Process proximity correction method and the computing device for the same

Pending Publication Date: 2022-02-03
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]Aspects of the present inventive concept provide a process proxi

Problems solved by technology

In the process of etching, process errors may occur due to various factors.
The factors that induce the process errors may be due to the characteri

Method used

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  • Process proximity correction method and the computing device for the same
  • Process proximity correction method and the computing device for the same
  • Process proximity correction method and the computing device for the same

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Embodiment Construction

[0019]FIG. 1 is an exemplary block diagram showing a process proximity correction computing device according to some embodiments.

[0020]Referring to FIG. 1, a computing device 100 according to some embodiments may include a plurality of processors 110, a random access memory 120, a device driver 130, a storage device 140, a modem 150, and user interfaces 160.

[0021]At least one of the processors 110 may execute a semiconductor process machine learning module 200. The semiconductor process machine learning module 200 may generate a layout for fabricating a semiconductor device on the basis of machine learning. For example, the semiconductor process machine learning module 200 may be implemented in the form of commands (or codes) executed by at least one of the processors 110 (also described as software or computer program code executed by hardware). At this time, at least one processor may load the commands (or codes) of the semiconductor process machine learning module 200 into the rando

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Abstract

A process proximity correction method is performed by a process proximity correction computing device which performs a process proximity correction (PPC) through at least one of a plurality of processors. The process proximity correction method includes: converting a target layout including a plurality of patterns into an image, zooming-in or zooming-out the image at a plurality of magnifications to generate a plurality of input channels, receiving the plurality of input channels and performing machine learning to predict an after-cleaning image (ACI), comparing the predicted after-cleaning image with a target value to generate an after-cleaning image error, and adjusting the target layout on the basis of the after-cleaning image error.

Description

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Claims

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Application Information

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Owner SAMSUNG ELECTRONICS CO LTD
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