Package of electronic component, package method of electronic component and circuit board

[0020] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0021] See figure 1 , figure 1 It is a schematic structural diagram of an embodiment of the electronic component packaging of the present invention.

[0022] among them, figure 1 The illustrated packaging structure of electronic components is a schematic diagram of the structure of the capacitor packaging as an example. It should be noted that, in the present invention, the electronic components are not limited to capacitors, such as filter capacitors. In other embodiments, the electronic component may also be other electronic components that need to be grounded, such as a controller chip, an analog-to-digital converter, etc., which are not limited herein.

[0023] Such as