrated machine, the box body can be divided into two spaces for cleaning and drying through the partition plate fixedly connected in the box body, the cleaning and drying operation in the same machine can be conducted, the integration degree is high, the processing cost of the machine can be effectively saved, and accordingly the cost input of manufacturers is reduced.

The scleral epimacular implant comprises an arm (6) with a curved configuration, having a first end (1), which can be affixed to a retina (8). The arm (6) comprises a second end (3) comprising a discoidal element (4), whose internal face facing the curvature of the arm (6) is constituted as an indentation platform (5), configured to be in contact with the retina (8) when the implant is placed in said retina (8).

The invention a flat ceramic membrane formulation carrying nano copper oxide and a preparation method thereof. The flat ceramic membrane comprises a carrier and a separation membrane layer; the carrier incudes a main materials and auxiliary materials; the main materials of the carrier include one or more of alumina, mullite, dolomite, and bauxite; the auxiliary materials of the carrier include a sintering aid, a plasticizer, a pore-forming agent and a binder; the separation membrane layer is made with adhesive, nano copper oxide particles, a dispersing agent and a plasticizer. The flat ceramicmembrane carrying nano copper oxide has the advantages that the materials of the carrier are simple and easily accessible, the materials have antibacterial and catalytic functions, the pore size is flexibly controllable, and the materials have good features, such as excellent mechanical properties and low thermal expansion coefficient.

The invention relates to a hinge assembly for a folding screen. The hinge assembly comprises a mounting base for fixed mounting, and a left overturning assembly and a right overturning assembly which are rotationally arranged on the mounting base and form synchronous overturning through an even number of gear sets; and the left overturning assembly and the right overturning assembly are each provided with a sliding structure in an integrated mode, and damping pieces rotating along with the sliding structures to achieve the damping hand feeling are arranged on the sliding structures. The assembly is simple in structure and high in function integration, and the installation space can be effectively saved.

The invention discloses an electronic module and a manufacturing method thereof. The electronic module comprises a substrate, an electronic element, a mould sealing layer and a composite electromagnetic wave mask layer. The electronic element is configured on the substrate. The mould sealing layer covers a part of bearing surface of the electronic element and the substrate. The mould sealing layer is provided with an upper surface which is provided with a three-dimensional geometric pattern. The composite electromagnetic wave mask layer covers the upper surface of the mould sealing layer with the advantage of the form so that electromagnetic wave is shielded. The composite electromagnetic wave mask layer comprises a magnetic material layer and a conductive material layer.

The invention discloses a dual-groove microstrip antenna. The antenna includesa substrate, metal grounding strip, a group of rectangles below which is a first rectangle, Below the first rectangle is asecond rectangle, a two-step groove is hollowed out in the second rectangle, below the second rectangle is a third rectangle, below the third rectangle is a feeding microstrip line, a U-shaped grooveis hollowed out in the feeding microstrip line, the antenna is integrally symmetrical, and the double groove structure enables the antenna to be at 3.3 GHz- 3.8 GHz and 5.2 GHz- 5.7 GHz two frequencyband work effectively and suppresses interference of two different narrowband communication system. The FR-4 is adopted as a substrate, that material has the advantage of small volume, simple fabrication, easy integration with the RF front end, good radiation characteristics, low cost, and the like.

An integrated circuit device includes a vertical stack of nonvolatile memory cells on a substrate, which are configured as a vertical NAND string of memory cells. This vertical stack of nonvolatile memory cells includes a plurality of gate patterns, which are spaced apart from each other by corresponding electrically insulating layers. A dummy mold structure is also provided on the substrate. The dummy mold structure includes a vertical stack of sacrificial layers, which are spaced apart from each other by corresponding electrically insulating layers. An insulation pattern is provided, which fills a dish-shaped recess in a first one of the sacrificial layers in the vertical stack of sacrificial layers. This insulation pattern has an upper surface that is coplanar with an upper surface of the first one of the sacrificial layers.

The invention discloses a light source mode measuring instrument. The light source mode measuring instrument comprises a light source adapter (601), a beam expanding concave lens (5), an inner lens cone (603), an annular mode selection mirror (21), a guide rail (605), a photoelectric detector PD (3), transmission plate glass (607), a holophote (4), an outer lens cone (609), a battery bin and circuit assembly (610) and an angle ruler (611). The annular mode selection mirror and the photoelectric detector (PD) (3) can move towards the same direction, and in the moving process, light of multiplemodes emitted by the multimode light source is different in emergent angle corresponding to different modes and finally can be sequentially reflected to the photoelectric detector (PD) (3). That is tosay, the power of the multimode light source in all propagation modes can be sequentially collected and recorded by the photoelectric detector (PD) (3), and all light propagation modes of the light source can be measured by corresponding to the emergent angle shown by the angle scale on the outer lens cone. The measuring instrument is simple in structure, accurate in measurement and low in cost.

The invention concerns a construction component (1) profiled using roller profiling, with a profile cross-section changing in the longitudinal extent, wherein the profiled construction component includes a flange (4). The construction component having this shape is rigid and particularly easy to integrate into the vehicle body shell.

The invention relate to the technical field of bridge structures, in particular to a road-rail layered bridge pier and beam combination structure suitable for multi-span long coupling and large expansion and contraction quantity beams on both sides. The road-rail layered bridge pier and beam combination structure suitable for the multi-span long coupling and large expansion and contraction quantity beams on both sides comprises a bearing platform and a bridge pier positioned on the bearing platform, and further comprises a pier-beam combination section and a beam part. The pier-beam combination section is of a reinforced concrete structure cast and fixed at the upper end of the bridge pier, and comprises beam section supporting parts for supporting the multi-span long coupling and large expansion and contraction quantity beams on both sides at two ends in the bridge direction and a beam part supporting part for bearing the beam part in the middle. The beam part is fixed to the beam part supporting part for connecting the multi-span long coupling and large expansion and contraction quantity beams on both sides, an expansion and contraction joint is reserved between the two ends of the beam part in the bridge direction and the multi-span long coupling and large expansion and contraction quantity beams on both sides, and the beam part comprises an upper deck and a lower deck. Thepier and beam combination structure skillfully solves a series of difficult problems caused by the continuous arrangement of multi-span long coupling and long-span bridges through a series of measures, effectively improves the overall arrangement of the bridge hole span, and has reasonable and safe structural stress and good economic benefits.

The invention relates to growing the GaN film with high quality on the Si substrate through the hydrid gas phase epitaxial method and low temperature buffer layer technology. In the HVPE growth system or MOCVD system, we chooses the ammonia gas and HCl as the gas source at the relative low temperature of between 400deg.C ad 800deg.C on the Si substrate, grow the GaN and then continue it at the high temperature, such as between 1000deg.C and 1100deg.C. The GaN film grown at the low temperature prevents the nitridation of the ammonia gas to the Si substrate and the reaction between the Si and the HCl at high temperature and thus makes the later GaN have high quality.

The invention relates to a method in a fiber web machine. In the method, a fabric (12) included in the fiber web machine is used for supporting a web (14) produced by the fiber web machine. Moreover, in the method the location of the fabric (12) is changed in the cross direction (CD) of the fiber web machine. The location is changed by means of oscillation, the amplitude (19) of which is kept so high that the area of impact (20) of the web (14) on the fabric (12) is wider than the width (21) of the web (14) throughout the lifetime of the fabric (12). The invention also relates to an arrangement in a fiber web machine, and to a software product.