Thermal management of environmentally-sealed electronics enclosure

[0013]The present invention provides successful and efficient extraction and removal of excessive heat that is generated by operating electronic components within an environmentally-sealed enclosure, thus maintaining a sufficiently cool internal environment to allow housed electronic devices to operate within their respective acceptable operational temperature limits. The invention accomplishes efficient extraction and removal of excessive heat without direct transmission of a viscous medium (air, coolant, etc.) through the environmentally-sealed enclosure, thereby allowing for the operation of the electronics enclosure in harsh environments including dust, sand, precipitation, fog, corrosive salt air, etc.

[0014]A thermal management system is disclosed whereby a combination of conductive and convective heat transfer schemas are employed to eliminate and discard excessive heat from within an environmentally-sealed electronics enclosure to its ambient surroundings.

[0015]FIGS. 1A to 1C sh