Free from cleaning soldering flux without halogen and rosin in use for solder without lead

[0029] Succinic acid 2.0

[0030] Glutaric acid 0.6

[0031] Salicylic acid 1.2

[0032] Tartaric acid 0.1

[0033] Citric acid 0.8

[0034] OP emulsifier 0.1

[0035] Glycerol 16.0

[0036] Ethylene glycol monobutyl ether 12.0

[0037] PEG-400 0.5

[0038] Benzotriazole 0.1

[0039] Deionized water 57.6

[0040] Preparation method:

[0041] Add co-solvent and part of deionized water into the reaction kettle with agitator first, add film-forming agent under stirring, add the remaining amount of deionized water, activator and surfactant after dissolving, then add corrosion inhibitor, stir until The solid matter is completely dissolved, the materials are mixed evenly, and the filtrate is retained after static filtration to obtain the flux of the present invention.

[0043] Salicylic acid 1.5

[0044] Succinic acid 1.5

[0045] Adipic acid 0.2

[0046] Tartaric acid 0.2

[0047] Lactic acid 1.0

[0048] TX-10 0.2

[0049] Glycerol 18.0

[0050] Diethylene glycol 4.0

[0051] Ethylene glycol monobutyl ether 15.0

[0052] PEG-600 0.5

[0053] Benzotriazole 0.1

[0054] Deionized water 57.8

[0055] The preparation and use methods are the same as in Example 1.

[0057] DL-malic acid 1.8

[0058] Tartaric acid 0.2

[0059] Citric acid 0.5

[0060] Lactic acid 0.5

[0061] OP emulsifier 0.3

[0062] Glycerol 18.0

[0063] Diethylene glycol ether 15.0

[0064] PEG-400 0.5

[0065] Triethylamine 0.1

[0066] Deionized water 63.1

[0067] The preparation and use methods are the same as in Example 1.