Buffer circuit and buffer chip

A buffer circuit and circuit technology, applied in the direction of logic circuit interface device, logic circuit connection/interface layout, etc., can solve the problems of complicated wiring, high cost, unfavorable large-scale expansion and use, etc., and achieve low cost, stable circuit and simple structure. Effect

Active Publication Date: 2016-08-10
SHENZHEN SUNMOON MICROELECTRONICS
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a buffer circuit and a buffer chip, aiming at solving the problem that the existing buffer uses two buffer chips with single-ended outpu

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Buffer circuit and buffer chip
  • Buffer circuit and buffer chip
  • Buffer circuit and buffer chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] figure 1 It is a basic structural block diagram of the buffer circuit provided by Embodiment 1 of the present invention.

[0045] Such as figure 1 As shown, the buffer circuit 100 provided by this embodiment includes a first port A1, a second port B1, a third port A2, and a fourth port B2 for connecting to an external circuit. The circuit also includes an enable port EN, a differential amplifier C. NOT gate, first single-to-dual-end conversion module 10 and second single-to-dual-end conversion module 20 .

[0046] The non-inverting input terminal of the differential amplifier C is commonly connected with the first signal output terminal OUTA of the second single-to-double-ended conversion module 20 to form the first port A1, and the inverting input terminal of the differential amplifier C is connected to the The second signal output terminal OUTB of the second single-to-double-ended conversion module 20 is commonly connected to form the second port B1 , and the output te

Embodiment 2

[0066] figure 2 It is a basic structural block diagram of the buffer circuit provided by Embodiment 2 of the present invention.

[0067] Such as figure 2 As shown, the buffer circuit provided in this embodiment is a further extension based on the first embodiment.

[0068] In this embodiment, the buffer circuit 100 further includes a voltage stabilizing module 30 that is externally connected to a wide-voltage power supply VIN and outputs a constant voltage. The output terminal VDD of the voltage stabilizing module 30 is connected to the positive power supply terminal of the differential amplifier C, the The power supply terminal of the first single-to-double-terminal conversion module 10 and the power supply terminal of the second single-to-double-terminal conversion module 20 are connected in common.

[0069] In a specific application, the negative power terminal of the differential amplifier C, the ground terminal of the first single-to-dual-terminal conversion module 10 an

Embodiment 3

[0073] image 3 It is a basic structural block diagram of the first single-to-dual-end conversion module provided by Embodiment 3 of the present invention.

[0074] Such as image 3 As shown, this embodiment is in figure 1 or figure 2 A further refinement of the snubber circuit is shown.

[0075] In this embodiment, the first single-to-double conversion module 10 and the second single-to-double conversion module 20 have the same structure, and both include a first logic unit 11, a second logic unit 21, a first electronic switch unit 12 and a second Second, the electronic switch unit 22, the following takes the first single- and double-ended conversion module 10 as an example for specific description:

[0076] The first input terminal, the third input terminal of the first logic unit 11 and the third input terminal of the second logic unit 21 are commonly connected to form the enable terminal EN_D of the first single-to-double-ended conversion module 10;

[0077] The second

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention is suitable for the field of buffers, and provides a buffer circuit and a buffer chip. The buffer circuit comprises a first port, a second port, a third port and a fourth port, wherein the first port, the second port, the third port and the fourth port are connected with an external circuit. The buffer circuit further comprises an enabling port, a differential amplifier, a NOT gate, a first single-double end conversion module and a second single-double end conversion module. The enabling end of the first single-double end conversion module is connected with the enabling end of the second single-double end conversion module for forming an enabling port. The NOT gate is connected between the enabling port and the enabling end of the first single-double end conversion module, and alternatively, between the enabling port and the enabling end of the second single-double end conversion module. The enabling port controls signal input and signal output of the first port, the second port and the fourth port and signal output of the third port through inputting an enabling signal. According to the buffer circuit and the buffer chip, the enabling signal can be input through the enabling port so that the buffer circuit can have a single-end-input differential-output function, a single-end-input single-end-output function, a differential-input differential-output function and a differential-input single-end-output function.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner SHENZHEN SUNMOON MICROELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products