Electronic module and manufacturing method thereof
一种电子模块、电子元件的技术,应用在半导体/固态器件制造、电路、电气元件等方向,能够解决影响电子元件特性、降低性能、电子元件失效等问题,达到兼具散热效果、增加表面积的效果
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[0040] Please refer to figure 1 . figure 1 A cutaway side view of an electronic module according to an embodiment of the present invention is shown. The electronic module 1 includes a substrate 10 , electronic components 11 a - 11 d , a molding layer 12 and a composite electromagnetic wave shielding layer 14 .
[0041] The substrate 10 has a carrying surface 101 and a bottom surface 102 . The substrate 10 also has a plurality of preset pads 103 and circuit layers (not shown). The pad 103 is made of conductive material, such as copper, to be electrically connected to a conductive circuit (not shown) or a ground plane (not shown). Wherein, the pads 103 and the circuit layer (not shown) are located on the substrate 10 or buried in the substrate 10 . The material of the substrate 10 can vary according to the process and product requirements. For example, the semiconductor industry is a silicon-containing semiconductor wafer, and in other applications, it can be a PCB substrate...
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