Laminated varistor, mounting structure of laminated varistor, and varistor module
a technology of laminated varistors and mounting structures, which is applied in the direction of resistor mounting/supporting, varistors, current responsive resistors, etc., can solve the problems of local breakage of varistors and original capability deterioration, and achieve excellent radiation capability
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first embodiment
[0056]FIG. 1A to FIG. 4B show a laminated varistor according to the
[0057] In this regard, FIG. 1A is a perspective view of a laminated varistor viewed from the top surface side, and FIG. 1B is a perspective view of the laminated varistor viewed from the bottom surface side. FIG. 2A is a sectional view of a section taken along a line b1-b1 shown in FIG. 1A, and FIG. 2B is a sectional view of a section taken along a line b2-b2 shown in FIG. 1A. FIG. 3A is a sectional view of a section taken along a line b3-b3 shown in FIG. 2A, and FIG. 3B is a sectional view of a section taken along a line b4-b4 shown in FIG. 2A. FIG. 4A is a diagram in which a first electrode portion, a second electrode portion, and a heat conductor portion are eliminated from FIG. 1A, and FIG. 4B is a diagram in which the first electrode portion, the second electrode portion, and the heat conductor portion are eliminated from FIG. 1B.
[0058] This laminated varistor 10 is provided with a rectangular parallelepiped la...
second embodiment
[0090]FIG. 21 shows a laminated varistor according to the
[0091] In this regard, in FIG. 21, reference numeral 20 denotes a laminated varistor, reference numeral 21 denotes a laminated chip, reference numeral 21a denotes a bottom surface of the laminated chip, reference numeral 21b denotes a top surface of the laminated chip, reference numeral 22 denotes a varistor layer, reference numeral 23 denotes a first conductor layer, reference numeral 23a denotes a lead portion, reference numeral 24 denotes a second conductor layer, reference numeral 24a denotes a lead portion, reference numeral 25 denotes a first electrode portion, reference numeral 26 denotes a second electrode portion, and reference numeral 27 denotes a heat conductor portion.
[0092] This laminated varistor 20 is different from the above-described laminated varistor 10 in that one each of the first electrode portion 25 and the second electrode portion 26 is disposed and one each of the lead portions 23a and 24a of the cond...
third embodiment
[0094]FIG. 22A shows a laminated varistor according to the
[0095] In this regard, in FIG. 22A, reference numeral 30 denotes a laminated varistor, reference numeral 31 denotes a laminated chip, reference numeral 31a denotes a bottom surface of the laminated chip, reference numeral 31b denotes a top surface of the laminated chip, reference numeral 32 denotes a varistor layer, reference numeral 33 denotes a first conductor layer, reference numeral 34 denotes a second conductor layer, reference numeral 35 denotes a first electrode portion, reference numeral 36 denotes a second electrode portion, and reference numeral 37 denotes a heat conductor portion.
[0096] This laminated varistor 30 is different from the above-described laminated varistor 10 in that the second conductor layer located on one side surface in the lamination direction of the conductor layers of the laminated chip 31 is eliminated and the varistor layer 32 is exposed at the one side surface.
[0097] According to this lamin...
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