Microneedle and manufacturing process thereof

[0034] Example 1:

[0035] see figure 1 , a manufacturing process of a microneedle of the present invention comprises the following steps:

[0036] a) Opening: Select a substrate 1 with an appropriate thickness as required, and then etch several concave portions 11 on the top surface of the substrate 1 that do not penetrate the bottom surface. The substrate 1 is a glass substrate, and each of the concave portions 11 are all inverted cones, and each of the inner recesses 11 is etched by maskless etching technology;

[0037] Among them, the maskless etching technology can be a laser etching technology, which can irradiate the top surface of the substrate 1 with a high-energy-density laser, so that the surface material of the irradiated area is subjected to heat, melting, vaporization, plasma formation, volatilization and sputtering. A series of complex physical and even chemical processes such as radiation, etc., finally form the inner recess 11;

[0038] b) Film formation: the

[0043] Embodiment 2:

[0044] see figure 2 , a manufacturing process of a microneedle of the present invention comprises the following steps:

[0045] a) Opening: Select a substrate 1 with an appropriate thickness as required, and then etch several concave portions 11 on the top surface of the substrate 1 that do not penetrate the bottom surface. The substrate 1 is a glass substrate, and each of the concave portions 11 are all inverted cones, and each of the inner recesses 11 is etched by photoresist etching technology;

[0046] Among them, the photoresist etching technique is specifically as follows: first, a photoresist is coated on the top surface of the substrate 1 to form a photoresist layer 3 , and after drying, a mask is used to block the photoresist layer 3 , so that the light irradiates the photoresist layer 3 . In some areas, the exposed or unexposed areas of the photoresist layer 3 are dissolved by the developer to form the through holes 31 , and finally the plasma

[0052] Embodiment three:

[0053] see image 3 , a manufacturing process of a microneedle of the present invention comprises the following steps:

[0054]a) Opening: Select a substrate 1 with an appropriate thickness according to the needs, and then etch several recesses 11 on the top surface of the substrate 1 that do not penetrate the bottom surface. The substrate 1 is a glass substrate, and each of the recesses 11 are all inverted cones, and each of the inner recesses 11 is etched by maskless etching technology;

[0055] Among them, the maskless etching technology can be a laser etching technology, which can irradiate the top surface of the substrate 1 with a high-energy-density laser, so that the surface material of the irradiated area is subjected to heat, melting, vaporization, plasma formation, volatilization and sputtering. A series of complex physical and even chemical processes such as radiation, etc., finally form the inner recess 11;

[0056] b) Film formation: the