Method for monitoring fluctuation of MOSFET gate line end cutting process
A cutting process and gate line technology, applied in the field of monitoring the fluctuation of MOSFET gate line end cutting process, can solve the problem of not representing the uniformity of on-chip feature size, increasing measurement time and equipment investment, affecting authenticity and accuracy, etc. problems, to achieve the effect of improving product yield, avoiding measurement impact, and saving time and cost
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[0013] The method for monitoring the fluctuation of the MOSFET gate line end cutting process, in the following embodiments, taking a typical 28nm Poly-SiON (polysilicon gate-silicon oxynitride dielectric) MOSFET as an example, the specific implementation process is as follows:
[0014] Step 1. Combine figure 1 As shown, the overlay pattern of the front layer grid is made, and the pattern is composed of a plurality of regularly arranged linear strips, and is arranged on the periphery of the entire overlay mark. The overlay pattern of the front grid is in the shape of a windmill. The gate overlay pattern on the front layer can also be composed of a plurality of grid bars, the length of the grid bars is 2-10 μm, the width is 0.5-2 μm, and the distance between the grid bars is 0.5-2 μm.
[0015] Step two, combine figure 1 As shown in the figure, the overlay pattern is made when the gate line end of the layer is cut. The pattern is composed of a plurality of regularly arranged long
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