A laminated
varistor having excellent
radiation capability is provided. A heat conductor portion is disposed on the top surface of a rectangular parallelepiped laminated
chip including a plurality of first conductor
layers and a plurality of second conductor
layers disposed alternately in a lateral direction with
varistor layers therebetween, and the heat conductor portion is connected to a top end of each second conductor layer. Therefore, when the heat from an exothermic device, e.g., an IC, disposed in the vicinity is transferred to each of the first conductor layers and the second conductor layers via a first
electrode portion and a second
electrode portion or when
heat generation occurs as a current passes through the
varistor layers, the heat is directly and highly efficiently transferred from each second conductor layer to the heat conductor portion, and is effectively released to the outside from the heat conductor portion.