Heat dissipation device

Active Publication Date: 2015-02-26
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0005]A primary object of the present invention is to provide a heat dissipation device that oscillates to produce a continuous wave of a member thereof for disturbing air

Problems solved by technology

Heat undesirably accumulated in the electronic elements would even cause burnout of the electronic elements.
Therefore, heat dissipation has already become one of the most important issues for electronic elements.
Since the limited internal space of the electronic devices is almost fully occupied by the necessary circuit board and various electronic elements, there is no longer sufficient space for mounting a cooling fan.
In addition, due to the largely reduced overall thickness of the current electronic devices, it is also impossible to mount the cooling fan, which includes blades and bearing having a required height, in the low-profile electronic devices.
Without a cooling fan mounted therein, the electronic devices and t

Method used

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Embodiment Construction

[0026]The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.

[0027]Please refer to FIGS. 1 and 2 that are assembled perspective and side views, respectively, of a heat dissipation device 1 according to a first preferred embodiment of the present invention. As shown, the heat dissipation device 1 in the first preferred embodiment includes an oscillation assembly 2, an air disturbing member 3, and at least one fixing seat 4.

[0028]The oscillation assembly 2 includes a base 21 and an oscillating member 22 provided on the base 21. The oscillation assembly 2 is adapted to generate a fixed-frequency oscillation. In the illustrated first preferred embodiment, the oscillation assembly 2 is a piezoelectric type oscillation assembly with the oscillating member 22 being a piezoelectric

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Abstract

A heat dissipation device is arranged in an outer case of an electronic device, and includes an oscillation assembly, an air disturbing member and at least one fixing seat. The oscillation assembly includes a base and an oscillating member provided on the base; and the air disturbing member is connected at a first end to the oscillating member and at an opposite second end to the fixing seat. When an electric power is supplied to the oscillation assembly, the oscillating member is oscillated to thereby vibrate the first end of the air disturbing member, producing a continuous wave of the air disturbing member. The waving air disturbing member in turn disturbs air in the outer case, forcing the air toward a heat source and causing air convection in the outer case to enable largely upgraded heat dissipation efficiency of the electronic device.

Description

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Claims

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Application Information

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Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
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